Loading and unloading system for silicon wafer

Abstract

A loading and unloading system for silicon wafer includes a wafer guiding apparatus, a silicon wafer flipping apparatus, and a conveying apparatus. The wafer guiding apparatus includes a loading-guiding assembly, an unloading-guiding assembly, and a lateral conveying device connecting each of the loading-guiding assembly and the unloading-guiding assembly. The loading-guiding assembly controls loading of silicon wafers, the unloading-guiding assembly controls unloading of the silicon wafers. The silicon wafer flipping apparatus includes a silicon wafer flipping mechanism, a silicon wafer lateral moving mechanism, and a silicon wafer shift mechanism configured to control movement of the silicon wafer flipping mechanism, the silicon wafer flipping mechanism configured to flip the silicon wafers. The conveying apparatus is configured to control flowing of silicon wafers between a main apparatus and the silicon wafer flipping apparatus.

What is claimed is: 
     
         1 . A loading and unloading system for silicon wafer, comprising:
 a wafer guiding apparatus comprising a loading-guiding assembly, an unloading-guiding assembly, and a lateral conveying device connecting to each of the loading-guiding assembly and the unloading-guiding assembly, the loading-guiding assembly configured to control loading of silicon wafers, the unloading-guiding assembly configured to control unloading of the silicon wafers, and the lateral conveying device configured to flow baskets in the loading-guiding assembly and baskets in the unloading-guiding assembly;   a silicon wafer flipping apparatus comprising a silicon wafer flipping mechanism, a silicon wafer lateral moving mechanism, and a silicon wafer shift mechanism, the silicon wafer lateral moving mechanism and the silicon wafer shift mechanism configured to control moving of the silicon wafer flipping mechanism, the silicon wafer flipping mechanism configured to flip the silicon wafers; and   a conveying apparatus configured to control flowing of silicon wafers between a main apparatus configured to process the silicon wafers and the silicon wafer flipping apparatus.   
     
     
         2 . The loading and unloading system for silicon wafer of  claim 1 , wherein the loading-guiding assembly comprises sequentially connected a loading docking-conveying mechanism, a loading buffer conveying mechanism, a loading basket lifting mechanism, a loading basket conveying mechanism, a loading silicon wafer conveying mechanism, a loading silicon wafer buffer mechanism, and a loading-receiving mechanism;
 the loading basket conveying mechanism is located on a lower side of the loading basket lifting mechanism;   the unloading-guiding assembly comprises sequentially connected an unloading docking-conveying mechanism, an unloading buffer conveying mechanism, an unloading basket lifting mechanism, an unloading basket conveying mechanism, an unloading silicon wafer conveying mechanism, an unloading silicon wafer buffer mechanism, and an unloading-receiving mechanism;   the unloading basket conveying mechanism is located on a lower side of the unloading basket lifting mechanism; and   the lateral conveying mechanism is connected to each of the loading basket conveying mechanism and the unloading basket conveying mechanism.   
     
     
         3 . The loading and unloading system for silicon wafer of  claim 1 , wherein the silicon wafer flipping mechanism comprises a suction component, the suction component comprises a flipping motor and two suction components, the flipping motor and the two suction components are configured to cooperatively control flipping of the silicon wafers; the flipping motor is connected to the two suction components;
 one of the two suction components comprises a first suction plate and a plurality of first suction cups on the first suction plate, and other of the two suction components comprises a second suction plate and a plurality of second suction cups on the second suction plate; the flipping motor is connected to each of the first suction plate and the second suction plate;   and the plurality of first suction cups and the plurality of second suction cups are configured to cooperatively suck or place the silicon wafers.   
     
     
         4 . The loading and unloading system for silicon wafer of  claim 1 , wherein the conveying apparatus comprises at least one basket positioning-moving mechanism, a basket silicon wafer lifting mechanism, a silicon wafer regularity mechanism, a carrier silicon wafer lifting mechanism, a suction cup lateral moving mechanism, a carrier positioning-moving mechanism, a carrier flipping-moving component, and a carrier holder conveying mechanism;
 the basket positioning-moving mechanism, the basket silicon wafer lifting mechanism, the carrier silicon wafer lifting mechanism, the suction cup lateral moving mechanism, and the carrier positioning-moving mechanism are configured to cooperatively control transportation and flow of the silicon wafers;   the silicon wafer regularity mechanism is configured to adjust lifting of the basket silicon wafer lifting mechanism and the silicon wafers in the carrier silicon wafer lifting mechanism;   the carrier flipping-moving component is configured to transport and flip carriers, and   the carrier holder conveying mechanism is connected to the main apparatus and is configured to control input or output of the silicon wafers to the main apparatus.   
     
     
         5 . The loading and unloading system for silicon wafer of  claim 4 , wherein the conveying apparatus comprises two basket positioning-moving mechanisms;
 each of the two basket positioning-moving mechanisms comprises at least one supporting component configured for carrying baskets and a driving component configured for moving the at least one supporting component;   the basket silicon wafer lifting mechanism comprises a bearing frame and a lifting assembly, the bearing frame comprises a lifting power component and a lifting assembly, the lifting power component is configured to control lifting of the lifting component;   the lifting assembly comprises a lifting connecting plate and a lifting component, the lifting component comprises a lifting frame component, a jacking tooth fixing plate, and a jacking tooth component, the jacking tooth component is installed on a lifting frame component by the jacking tooth fixing plate.   the jacking tooth component comprises a plurality of jacking teeth, each of the plurality of jacking teeth defines a plurality of grooves for importing or exporting the silicon wafers.   
     
     
         6 . The loading and unloading system for silicon wafer of  claim 5 , wherein the lifting frame component comprises two symmetrical distributed lifting frame plates;
 the lifting component comprises two jacking tooth components, each of the two jacking tooth components corresponds to one of the two lifting frame plates; and   the jacking tooth fixing plate is connected between the lifting frame plate and the jacking tooth component.   
     
     
         7 . The loading and unloading system for silicon wafer of  claim 6 , wherein a connection stabilization device is installed between jacking tooth fixing plate and the lifting frame plate; the connection stabilization device comprises a connection stabilization fixing part and a connection stabilization adjustment part connected to the connection stabilization fixing part;
 the connection stabilization fixing part is connected to a lower end surface of the jacking tooth fixing plate, the connection stabilization adjustment part defines a stable perforation, a stable adjustment rod is inserted in the stable perforation, the lifting frame plate defines a frame adjustment waist hole, and the stable adjustment rod extends into the frame adjustment waist hole; and   a position of the jacking tooth fixing plate relative to the lifting frame plate is controlled by adjusting a length of the stable adjustment rod extending into the frame adjustment waist hole.   
     
     
         8 . The loading and unloading system for silicon wafer of  claim 6 , wherein every adjacent two of the plurality of jacking teeth are connected to each other, an upper end of each of the plurality of groove is connected to a guiding cavity; and
 a distance between each adjacent grooves of each jacking tooth component is kept consistent.   
     
     
         9 . The loading and unloading system for silicon wafer of  claim 4 , wherein the silicon wafer regularity mechanism comprises a silicon wafer regularity power component, two silicon wafer regular moving components, and a silicon wafer regularity restriction component,
 the silicon wafer regularity power component is configured to drive the two silicon wafer regular moving components to move closer or farther away from each other; and   the silicon wafer regularity restriction component is configured to restrict movement of the silicon wafer regular moving components and detect silicon wafer.   
     
     
         10 . The loading and unloading system for silicon wafer of  claim 9 , wherein the silicon wafer regularity power component comprises a silicon wafer regular fixing plate and two silicon wafer regular cylinders fixed on the silicon wafer regular fixing plate;
 each of the two silicon wafer regular cylinders is connected to the silicon wafer regular moving component;   the silicon wafer regular moving component comprises a silicon wafer regular connecting plate and a silicon wafer regular adjusting plate connected to the silicon wafer regular connecting plate;   the silicon wafer regular connecting plate is connected to an output shaft of the silicon wafer regular cylinder, the silicon wafer regular cylinder is configured to drive the silicon wafer regular adjusting plate to move by the silicon wafer regular connecting plate;   a silicon wafer regular sliding rail is installed on the silicon wafer regular fixing plate, a silicon wafer regular slider is slidably installed on the silicon wafer regular slide rail, a silicon wafer regular slider plate fixed on the silicon wafer regular slider, the silicon wafer regular slider plate is connected to the silicon wafer regular adjusting plate by a silicon wafer regular reinforcement plate.   
     
     
         11 . The loading and unloading system for silicon wafer of  claim 10 , wherein
 the silicon wafer regularity restriction component is located between the two silicon wafer regular moving components; the silicon wafer regularity restriction component comprises a silicon wafer regularity limiting block; a wafer regularity adjusting rods is fixed on a side surface of the silicon wafer regularity limiting block facing the silicon wafer regular slider;   a silicon wafer regularity sensor is installed on the silicon wafer regularity limiting block, the silicon wafer regularity sensor is configured to detect a full and shortage status of the basket silicon wafer lifting mechanism.   
     
     
         12 . The loading and unloading system for silicon wafer of  claim 4 , wherein the carrier silicon wafer lifting mechanism is configured to push out silicon wafers in the carrier positioning-moving mechanism or place silicon wafers in the carrier jacking tooth component into the carrier positioning-moving mechanism;
 the suction cup lateral moving mechanism is configured to control suction and separation of the silicon wafers, thereby controlling a flow of the silicon wafers between the basket silicon wafer lifting mechanism and the carrier silicon wafer lifting mechanism; and   the carrier holder conveying mechanism comprises a carrier holder component configured for carrying the carrier holders and a moving component configured for driving the movement of the carrier holder component.   
     
     
         13 . The loading and unloading system for silicon wafer of  claim 2 , wherein the lateral conveying mechanism comprises a flow conveying component and a flow moving component;
 the flow moving component is configured to drive the flow conveying component to move relative to the flow moving component;   the flow conveying component is connected to each of the loading basket conveying mechanism and the unloading basket conveying mechanism during a movement process; and   an upper end surface of the flow conveying component is in a same horizontal plane as an upper end surface of the loading basket conveying mechanism and an upper end surface of the unloading basket conveying mechanism.   
     
     
         14 . The loading and unloading system for silicon wafer of  claim 2 , wherein the loading docking-conveying mechanism is configured to simultaneously accommodate a plurality of baskets for conveying;
 loading blocking cylinders are fixed on both ends of the loading docking-conveying mechanism in a conveying direction;   two loading target sensors are symmetrically fixed on two sides of an end face of the loading docking-conveying mechanism, the two loading target sensors and the loading blocking cylinders cooperate to achieve a purpose of sequentially transporting one basket to the loading buffer conveying mechanism; and   the loading docking-conveying mechanism is also equipped with several sensors for detecting a full or short material status of the basket.