Waveform pressure-bonded package of a paper member

Abstract

A package is provided which is formed by, with a commodity sandwiched between single-faced corrugated paperboards that are vertically disposed paper members, pressure-bonding together the paper members at the edges of the paper members along the peripheral sides thereof. The edges of the single-faced corrugated paperboards along at least two opposed sides thereof are subjected to waveform bonding by pressure bonding such that a wave shape is formed in the thickness direction of the single-faced corrugated paperboards. The dimensional difference between (i) the length L1 of the portion of each paper member deflected by sandwiching a commodity, and (ii) the flat-bonding length (imaginary linear distance) L2 of a respective one of the edges extending parallel to the direction of the length L1, and each imaginarily bonded flat is absorbed by the waveform bonding, so that, at these edges, the vertical gaps between the single-faced corrugated paperboards are eliminated.

1 . A waveform pressure-bonded package comprising a paper member or paper members, and formed by:
 with an item to be packaged sandwiched between vertically disposed portions of the paper member that are vertically disposed, or sandwiched between the paper members that are vertically disposed,   pressure-bonding together the vertically disposed portions of the paper member or the paper members at edges of the paper member or the paper members along peripheral sides thereof,   wherein edges of the paper member or the paper members along at least two opposed sides thereof are subjected to waveform bonding by pressure bonding such that a wave shape is formed in a thickness direction of the paper member or the paper members, and   wherein a dimensional difference between (i) a length of each of deflected portions of the paper member or the paper members deflected by sandwiching an item to be packaged, and (ii) a flat-bonding length (imaginary linear distance) of a respective one of parallel-extending edges of the paper member or the paper members extending parallel to a direction of the length of the each of the deflected portions, and each imaginarily bonded flat by flat-bonding is absorbed by the waveform bonding, so that, at the parallel-extending edges, vertical gaps between the vertically disposed portions of the paper member, or between the paper members are eliminated.   
     
     
         2 . The waveform pressure-bonded package according to  claim 1 , wherein the paper members that are vertically disposed comprise two paper members having a first pair of opposed sides and a second pair of opposed sides. 
     
     
         3 . The waveform pressure-bonded package according to  claim 2 , wherein edges of the two paper members along one pair of the first pair of opposed sides and the second pair of opposed sides are subjected to the waveform bonding, and edges of the two paper members along the other pair of the first pair of opposed sides and the second pair of opposed sides are subjected to the flat-bonding. 
     
     
         4 . The waveform pressure-bonded package according to  claim 2 , wherein edges of the two paper members along all of four peripheral sides thereof are subjected to the waveform bonding. 
     
     
         5 . The waveform pressure-bonded package according to  claim 1 , wherein the vertically disposed portions of the paper member comprise portions of one paper member folded into two along a fold line, and
 wherein edges of the one paper member along two sides thereof that are orthogonal to the fold line and that are opposed to each other are subjected to the waveform bonding, and an edge of the one paper member along one side thereof that is opposed to the fold line is pressure-bonded by the flat-bonding.   
     
     
         6 . The waveform pressure-bonded package according to  claim 1 , wherein the paper member or each of the paper members is a single-faced corrugated paperboard comprising a corrugated medium forming a corrugated flute, and a linerboard bonded to one surface of the corrugated medium, and
 wherein with portions of the corrugated medium of the single-faced corrugated paperboard constituting the paper member opposed to each other, the single-faced corrugated paperboard is pressure bonded, or with the corrugated media of the single-faced corrugated paperboards constituting the paper members opposed to each other, the single-faced corrugated paperboards are pressure bonded together.   
     
     
         7 . A corrugated pressing member having a corrugated pressing surface configured such that when the waveform pressure-bonded package according to  claim 1  is formed, the corrugated pressing surface compresses the paper member or paper members so that an edge of the vertically disposed portions of the paper member, or an edge of the paper members that are vertically disposed is subjected to waveform bonding. 
     
     
         8 . The corrugated pressing member according to  claim 7 , comprising a rigid die body having a corrugated top surface; and
 a low-friction layer disposed on the top surface of the die body, wherein the low-friction layer is used as the pressing surface.   
     
     
         9 . The corrugated pressing member according to  claim 7 , comprising a rigid die body having a corrugated top surface;
 a cushion layer disposed on the top surface of the die body; and   a low-friction layer disposed on a surface of the cushion layer, wherein the low-friction layer is used as the pressing surface.   
     
     
         10 . A pressure-bonding device comprising an upper die and a lower die that are configured to move up and down; and
 opposed corrugated pressing members disposed, respectively on the upper die and the lower die so as to be opposed to each other, and each comprising the corrugated pressing member according to  claim 8 ,   wherein the pressure-bonding device is configured such that with the upper die and the lower die separated from each other, the vertically disposed portions of the paper member or the paper members that are vertically disposed are fed between the pressing surfaces of the opposed corrugated pressing members, an item to be packaged is sandwiched between the vertically disposed portions of the paper member or between the paper members, and the upper die and the lower die are moved toward each other until an edge of the paper member or the paper members is compressed by the pressing surfaces of the opposed corrugated pressing members, and is subjected to waveform bonding.   
     
     
         11 . A pressure-bonding device comprising an upper die and a lower die that are configured to move up and down; and
 opposed corrugated pressing members disposed, respectively on the upper die and the lower die so as to be opposed to each other, and each comprising the corrugated pressing member according to claim  9 ,   wherein the pressure-bonding device is configured such that with the upper die and the lower die separated from each other, the vertically disposed portions of the paper member or the paper members that are vertically disposed are fed between the pressing surfaces of the opposed corrugated pressing members, an item to be packaged is sandwiched between the vertically disposed portions of the paper member or between the paper members, and the upper die and the lower die are moved toward each other until an edge of the paper member or the paper members is compressed by the pressing surfaces of the opposed corrugated pressing members, and is subjected to waveform bonding.