US2024213024A1PendingUtilityA1

Diamond Semiconductor System And Method

Assignee: AKHAN SEMICONDUCTOR INCPriority: Dec 21, 2011Filed: Jan 22, 2024Published: Jun 27, 2024
Est. expiryDec 21, 2031(~5.4 yrs left)· nominal 20-yr term from priority
Inventors:Adam Khan
H10P 95/90H10P 50/00H10P 30/2044H10P 14/3406H10P 14/2923H10P 14/44H10P 14/43H10D 64/0122H10W 20/042H10D 64/0114H10D 8/045H10D 62/8303H10D 62/60H10D 8/051H10D 8/50H01L 29/868H01L 29/6603H01L 29/36H01L 29/1602H01L 21/76871H01L 21/324H01L 21/28556H01L 21/2855H01L 21/0435H01L 21/042H01L 21/0415H01L 21/02527H01L 21/02425H01L 21/043H10P 30/21H10P 30/222H10P 30/22H10P 30/28H10P 30/208
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Claims

Abstract

Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond semiconductor material having a surface, exposing the surface to a source gas in an etching chamber, forming a carbide interface contact layer on the surface; and forming a metal layer on the interface layer.

Claims

exact text as granted — not AI-modified
1 . A method of fabricating doped diamond material, comprising:
 providing diamond material;   depositing a mask on the diamond material;   implanting a first set of dopant atoms into the diamond material layer; and   implanting a second set of dopant atoms sized to be larger than the first set of dopant atoms into the diamond material.   
     
     
         2 . The method of  claim 1 , wherein the diamond material is formed on a substrate that further comprises at least one of intrinsic diamond, fused silica, quartz, glass, sapphire, oxides, silicon oxide, silicon, and metal. 
     
     
         3 . The method of  claim 1 , wherein the diamond material forms a part of a light emitting device. 
     
     
         4 . The method of  claim 1 , wherein the diamond material forms a part of an RF attenuator device. 
     
     
         5 . The method of  claim 1 , wherein the diamond material forms a part of a logic device. 
     
     
         6 . The method of  claim 1 , wherein the diamond material is attached to a metal contact. 
     
     
         7 . The method of  claim 1 , wherein dopant atoms positioned in the diamond material form n-type material. 
     
     
         8 . The method of  claim 1 , wherein dopant atoms positioned in the diamond material form p-type material. 
     
     
         9 . The method of  claim 1 , further comprising patterning the diamond material by masking with at least one of a photoresist and a metallic element. 
     
     
         10 . The method of  claim 1 , further comprising defining different electrically active and inactive areas in the diamond material. 
     
     
         11 . The method of  claim 1 , wherein the second set of dopant atoms is implanted into the diamond material after the first set of dopant atoms. 
     
     
         12 . The method of  claim 1 , wherein the first set of dopant atoms forms pathways in the diamond material. 
     
     
         13 . The method of  claim 1 , wherein the first set of dopant atoms forms pathways in the diamond material into which the second set of dopant atoms is implanted. 
     
     
         14 . The method of  claim 1 , wherein temperature of the diamond material is changed after implant of the first set of dopant atoms. 
     
     
         15 . The method of  claim 1 , wherein at least a portion of the surface of the diamond material is terminated. 
     
     
         16 . The method of  claim 1 , wherein the diamond material further comprises polycrystalline diamond material. 
     
     
         17 . The method of  claim 1 , wherein the diamond material further comprises ultrananocrystalline diamond material.

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