Copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same

Abstract

According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 mΩ/cm to 2.7 mΩ/cm.

What is claimed is: 
     
         1 . A copper foil comprising:
 a copper film including 99.9 wt % or more of copper; and   a protective layer formed on the copper film,   wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 mΩ/cm to 2.7 mΩ/cm.   
     
     
         2 . The copper foil of  claim 1 , wherein the copper foil has a water contact angle reduction rate after heat treatment at 190° C.for one hour in a range of 0% to 25%. 
     
     
         3 . The copper foil of  claim 1 , wherein the copper foil has a surface resistance increase rate after heat treatment at 190° C.for one hour in a range of 0% to 5%. 
     
     
         4 . The copper foil of  claim 1 , wherein the copper foil has an arithmetic mean roughness (Ra) of 0.1 μm to 0.3 μm. 
     
     
         5 . The copper foil of  claim 1 , wherein the protective layer includes at least one of a chromium compound, a silane compound, and a nitrogen compound.