Backlight module and manufacturing method thereof

Abstract

A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a substrate, a light emitting element, and a conductive layer. The substrate includes a central region and a peripheral region. The peripheral region surrounds the central region. The light emitting element is disposed in the central region. The conductive layer is disposed in the peripheral region and electrically connected to the light emitting element. The conductive layer has a first portion and a second portion. The first portion is closer to the light emitting element than the second portion. The first portion has a first metal layer area, and the second portion has a second metal layer area. The first metal layer area is greater than the second metal layer area. The backlight module and the manufacturing method thereof may reduce a loss of laser energy or improve a cutting yield during a cutting step of a manufacturing process.

What is claimed is: 
     
         1 . A backlight module, comprising:
 a substrate comprising a central region and a peripheral region, wherein the peripheral region surrounds the central region;   a light emitting element disposed in the central region; and   a conductive layer disposed in the peripheral region and electrically connected to the light emitting element,   wherein the conductive layer has a first portion and a second portion, the first portion is closer to the light emitting element than the second portion, the first portion has a first metal layer area, the second portion has a second metal layer area, and the first metal layer area is greater than the second metal layer area.   
     
     
         2 . The backlight module according to  claim 1 , further comprising:
 a driving circuit, wherein the conductive layer is electrically connected to the light emitting element through the driving circuit.   
     
     
         3 . The backlight module according to  claim 1 , wherein the first portion has a first metal layer thickness, the second portion has a second metal layer thickness, and the second metal layer thickness is less than the first metal layer thickness. 
     
     
         4 . The backlight module according to  claim 1 , further comprising:
 a first insulation layer disposed between the substrate and the conductive layer.   
     
     
         5 . The backlight module according to  claim 4 , wherein the first insulation layer comprises a first region and a second region, the first region corresponds to the first portion, the second region corresponds to the second portion, and a thickness of the second region is less than a thickness of the first region. 
     
     
         6 . The backlight module according to  claim 5 , wherein roughness of the second region is greater than roughness of the first region. 
     
     
         7 . The backlight module according to  claim 4 , further comprising:
 a second insulation layer, wherein the conductive layer is disposed between the first insulation layer and the second insulation layer.   
     
     
         8 . The backlight module according to  claim 7 , wherein the second insulation layer comprises a third region and a fourth region, the third region corresponds to the first portion, the fourth region corresponds to the second portion, and a thickness of the fourth region is less than a thickness of the third region. 
     
     
         9 . The backlight module according to  claim 8 , wherein roughness of the fourth region is greater than roughness of the third region. 
     
     
         10 . The backlight module according to  claim 1 , wherein roughness of the second portion is greater than roughness of the first portion. 
     
     
         11 . The backlight module according to  claim 10 , wherein roughness of a surface of the second portion away from the substrate is greater than roughness of a surface of the first portion away from the substrate. 
     
     
         12 . The backlight module according to  claim 10 , wherein roughness of a side surface of the second portion adjacent to the peripheral region is greater than roughness of a side surface of the first portion adjacent to the peripheral region. 
     
     
         13 . The backlight module according to  claim 1 , wherein the first portion has a first minimum width, the second portion has a second minimum width, and the second minimum width is less than the first minimum width. 
     
     
         14 . The backlight module according to  claim 1 , wherein the second portion has at least one sub-portion and at least one opening, and the at least one opening exposes a portion of the substrate. 
     
     
         15 . The backlight module according to  claim 14 , wherein the first portion has a first minimum width, the at least one sub-portion has a third minimum width, and the third minimum width is less than the first minimum width. 
     
     
         16 . The backlight module according to  claim 15 , wherein the at least one sub-portion is a plurality of sub-portions, the at least one opening is a plurality of openings, the sub-portions are separated from one another, and the openings separate the sub-portions. 
     
     
         17 . The backlight module according to  claim 1 , wherein a shape of the second portion is comb-like, trapezoidal, or U-shaped. 
     
     
         18 . A manufacturing method of a backlight module, comprising:
 providing a substrate, wherein the substrate comprises a central region, a peripheral region, and a region to be cut, the peripheral region surrounds the central region, and the region to be cut surrounds the peripheral region;   disposing a light emitting element in the central region;   forming a first conductive layer in the peripheral region and the region to be cut to be electrically connected to the light emitting element; and   through a cutting step, removing the first conductive layer located in the region to be cut to obtain a second conductive layer,   wherein the second conductive layer has a first portion and a second portion, the first portion is closer to the light emitting element than the second portion, the first portion has a first metal layer area, the second portion has a second metal layer area, and the first metal layer area is greater than the second metal layer area.   
     
     
         19 . The manufacturing method according to  claim 18 , further comprising:
 forming a first insulation layer between the substrate and the first conductive layer, wherein the first insulation layer comprises a first region and a second region, the first region corresponds to the first portion, the second region corresponds to the second portion, and a thickness of the first region is greater than a thickness of the second region.   
     
     
         20 . The manufacturing method according to  claim 18 , further comprising:
 forming a second insulation layer such that the conductive layer is disposed between the first insulation layer and the second insulation layer.   wherein the second insulation layer comprises a third region and a fourth region, the third region corresponds to the first portion, the fourth region corresponds to the second portion, and a thickness of the fourth region is less than a thickness of the third region.