Multi-flip semiconductor die sorter tool

Abstract

A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

What is claimed is: 
     
         1 . A tool, comprising:
 a module to:
 select or pick up a set of dies from a carrier, 
 manipulate the set of dies, and 
 return, after manipulating the set of dies, the set of dies to the carrier. 
   
     
     
         2 . The tool of  claim 1 , wherein the set of dies is selected or picked up from, and returned to, a same position on the carrier. 
     
     
         3 . The tool of  claim 1 , wherein the module is further to:
 cause, after returning the set of dies to the carrier, the carrier to be provided to a conveyor.   
     
     
         4 . The tool of  claim 1 , wherein the module comprises a plurality of heads that each select or pick up a different die of the set of dies from the carrier, manipulate the different die, and return the different die to the carrier. 
     
     
         5 . The tool of  claim 4 , wherein the plurality of dies concurrently manipulate the different die. 
     
     
         6 . The tool of  claim 1 , wherein the module comprises:
 a first head to:
 select or pick up the set of dies from the carrier, and 
 manipulate the set of dies, and 
   a second head to:
 receive the set of dies from the first head, and 
 return the set of dies to the carrier. 
   
     
     
         7 . The tool of  claim 1 , further comprising:
 a lane to:
 provide the carrier to the die module. 
   
     
     
         8 . The tool of  claim 1 , further comprising:
 an optical system to:   capture an image of the carrier; and   identify, based on the image, the set of dies on the carrier,   wherein the die module is to receive or select the set of dies after the set of dies are identified on the carrier.   
     
     
         9 . A method, comprising:
 receiving, by a device, a carrier on a lane;   selecting or picking up, by the device, a set of dies from the carrier;   manipulating, by the device, the set of dies; and   returning, by the device and after manipulating the set of dies, the set of dies to the carrier.   
     
     
         10 . The method of  claim 9 , wherein the set of dies is selected or picked up from, and returned to, a same position on the carrier. 
     
     
         11 . The method of  claim 9 , further comprising:
 causing after returning the set of dies to the carrier, the carrier to be provided to a conveyor.   
     
     
         12 . The method of  claim 9 , wherein the device comprises one or more robotic arms. 
     
     
         13 . The method of  claim 12 , wherein the one or more robotic arms comprises a plurality of robotic arms. 
     
     
         14 . A module, comprising:
 a first head, to:
 select or pick up a set of dies from a carrier, 
 manipulate the set of dies, and 
 after manipulating the set of dies, return the set of dies to the carrier or provide the set of dies to a second head of the module. 
   
     
     
         15 . The module of  claim 14 , wherein the set of dies is selected or picked up from, and returned to, a same position on the carrier. 
     
     
         16 . The module of  claim 14 , further comprising:
 the second head,
 wherein each of the first head and second head is to select or pick up a different die of the set of dies from the carrier, manipulate the different die, and return the different die to the carrier. 
   
     
     
         17 . The module of  claim 14 , wherein the first head is to, after manipulating the set of dies, provide the set of dies to the second head of the module: 
     
     
         18 . The module of  claim 14 , further comprising:
 the second head to:
 receive the set of dies from the first head, and 
 return the set of dies to the carrier. 
   
     
     
         19 . The module of  claim 14 , wherein at least one of the first head or the second head comprises a robotic arm. 
     
     
         20 . The module of  claim 14 , wherein the first head is further to:
 cause, after returning the set of dies to the carrier, the carrier to be provided to the conveyer.