Display device comprising display module, and method for manufacturing same

Abstract

A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal plate positioned on the rear surface of the substrate; a side molding covering the side surface and positioned below the outer area from the mounting surface; and a grounding member grounded to the metal plate and adhered to a lower surface of the side molding, where the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.

What is claimed is: 
     
         1 . A display module comprising:
 a substrate comprising a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface;   a front cover covering the mounting surface and extending to an outer area from the mounting surface;   a metal plate positioned on the rear surface of the substrate;   a side molding covering the side surface and positioned below the outer area from the mounting surface; and   a grounding member grounded to the metal plate and adhered to a lower surface of the side molding,   wherein the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.   
     
     
         2 . The display module of  claim 1 , wherein a side end of the front cover positioned in the outer area from the mounting surface, and a side end of the side molding are aligned in a direction which the mounting surface faces. 
     
     
         3 . The display module of  claim 1 , further comprising a Thin Film Transistor (TFT) layer formed on the mounting surface, and an anisotropic conductive layer positioned on an upper surface of the TFT layer and configured to electrically connect the TFT layer to the plurality of inorganic light-emitting devices,
 wherein the anisotropic conductive layer extends to the outer area from the mounting surface.   
     
     
         4 . The display module of  claim 3 , wherein a side end of the front cover positioned in the outer area from the mounting surface, and a side end of the anisotropic conductive layer positioned in the outer area from the mounting surface are aligned in a direction which the mounting surface faces. 
     
     
         5 . The display module of  claim 4 , wherein the side end of the front cover, the side end of the anisotropic conductive layer, and a side end of the side molding are aligned in the direction which the mounting surface faces. 
     
     
         6 . The display module of  claim 1 , wherein the side molding comprises a chamfer portion positioned between the lower surface of the side molding and a side end of the side molding, and
 wherein the grounding member extends from the metal plate and is in contact with the lower surface of the side molding and the chamfer portion of the side molding.   
     
     
         7 . The display module of  claim 6 , wherein the grounding member is positioned at a more inner location than the side end of the side molding in a direction that is orthogonal to a direction which the mounting surface faces. 
     
     
         8 . A display device comprising a display module array in which a plurality of display modules are arranged horizontally in a matrix form of M*N, wherein each of the plurality of display modules comprises:
 a substrate comprising a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface;   a front cover covering the mounting surface and extending to an outer area from the mounting surface;   a metal plate mounted on the rear surface of the substrate;   a side molding covering the side surface and positioned below the outer area from the mounting surface; and   a grounding member being grounded to the metal plate and adhered to a lower surface of the side molding,   wherein the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.   
     
     
         9 . The display device of  claim 8 , wherein a side end of the front cover positioned in the outer area from the mounting surface, and a side end of the side molding are aligned in a direction which the mounting surface faces. 
     
     
         10 . The display device of  claim 9 , further comprising a thin film transistor (TFT) layer formed on the mounting surface, and an anisotropic conductive layer positioned on an upper surface of the TFT layer and configured to electrically connect the TFT layer to the plurality of inorganic light-emitting devices,
 wherein the anisotropic conductive layer extends to the outer area from the mounting surface.   
     
     
         11 . The display device of  claim 10 , wherein the side end of the front cover positioned in the outer area from the mounting surface, and a side end of the anisotropic conductive layer positioned in the outer area from the mounting surface are aligned in the direction which the mounting surface faces. 
     
     
         12 . The display device of  claim 8 , wherein the side molding comprises a chamfer portion positioned between the lower surface of the side molding and a side end of the side molding, and
 wherein the grounding member extends from the metal plate and is in contact with the lower surface of the side molding and the chamfer portion of the side molding.   
     
     
         13 . The display device of  claim 12 , wherein the grounding member is positioned at a more inner location than the side end of the side molding in a direction that is orthogonal to the direction which the mounting surface faces. 
     
     
         14 . A method of manufacturing a display module, comprising:
 providing a substrate including a mounting surface on which a Thin Film Transistor (TFT) layer is formed, a side surface, and a rear surface being opposite to the mounting surface, wherein a wire is formed on the substrate;   injection-molding a side molding on the side surface of the substrate;   adhering an anisotropic conductive film onto the TFT layer;   mounting a plurality of inorganic light-emitting devices on the mounting surface;   adhering a front cover onto the mounting surface, the front cover extending to an outer area from the mounting surface; and   cutting the front cover, the anisotropic conductive film, and the side molding simultaneously in a direction which the mounting surface faces.   
     
     
         15 . The method of  claim 14 , further comprising providing a metal plate in contact with the rear surface of the substrate.