Depositing Station And Device For Generating Contact Metallizations

Abstract

The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.

1 . A depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprising a basin arrangement ( 11 ,  77 ,  80 ) having a basin ( 13 ,  81 ) forming a processing chamber ( 12 ) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer ( 15 ,  85 ,  96 ) receivable in the processing chamber, the basin having at least one inlet ( 17 ) for introducing the solution into the basin,
 characterized in that   the basin has a perforation ( 18 ) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber.   
     
     
         2 . The depositing station according to  claim 1 ,
 characterized in that   the inlet ( 17 ) of the basin ( 13 ,  81 ) is disposed on the bottom of the basin, a bottom wall ( 19 ) of the basin having the perforation ( 18 ).   
     
     
         3 . The depositing station according to  claim 2 ,
 characterized in that   the basin ( 13 ,  81 ) has a substructure ( 20 ) which forms part of the inlet ( 17 ) of the basin and which is disposed below the bottom wall ( 19 ) of the basin, said substructure ( 20 ) forming a cavity ( 21 ) through which the solution can flow and which is limited at least by the bottom wall of the basin and a bottom wall ( 23 ) of the substructure, the basin having an inlet socket ( 27 ) which forms part of the inlet of the basin and is inserted in a passage opening ( 26 ) penetrating at least the bottom wall of the substructure, said inlet socket ( 27 ) having a perforation ( 29 ) on at least the circumference of a portion ( 28 ) of the inlet socket protruding into the cavity, said perforation ( 29 ) being configured to introduce the solution into the cavity.   
     
     
         4 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin ( 13 ,  81 ) has an outlet ( 30 ), preferably disposed on the side of the basin, for draining the solution from the basin.   
     
     
         5 . The depositing station according to  claim 4 ,
 characterized in that   each side wall ( 31 ) of the basin ( 13 ,  81 ) has a perforation ( 33 ) which is preferably formed in an area of an edge ( 32 ) of the side walls and which forms the outlet ( 30 ) of the basin.   
     
     
         6 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin arrangement ( 11 ,  80 ) comprises an additional basin ( 34 ,  82 ), the basin ( 13 ,  81 ) being inserted into the additional basin.   
     
     
         7 . The depositing station according to  claim 6 ,
 characterized in that   the additional basin ( 34 ,  82 ) has an outlet ( 35 ,  36 ), which is preferably disposed on the bottom of the additional basin, for draining the solution from the additional basin.   
     
     
         8 . The depositing station according to at least  claims 4  and  7 ,
 characterized in that 
 the inlet ( 17 ) of the basin ( 13 ,  81 ) is provided for introducing the solution from an area ( 25 ) outside of the basin arrangement ( 11 ,  77 ,  80 ) into the basin, the outlet ( 30 ) of the basin is provided for draining the solution from the basin into the additional basin ( 34 ,  82 ) and the outlet ( 35 ,  36 ) of the additional basin is provided for draining the solution from the additional basin to the area outside of the basin arrangement. 
 
     
     
         9 . The depositing station according to at least  claims 4  and  6 ,
 characterized in that 
 the basin ( 13 ,  81 ) is inserted into the additional basin ( 34 ,  82 ), preferably so as to be centered, such that the solution is introduced from the basin into an area ( 40 ) of the additional basin limited at least by side walls ( 31 ) of the basin and side walls ( 39 ) of the additional basin, through the outlet ( 30 ) of the basin disposed on the side of the basin, each side wall of the basin having a rim ( 41 ) in an area of an edge ( 32 ) of the side walls of the basin which preferably protrudes perpendicular from the side walls of the basin to a direction of the side walls of the additional basin and which abuts against the side walls of the additional basin in such a manner that an opening ( 43 ) of the additional basin is covered. 
 
     
     
         10 . The depositing station according to any one of  claims 6  to  9 ,
 characterized in that 
 the additional basin ( 34 ,  82 ) has at least one inlet ( 37 ,  38 ), preferably disposed on the side of the additional basin, for introducing the solution from an area ( 25 ) outside of the basin arrangement ( 11 ,  77 ,  80 ) into the additional basin. 
 
     
     
         11 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin ( 13 ,  81 ) is configured such that a transport receptacle ( 14 ,  84 ,  95 ) having a plurality of objects, in particular wafers ( 15 ,  85 ,  96 ), received therein is insertable into the basin from above.   
     
     
         12 . The depositing station according to  claim 11 ,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a manipulator ( 16 ,  102 ) which is configured to insert the transport receptacle ( 14 ,  84 ,  95 ) into the basin ( 13 ,  81 ) and remove said transport receptacle ( 14 ,  84 ,  95 ) from the basin.   
     
     
         13 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin arrangement ( 11 ,  77 ,  80 ) has a filling level measuring device ( 45 ) which is configured to measure a filling level.   
     
     
         14 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin arrangement ( 11 ,  77 ,  80 ) and/or the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) has a heating device ( 46 ) which is configured to heat the solution.   
     
     
         15 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin arrangement ( 11 ,  77 ,  80 ) has a lid ( 49 ,  83 ) which covers an opening ( 50 ) of the basin ( 13 ,  81 ) in a closed position of the lid.   
     
     
         16 . The depositing station according to  claim 15 ,
 characterized in that   the lid ( 49 ,  83 ) is pivotable, the lid forming a guiding portion ( 52 ) in an area of a pivot axis ( 51 ) of the lid, said guiding portion ( 52 ) being configured to guide condensate, which may have formed on an inner surface ( 53 ) of the lid, into the basin when the lid is moved to an open position of the lid.   
     
     
         17 . The depositing station according to any one of the preceding claims,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a tube assembly ( 54 ) which integrates the depositing station into a fluid circuit ( 55 ).   
     
     
         18 . The depositing station according to  claim 17 ,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a pumping device ( 56 ) which is configured to circulate the solution in the fluid circuit ( 55 ).   
     
     
         19 . The depositing station according to  claim 17  or  18 ,
 characterized in that 
 the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a filter device ( 57 ,  72 ) which preferably has a preliminary filter ( 73 ) and a main filter ( 74 ) and which is configured to clean the solution flowing in the fluid circuit ( 55 ). 
 
     
     
         20 . The depositing station according to any one of  claims 17  to  19 ,
 characterized in that 
 the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a volume flow device ( 58 ) which is configured to measure and/or adjust a volumetric flow rate of the solution in the fluid circuit ( 55 ). 
 
     
     
         21 . The depositing station according to any one of the preceding claims,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a valve arrangement ( 59 ) which is configured to empty the basin arrangement ( 11 ,  77 ,  80 ).   
     
     
         22 . The depositing station according to any one of the preceding claims,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a sample-analysis device ( 60 ,  75 ) which is configured to take a sample of the solution, preferably from the basin arrangement ( 11 ,  77 ,  80 ), and to analyze said sample, in particular regarding a pH value of the sample.   
     
     
         23 . The depositing station according to any one of the preceding claims,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a cooling device ( 47 ,  76 ).   
     
     
         24 . The depositing station according to any one of the preceding claims,
 characterized in that   the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) comprises a dosing arrangement ( 61 ) having at least one container ( 62 ) for receiving a component contained in the solution and having at least one dosing pump ( 63 ) which is assigned to the container, the dosing arrangement being configured to dose the component in the solution.   
     
     
         25 . The depositing station according to any one of the preceding claims,
 characterized in that   the basin arrangement ( 11 ,  77 ,  80 ) has a moving device ( 86 ) which is configured to preferably vertically move the object in the processing chamber ( 12 ).   
     
     
         26 . A device ( 69 ,  94 ) for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) according to any one of the preceding claims, a processing chamber ( 12 ) of the depositing station being configured to receive a transport receptacle ( 14 ,  84 ,  95 ) having a plurality of wafers ( 15 ,  85 ,  96 ) received therein, the device having a manipulator ( 16 ,  102 ) for handling the transport receptacle. 
     
     
         27 . The device according to  claim 26 ,
 characterized in that   the device ( 69 ,  94 ) comprises a plurality of workstations which are preferably disposed in a line, each workstation having a processing chamber ( 12 ) for receiving the transport receptacle ( 14 ,  84 ,  95 ) having the wafers ( 15 ,  85 ,  96 ) received therein, the plurality of workstations comprising the depositing station ( 10 ,  71 ,  78 ,  98 ,  99 ) as a workstation, the device having a conveyor ( 103 ) on which the manipulator ( 16 ,  102 ) is disposed, the manipulator, in interaction with the conveyor, allowing the transport receptacle to be disposed in a selectable order of the processing chambers in a conveying direction.   
     
     
         28 . The device according to  claim 27 ,
 characterized in that   the manipulator ( 16 ,  102 ) has a horizontally movable carrier ( 106 ) which is connected to a conveyor belt ( 105 ) of the conveyor ( 103 ) and which has at least one gripping arm ( 107 ) which is vertically moveable with respect to the carrier.   
     
     
         29 . The device according to  claim 27  or  28 ,
 characterized in that 
 the device ( 69 ,  94 ) comprises an input/output station ( 97 ) which preferably has drawers ( 111 ), said drawers ( 111 ) preferably being automatically retractable and extendable, and serves to equip the device with at least one transport receptacle ( 14 ,  84 ,  95 ), and/or the plurality of workstations comprise at least one cleaning station, at least one rinsing station for removing any residue from wafer surfaces and/or a drying station.