Semiconductor device, and semiconductor device mounting body

Abstract

A semiconductor device includes a semiconductor element and a first terminal electrically connected to the semiconductor element. The first terminal includes a first portion at least a portion of which extends in a first direction and a second portion extending in the first direction. The second portion overlaps with the first portion as viewed in a second direction orthogonal to the first direction. The first terminal may include a third portion connecting the first portion and the second portion. The third portion may protrude beyond the first portion and the second portion as viewed in the first direction. The second section may be spaced apart from the first section.

1 . A semiconductor device comprising:
 a semiconductor element; and   a first terminal electrically semiconductor element, connected to the   wherein the first terminal includes a first portion at least a portion of which extends in a first direction and a second portion extending in the first direction, and   the second portion overlaps with the first portion as viewed in a second direction orthogonal to the first direction.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the first terminal includes a third portion connecting the first portion and the second portion. 
     
     
         3 . The semiconductor device according to  claim 2 , wherein the third portion protrudes beyond the first portion and the second portion as viewed in the first direction. 
     
     
         4 . The semiconductor device according to  claim 2 , wherein the second portion is spaced apart from the first portion. 
     
     
         5 . The semiconductor device according to  claim 2 , wherein the first terminal includes a fourth portion located on a side opposite to the third portion in the first direction with respect to the second portion and connected to the second portion, and
 the fourth portion extends in the second direction toward a side opposite to the first portion.   
     
     
         6 . The semiconductor device according to  claim 1 , further comprising a sealing resin covering a portion of the first terminal and the semiconductor element,
 wherein the first portion extends from the sealing resin, and   the second portion is spaced apart from the sealing resin.   
     
     
         7 . The semiconductor device according to  claim 6 , wherein the sealing resin overlaps with the first portion and the second portion as viewed in the first direction. 
     
     
         8 . The semiconductor device according to  claim 6 , further comprising a second terminal extending in the first direction and including a portion covered with the sealing resin,
 wherein the second terminal is spaced apart from the first terminal in a third direction orthogonal to the first direction and the second direction,   the second terminal includes a first mounting portion extending from the sealing resin and a second mounting portion located on a side opposite to the sealing resin in the first direction with respect to the first mounting portion and connected to the first mounting portion, and   a dimension of the second mounting portion in the third direction is smaller than a dimension of the first mounting portion in the third direction.   
     
     
         9 . The semiconductor device according to  claim 8 , wherein the first mounting portion overlaps with the first portion as viewed in the third direction. 
     
     
         10 . The semiconductor device according to  claim 8 , wherein the first mounting portion includes a first edge extending in the third direction to be connected to the second mounting portion, and
 the second portion lies on both sides of the first edge in the first direction.   
     
     
         11 . The semiconductor device according to  claim 6 , further comprising a die pad,
 wherein the semiconductor element is electrically bonded to the die pad.   
     
     
         12 . The semiconductor device according to  claim 11 , wherein the first terminal is connected to the die pad. 
     
     
         13 . The semiconductor device according to  claim 11 , wherein the die pad includes a reverse surface facing opposite to the semiconductor element in the second direction, and
 the reverse surface is exposed from the sealing resin.   
     
     
         14 . A mounting body of a semiconductor device, the mounting body comprising:
 the semiconductor device according to  claim 6 ;   a wiring board including a substrate and a wiring disposed on the substrate; and   a bonding layer electrically bonding the wiring and the first terminal,   wherein the substrate includes a through-hole adjacent to the wiring and extending in the first direction through the substrate, and   a portion of the first portion and a portion of the second portion are accommodated in the through-hole.   
     
     
         15 . The mounting body according to  claim 14 , wherein the through-hole is a slotted hole extending in the second direction. 
     
     
         16 . The mounting body according to  claim 14 , wherein the first portion is located between the sealing resin and the second portion in the second direction. 
     
     
         17 . The mounting body according to  claim 14 , further comprising a heat dissipating member,
 wherein the heat dissipating member is attached to the sealing resin.