Voice coil structure and loudspeaker

Abstract

The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.

What is claimed is: 
     
         1 . A voice coil structure comprising:
 a substrate;   a first wiring layer disposed on the substrate and having a winding structure, the first wiring layer comprising a first end and a second end; and   a first insulation layer disposed on the first wiring layer, the first insulation layer defining a through hole and a first notch, the first end exposed from the through hole, and the second end exposed from the first notch.   
     
     
         2 . The voice coil structure of  claim 1 , further comprising a second wiring layer and a second insulation layer, wherein the second wiring layer is disposed on the first insulation layer, the second insulation layer is disposed on the second wiring layer, the second wiring layer comprises a third end and a fourth end, the second insulation layer defines a second notch and a third notch, the second notch is aligned with the first notch, the second end is further exposed from the second notch, the third end is electrically connected to the first end exposed from the through hole, and the fourth end is exposed from the third notch. 
     
     
         3 . The voice coil structure of  claim 2 , further comprising a first solder pad and a second solder pad, wherein the first solder pad and the second wiring layer are located on a same plane, the first solder pad is electrically connected to the second end exposed from the first notch, and the first solder pad is exposed from the second notch; the second solder pad and the first wiring layer are located on a same plane, the first insulating layer further defines a fourth notch, the second solder pad is exposed from the fourth notch, and the fourth end is electrically connected to the second solder pad exposed from the fourth notch. 
     
     
         4 . The voice coil structure of  claim 3 , wherein the first pad and the fourth end are exposed from a same side of the second insulation layer. 
     
     
         5 . The voice coil structure of  claim 2 , wherein the second wiring layer has a winding structure. 
     
     
         6 . The voice coil structure of  claim 1 , wherein a thickness of the substrate is in a range from 10 μm to 500 μm, a thickness of the first wiring layer is in a range from 0.1 μm to 50 μm, and a spacing of wirings of the first wiring layer is in a range from 1.0 μm to 100 μm. 
     
     
         7 . The voice coil structure of  claim 1 , wherein the first wiring layer comprises a material selected from a group consisting of aluminum, copper, silver, gold, or any combination thereof. 
     
     
         8 . The voice coil structure of  claim 1 , wherein the substrate comprises a material selected from a group consisting of glass, polydimethylsiloxane, polyimide, or any combination thereof. 
     
     
         9 . The voice coil structure of  claim 1 , wherein the first wiring layer comprises two straight segments and two bent segments which are alternately arranged in a winding direction of the first wiring layer, and each of the two bent segments is convex away from the first end. 
     
     
         10 . The voice coil structure of  claim 1 , wherein the first wiring layer is formed by winding a wire around the first end as a starting end, the second end is a terminal by winding the wire, and the first end and the second end are located on a same plane. 
     
     
         11 . A loudspeaker comprising:
 a diaphragm; and   a voice coil structure comprising:
 a substrate; 
 a first wiring layer disposed on the substrate, the first wiring layer having a winding structure, the first wiring layer comprising a first end and a second end; and 
 a first insulation layer disposed on the first wiring layer, the first insulation layer defining a through hole and a first notch, the first end exposed from the through hole, the second end exposed from the first notch, a surface of the substrate away from the first wiring layer disposed on the diaphragm. 
   
     
     
         12 . The loudspeaker of  claim 11 , further comprising a support frame, a first conductive adhesive, and a second conductive adhesive, wherein the diaphragm is disposed on the support frame, the first conductive adhesive and the second conductive adhesive are disposed on a surface of the support frame, the first conductive adhesive is electrically connected to the first end, and the second conductive adhesive is electrically connected to the second end. 
     
     
         13 . The loudspeaker of  claim 11 , wherein the voice coil structure further comprises a second wiring layer disposed on the first insulation layer and a second insulation layer disposed on the second wiring layer, the second wiring layer comprises a third end and a fourth end, the second insulation layer defines a second notch and a third notch, the second notch is aligned with the first notch, the second end is further exposed from the second notch, the third end is electrically connected to the first end exposed from the through hole, and the fourth end is exposed from the third notch. 
     
     
         14 . The loudspeaker of  claim 13 , wherein the voice coil structure further comprises a first solder pad and a second solder pad, the first solder pad and the second wiring layer are located on a same plane, the first solder pad is electrically connected to the second end exposed from the first notch, and the first solder pad is exposed from the second notch; the second solder pad and the first wiring layer are located on a same plane, the first insulating layer further defines a fourth notch, the second solder pad is exposed from the fourth notch, and the fourth end is electrically connected to the second solder pad exposed from the fourth notch. 
     
     
         15 . The loudspeaker of  claim 14 , wherein the first pad and the fourth end are exposed from a same side of the second insulation layer. 
     
     
         16 . The loudspeaker of  claim 13 , wherein the second wiring layer has a winding structure. 
     
     
         17 . The loudspeaker of  claim 11 , wherein a thickness of the substrate is in a range from 10 μm to 500 μm, a thickness of the first wiring layer is in a range from 0.1 μm to 50 μm, and a spacing of wirings of the first wiring layer is in a range from 1.0 μm to 100 μm. 
     
     
         18 . The voice coil structure of  claim 11 , wherein the first wiring layer comprises a material selected from a group consisting of aluminum, copper, silver, gold, or any combination thereof. 
     
     
         19 . The loudspeaker of  claim 11 , wherein the substrate comprises a material selected from a group consisting of glass, polydimethylsiloxane, polyimide, or any combination thereof. 
     
     
         20 . The loudspeaker of  claim 11 , wherein the first wiring layer comprises two straight segments and two bent segments which are alternately arranged in a winding direction of the first wiring layer, and each of the two bent segments is convex away from the first end.