Cathode conduction mechanism and electroplating system

Abstract

A cathode conduction mechanism and an electroplating system are provided. The cathode conduction mechanism includes a first conductive belt and a first conductive belt assembly, the first conductive belt assembly includes a first belt roll and a second belt roll, and the first conductive belt covering the first belt roll and the second belt roll; and a second conductive belt and a second conductive belt assembly, the second conductive belt assembly includes a third belt roll and a fourth belt roll, and the second conductive belt covering the third belt roll and the fourth belt roll. According to the present disclosure, the lower conductive belt does not pass through the bottom of the electroplating bath to prevent leakage. The upper conductive belt and the lower conductive belt each are only driven by two belt rolls to greatly save a cost.

What is claimed is: 
     
         1 . A cathode conduction mechanism, comprising:
 a first conductive belt and a first conductive belt assembly, wherein the first conductive belt assembly comprises a first belt roll and a second belt roll, and the first conductive belt covers the first belt roll and the second belt roll; and   a second conductive belt and a second conductive belt assembly, wherein the second conductive belt assembly comprises a third belt roll and a fourth belt roll, and the second conductive belt covers the third belt roll and the fourth belt roll, wherein   the first belt roll comes in rolling contact with the third belt roll, and the second belt roll comes in rolling contact with the fourth belt roll.   
     
     
         2 . The cathode conduction mechanism according to  claim 1 , wherein
 the second conductive belt is wider than the first conductive belt, and a wider portion of the second conductive belt over the first conductive belt is provided with a conductive brush; or,   the first conductive belt is wider than the second conductive belt, and a wider portion of the first conductive belt over the second conductive belt is provided with a conductive brush.   
     
     
         3 . The cathode conduction mechanism according to  claim 2 , wherein
 the conductive brush is connected to a copper bar.   
     
     
         4 . The cathode conduction mechanism according to  claim 1 , wherein
 the first conductive belt assembly further comprises a plurality of upper pressing wheels; and the plurality of upper pressing wheels are located between the first belt roll and the second belt roll, with a mounting height lower than a mounting height of each of the first belt roll and the second belt roll.   
     
     
         5 . The cathode conduction mechanism according to  claim 1 , wherein
 the second conductive belt assembly further comprises a plurality of lower pressing wheels; and the plurality of lower pressing wheels are located between the third belt roll and the fourth belt roll, with a mounting height higher than a mounting height of each of the third belt roll and the fourth belt roll.   
     
     
         6 . The cathode conduction mechanism according to  claim 1 , wherein
 an upper auxiliary electrode bath is provided above the first conductive belt assembly, and openings for allowing the first conductive belt to pass through are respectively formed at two sides of the upper auxiliary electrode bath; and   an upper copper etching mechanism is provided in the upper auxiliary electrode bath, wherein the upper copper etching mechanism is configured for removing copper plated particles on a surface of a conductive layer of the first conductive belt.   
     
     
         7 . The cathode conduction mechanism according to  claim 1 , wherein
 a lower auxiliary electrode bath is provided below the second conductive belt assembly, and openings for allowing the second conductive belt to pass through are respectively formed at two sides of the lower auxiliary electrode bath; and   an upper copper etching mechanism is provided in the lower auxiliary electrode bath, wherein the upper copper etching mechanism is configured for removing copper plated particles on a surface of a conductive layer of the second conductive belt.   
     
     
         8 . An electroplating system, comprising
 an electroplating bath and cathode conduction mechanisms, wherein the cathode conduction mechanisms are provided in a film coating segment of the electroplating bath in mirror symmetry and respectively located at two sides of a film feeding direction of a thin film; and   a plurality of upper and lower electroplating anodes are provided in the electroplating bath and are provided between the cathode conduction mechanisms at two sides of the electroplating bath.   
     
     
         9 . The electroplating system according to  claim 8 , wherein
 a thickening segment is further provided at a front end of the film coating segment of the electroplating bath, and the thickening segment is configured to thicken a plated layer at an edge of the thin film.   
     
     
         10 . The electroplating system according to  claim 8 , wherein
 a pre-plating bath is provided at a front end of the electroplating bath; and a conduction roll, a pass-over roll and an anode plate are provided in the pre-plating bath.