Systems and methods for treating a substrate

Abstract

Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series metal, copper, an inorganic phosphate compound, an organophosphate compound, and an organophosphonate compound; wherein the composition is substantially free of peroxide. Also disclosed herein are systems and methods of treating a metal substrate. Also disclosed are substrates treated with the systems and methods.

1 . A composition comprising:
 a first lanthanide series metal, wherein the composition comprises a pH of less than 2.0 and is substantially free of peroxide.   
     
     
         2 . The composition of  claim 1 , further comprising:
 a second lanthanide series metal, copper, an inorganic phosphate compound, an organophosphate compound, and/or an organophosphonate compound.   
     
     
         3 . (canceled) 
     
     
         4 . The composition of  claim 1 , wherein the composition is substantially free of zirconium or zinc. 
     
     
         5 . The composition of  claim 2 , wherein the first lanthanide series metal is different than the second lanthanide series metal. 
     
     
         6 - 7 . (canceled) 
     
     
         8 . The composition of  claim 1 , wherein the composition comprises the first lanthanide series metal in an amount of 5 ppm to 25,000 ppm based on total weight of the pretreatment composition. 
     
     
         9 . The composition of  claim 1 , wherein the composition further comprises ammonium nitrate and/or ammonium sulfate. 
     
     
         10 . The composition of  claim 2 , wherein:
 (a) the second lanthanide series metal comprises gadolinium, lanthanum, praseodymium, samarium, or combinations thereof;   (b) the inorganic phosphate compound comprises sodium phosphotungstate, potassium phosphotungstate, calcium phosphotungstate, or combinations thereof;   (c) the organophosphate compound comprises a phosphatized epoxy; and/or   (d) the organophosphonate compound comprises a phosphoric acid and/or a phosphonic acid; and/or   (e) the first lanthanide series metal is present in the +4 oxidation state prior to application of the composition to a surface of a metal substrate.   
     
     
         11 . The composition of  claim 2 , comprising:
 (a) the second lanthanide series metal in an amount of 5 ppm to 25,000 ppm based on total weight of the composition;   (b) copper in an amount of 5 ppm to 1,000 ppm based on total weight of the composition;   (c) the inorganic phosphate compound in an amount of 10 ppm to 50,000 ppm based on total weight of the composition;   (d) the organophosphate compound in an amount of 10 ppm to 100,000 ppm based on total weight of the composition; and/or   (e) the organophosphonate compound in an amount of 10 ppm to 100,000 ppm based on total weight of the composition.   
     
     
         12 . The composition of  claim 1 , wherein the composition is substantially free of gelatin, lanthanide oxide, and/or copper. 
     
     
         13 . A system for treating a metal substrate, comprising:
 a first composition comprising the composition of  claim 1 ; and   a second composition comprising a fluorometallic acid and a pH of 1.0 to 4.0; and/or   a third composition comprising a Group IVB metal.   
     
     
         14 . The system of  claim 13 , wherein the second composition further comprises free fluoride in an amount of 1 ppm to 500 ppm based on total weight of the second composition. 
     
     
         15 . The system of  claim 13 , wherein the fluorometallic acid of the second composition comprises a Group IVA metal, a Group IVB metal, a Group IIIA metal, and/or a Group VIIIB metal. 
     
     
         16 - 18 . (canceled) 
     
     
         19 . The system of  claim 15 , wherein the second composition comprises:
 (a) the Group IVA metal in an amount of 10 ppm to 1,500 ppm based on total weight of the second composition;   (b) the Group IVB metal in an amount of 20 ppm to 5,000 ppm based on total weight of the second composition;   (c) the Group IIIA metal in an amount of 10 ppm to 1,500 ppm based on total weight of the second composition; and/or   (d) the Group VIIIB metal in an amount of 100 ppm to 3,000 ppm based on total weight of the second composition.   
     
     
         20 - 22 . (canceled) 
     
     
         23 . The system of  claim 13 , wherein the third composition comprises the Group IVB metal in an amount of 20 ppm to 1,000 ppm based on total weight of the third composition. 
     
     
         24 . The system of  claim 13 , wherein the third composition further comprises an electropositive metal, a Group IA metal, a Group VIB metal, a Group VIIIB metal, and/or an oxidizing agent. 
     
     
         25 . (canceled) 
     
     
         26 . The system of  claim 24 , wherein the third composition comprises:
 (a) the electropositive metal in an amount of 2 ppm to 100 ppm based on total weight of the third composition;   (b) the Group IA metal in an amount of 2 ppm to 500 ppm based on total weight of the third composition;   (c) the Group VIB metal in an amount of 5 ppm to 500 ppm based on total weight of the third composition;   (d) the Group VIIIB metal in an amount of 0.1 ppm to 50 ppm based on total weight of the third composition; and/or   (e) the oxidizing agent in an amount of 50 ppm to 13,000 ppm based on total weight of the third composition.   
     
     
         27 - 33 . (canceled) 
     
     
         34 . A method of treating a metal substrate comprising:
 contacting at least a portion of a surface of the substrate with the composition of  claim 1 .   
     
     
         35 . A method of treating a metal substrate with the system of  claim 13 , wherein the treating comprises:
 contacting at least a portion of a surface of the substrate with the first composition; and   contacting at least a portion of the surface with the second composition; and/or   contacting at least a portion of the surface with the third composition.   
     
     
         36 - 37 . (canceled) 
     
     
         38 . A substrate comprising a surface, wherein at least a portion of the surface is treated with the composition of  claim 1 . 
     
     
         39 . The substrate of  claim 38 , wherein the substrate has a scribe creep on a substrate surface that is at least maintained compared to a substrate contacted with a composition comprising lanthanide series metal and an oxidizing agent, wherein the scribe creep is measured following ASTM G85 A2 testing for at least 1 week, GMW14872 corrosion testing for at least five weeks, and/or CASS testing for at least 1 week. 
     
     
         40 - 44 . (canceled)