US2024213024A1PendingUtilityA1
Diamond Semiconductor System And Method
Est. expiryDec 21, 2031(~5.4 yrs left)· nominal 20-yr term from priority
Inventors:Adam Khan
H10P 95/90H10P 50/00H10P 30/2044H10P 14/3406H10P 14/2923H10P 14/44H10P 14/43H10D 64/0122H10W 20/042H10D 64/0114H10D 8/045H10D 62/8303H10D 62/60H10D 8/051H10D 8/50H01L 29/868H01L 29/6603H01L 29/36H01L 29/1602H01L 21/76871H01L 21/324H01L 21/28556H01L 21/2855H01L 21/0435H01L 21/042H01L 21/0415H01L 21/02527H01L 21/02425H01L 21/043H10P 30/21H10P 30/222H10P 30/22H10P 30/28H10P 30/208
87
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond semiconductor material having a surface, exposing the surface to a source gas in an etching chamber, forming a carbide interface contact layer on the surface; and forming a metal layer on the interface layer.
Claims
exact text as granted — not AI-modified1 . A method of fabricating doped diamond material, comprising:
providing diamond material; depositing a mask on the diamond material; implanting a first set of dopant atoms into the diamond material layer; and implanting a second set of dopant atoms sized to be larger than the first set of dopant atoms into the diamond material.
2 . The method of claim 1 , wherein the diamond material is formed on a substrate that further comprises at least one of intrinsic diamond, fused silica, quartz, glass, sapphire, oxides, silicon oxide, silicon, and metal.
3 . The method of claim 1 , wherein the diamond material forms a part of a light emitting device.
4 . The method of claim 1 , wherein the diamond material forms a part of an RF attenuator device.
5 . The method of claim 1 , wherein the diamond material forms a part of a logic device.
6 . The method of claim 1 , wherein the diamond material is attached to a metal contact.
7 . The method of claim 1 , wherein dopant atoms positioned in the diamond material form n-type material.
8 . The method of claim 1 , wherein dopant atoms positioned in the diamond material form p-type material.
9 . The method of claim 1 , further comprising patterning the diamond material by masking with at least one of a photoresist and a metallic element.
10 . The method of claim 1 , further comprising defining different electrically active and inactive areas in the diamond material.
11 . The method of claim 1 , wherein the second set of dopant atoms is implanted into the diamond material after the first set of dopant atoms.
12 . The method of claim 1 , wherein the first set of dopant atoms forms pathways in the diamond material.
13 . The method of claim 1 , wherein the first set of dopant atoms forms pathways in the diamond material into which the second set of dopant atoms is implanted.
14 . The method of claim 1 , wherein temperature of the diamond material is changed after implant of the first set of dopant atoms.
15 . The method of claim 1 , wherein at least a portion of the surface of the diamond material is terminated.
16 . The method of claim 1 , wherein the diamond material further comprises polycrystalline diamond material.
17 . The method of claim 1 , wherein the diamond material further comprises ultrananocrystalline diamond material.Join the waitlist — get patent alerts
Track US2024213024A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.