Additive for composite plating solutions

Abstract

An additive for a composite plating solution, containing non-conductive fine particles, nickel ions, and water. A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, including incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water.

1 . An additive for a composite plating solution, comprising non-conductive fine particles, nickel ions, and water. 
     
     
         2 . The additive for a composite plating solution according to  claim 1 , wherein the composite plating solution is a satin nickel plating solution or a microporous nickel plating solution. 
     
     
         3 . The additive for a composite plating solution according to  claim 1 , wherein the non-conductive fine particles are one or more of oxides, nitrides, sulfides, or inorganic salts of a metal selected from the group consisting of silicon, barium, zirconium, aluminum, and titanium. 
     
     
         4 . The additive for a composite plating solution according to  claim 1 , which contains one or more selected from the group consisting of hydrates of nickel sulfate, nickel chloride, nickel sulfamate, and nickel acetate and anhydrides of nickel sulfate, nickel chloride, nickel sulfamate, and nickel acetate. 
     
     
         5 . The additive for a composite plating solution according to  claim 1 , further comprising one or more selected from a charge imparting agent, a surfactant, and a brightener. 
     
     
         6 . A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, comprising:
 incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water.