Cut surface smoothing device and manufacturing system

Abstract

A cut surface smoothing device which can smooth the cut surface of a filament three-dimensional bonded member is provided. The cut surface smoothing device includes a high temperature portion which is heated to a temperature equal to or higher than the melting point of the filament three-dimensional bonded member, and the high temperature portion is applied to the cut surface of the filament three-dimensional bonded member to smooth the cut surface.

1 . A cut surface smoothing device comprising:
 a high temperature portion that is heated to a temperature equal to or higher than a melting point of a filament three-dimensional bonded member,   wherein the high temperature portion is applied to a cut surface of the filament three-dimensional bonded member to smooth the cut surface,   the cut surface of the filament three-dimensional bonded member that is conveyed parallel to the cut surface is smoothed, and   the high temperature portion is arranged to rotate in a same direction as the conveyance while being applied to the cut surface.   
     
     
         2 . (canceled) 
     
     
         3 . The cut surface smoothing device according to  claim 1 ,
 wherein the high temperature portion is an outer surface of a belt that is tensioned and supported by rollers arranged on an upstream side and a downstream side of the conveyance.   
     
     
         4 . The cut surface smoothing device according to  claim 3 ,
 wherein the belt is heated by a heat source provided in the roller on the upstream side, and   cooling air is supplied between the rollers inside the belt.   
     
     
         5 . The cut surface smoothing device according to  claim 3 ,
 wherein coating treatment that easily separates the cut surface from the outer surface is performed on the outer surface of the belt.   
     
     
         6 . A cut surface smoothing device comprising:
 a high temperature portion that is heated to a temperature equal to or higher than a melting point of a filament three-dimensional bonded member,   wherein the high temperature portion is applied to a cut surface of the filament three-dimensional bonded member to smooth the cut surface,   the cut surface smoothing device includes:
 the high temperature portion that is a wall surface; and 
 a fixing vibration table that exposes the cut surface and fixes and supports the filament three-dimensional bonded member, 
   wherein the fixing vibration table vibrates parallel to the cut surface while applying the cut surface to the wall surface to smooth the cut surface.   
     
     
         7 . The cut surface smoothing device according to  claim 6 ,
 wherein coating that suppresses adhesion of a resin to the wall surface is performed on the wall surface.   
     
     
         8 . (canceled) 
     
     
         9 . A manufacturing system comprising:
 a filament three-dimensional bonded member manufacturing device that continuously forms and discharges the filament three-dimensional bonded member;   a cutting device that cuts the discharged filament three-dimensional bonded member at predetermined intervals; and   the cut surface smoothing device according to  claim 1  that smooths the cut surface generated by the cutting.   
     
     
         10 . (canceled) 
     
     
         11 . (canceled) 
     
     
         12 . (canceled) 
     
     
         13 . The cut surface smoothing device according to  claim 4 ,
 wherein coating treatment that easily separates the cut surface from the outer surface is performed on the outer surface of the belt.