Electroplating Device

Abstract

An electroplating device includes an electroplating pool containing an electroplating solution, a first anode plate immersed in the electroplating solution, and a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically connected to a workpiece to be electroplated that is immersed in the electroplating solution. The first pulse rectifier periodically outputs a first set of pulse currents during electroplating of the workpiece. The first set of pulse currents includes a plurality of first different pulse currents that differ in a peak current density and a duty cycle.

What is claimed is: 
     
         1 . An electroplating device, comprising:
 an electroplating pool containing an electroplating solution;   a first anode plate immersed in the electroplating solution; and   a first pulse rectifier having a positive electrode electrically connected to the first anode plate and a negative electrode electrically connected to a workpiece to be electroplated that is immersed in the electroplating solution, the first pulse rectifier periodically outputs a first set of pulse currents during electroplating of the workpiece, the first set of pulse currents includes a plurality of first different pulse currents that differ in a peak current density and a duty cycle.   
     
     
         2 . The electroplating device according to  claim 1 , wherein the plurality of first different pulse currents in the first set of pulse currents are generated in chronological order, the peak current density of a pulse current generated first in the first set of pulse currents is higher than that of another pulse current generated later in the first set of pulse currents, the duty cycle of a pulse current generated first in the first set of pulse currents is lower than that of another pulse current generated later in the first set of pulse currents. 
     
     
         3 . The electroplating device according to  claim 1 , wherein at least one of an amplitude, a pulse width, and a pulse frequency of the plurality of first different pulse currents in the first set of pulse currents are different from each other. 
     
     
         4 . The electroplating device according to  claim 1 , further comprising a second anode plate immersed in the electroplating solution and a second pulse rectifier, the second pulse rectifier has a positive electrode electrically connected to the second anode plate and a negative electrode electrically connected to the workpiece. 
     
     
         5 . The electroplating device according to  claim 4 , wherein the second pulse rectifier periodically outputs a second set of pulse currents during electroplating of the workpiece, the second set of pulse currents include a plurality of second different pulse currents that differ in a peak current density and a duty cycle. 
     
     
         6 . The electroplating device according to  claim 5 , wherein the second set of pulse currents output by the second pulse rectifier is different from the first set of pulse currents output by the first pulse rectifier. 
     
     
         7 . The electroplating device according to  claim 6 , wherein:
 the peak current density of at least one pulse current in the second set of pulse currents is different from that of any pulse current in the first set of pulse currents; and/or   the duty cycle of at least one pulse current in the second set of pulse currents is different from that of any pulse current in the first set of pulse currents.   
     
     
         8 . The electroplating device according to  claim 5 , wherein the plurality of second different pulse currents in the second set of pulse currents are generated in chronological order, the peak current density of a pulse current generated first in the second set of pulse currents is higher than that of another pulse current generated later in the second set of pulse currents, the duty cycle of a pulse current generated first in the second set of pulse currents is lower than that of another pulse current generated later in the second set of pulse currents. 
     
     
         9 . The electroplating device according to  claim 5 , wherein at least one of an amplitude, a pulse width, and a pulse frequency of the plurality of second different pulse currents in the second set of pulse currents is different from each other. 
     
     
         10 . The electroplating device according to  claim 5 , wherein the first anode plate is one of a pair of first anode plates that are respectively arranged on a front side and a back side of the workpiece, and the second anode plate is one of a pair of second anode plates that are respectively arranged on the front side and the back side of the workpiece. 
     
     
         11 . The electroplating device according to  claim 5 , wherein the first anode plate is one of a pair of first anode plates and the second anode plate is one of a pair of second anode plates, one of the first anode plates and one of the second anode plates are arranged side by side on a front side of the workpiece, and another of the first anode plates and another of the second anode plates are arranged side by side on a back side of the workpiece. 
     
     
         12 . The electroplating device according to  claim 5 , wherein the first anode plate is one of a pair of first anode plates and the second anode plate is one of a pair of second anode plates, one of the first anode plates and one of the second anode plates are overlapped on a front side of the workpiece, and another of the first anode plates and another of the second anode plates are overlapped on a back side of the workpiece. 
     
     
         13 . The electroplating device according to  claim 5 , wherein the first anode plate is one of two pairs of first anode plates, one of the pairs of first anode plates is arranged staggered on a front side of the workpiece and electrically connected to each other, the other of the pairs of first anode plates is arranged staggered on a back side of the workpiece and electrically connected to each other. 
     
     
         14 . The electroplating device according to  claim 13 , wherein the second anode plate is one of two pairs of second anode plates, one of the pairs of second anode plates is arranged staggered on the front side of the workpiece and electrically connected to each other, the other of the pairs of second anode plates is arranged staggered on the back side of the workpiece and electrically connected to each other. 
     
     
         15 . The electroplating device according to  claim 14 , wherein one of the first anode plates of the two pairs of first anode plates is overlapped with the one of the second anode plates of the two pairs of second anode plates. 
     
     
         16 . The electroplating device according to  claim 4 , wherein a material of the first anode plate is different from a material of the second anode plate. 
     
     
         17 . The electroplating device according to  claim 4 , further comprising a filter bag containing the first anode plate and/or the second anode plate, the filter bag prevents a plurality of foreign powder particles dissolved from the first anode plate and/or the second anode plate from entering the electroplating solution.