Cooling panel and cooling device

Abstract

Cooling panel and cooling devices are provided in this application. The cooling panel includes a panel body and a plurality of heat dissipation columns. The plurality of heat dissipation columns is arranged at intervals on a surface of the panel body, and the plurality of heat dissipation columns is configured for heat exchange with a heat dissipation medium. In a flow direction of the heat dissipation medium, a spacing between adjacent heat dissipation columns of a part of the plurality of heat dissipation columns is less than a spacing between adjacent heat dissipation columns of another part of the plurality of heat dissipation columns. Flow velocity of the heat dissipation medium can be increased and contact area between the heat dissipation medium and the heat dissipation columns can be enlarged in the region where the spacing between the heat dissipation columns is smaller.

What is claimed is: 
     
         1 . A cooling panel comprising:
 a panel body, and   a plurality of heat dissipation columns, wherein the plurality of heat dissipation columns is arranged at intervals on a surface of the panel body, and the plurality of heat dissipation columns is configured for heat exchange with a heat dissipation medium, and   wherein in a flow direction of the heat dissipation medium, a spacing between adjacent heat dissipation columns of a part of the plurality of heat dissipation columns is less than a spacing between adjacent heat dissipation columns of another part of the plurality of heat dissipation columns.   
     
     
         2 . The cooling panel as claimed in  claim 1 , wherein, in the flow direction of the heat dissipation medium, spacings between each two adjacent heat dissipation columns of the plurality of heat dissipation columns gradually decreases. 
     
     
         3 . The cooling panel as claimed in  claim 2 , wherein, a range of variations in spacing between adjacent heat dissipation columns is 2.55 mm to 1 mm. 
     
     
         4 . The cooling panel as claimed in  claim 1 , wherein,
 the plurality of heat dissipation columns comprises a plurality of first heat dissipation columns and a plurality of second heat dissipation columns,   the plurality of first heat dissipation columns and the plurality of second heat dissipation columns are arranged in a plurality of lines in the flow direction of heat dissipation medium, and a distance between adjacent lines of the second heat dissipation columns is greater than a distance between adjacent lines of first heat dissipation columns;   a cross-sectional area of gaps between heat dissipation columns in each the plurality of lines is a cross-sectional area of a flow channel in the respective line, and the cross-sectional area of the flow channel in any line of the second heat dissipation columns is smaller than the cross-sectional area of the flow channel in any line of the first heat dissipation columns.   
     
     
         5 . The cooling panel as claimed in  claim 4 , wherein, a cross-sectional area of one first heat dissipation column is smaller than a cross-sectional area of one second heat dissipation column. 
     
     
         6 . The cooling panel as claimed in  claim 5 , wherein, in the flow direction of the heat dissipation medium, spacings between each two adjacent first heat dissipation columns of the plurality of first heat dissipation columns gradually decreases. 
     
     
         7 . The cooling panel as claimed in  claim 4 , wherein, a side of the board body that is away from the heat dissipation columns is configured to contact a plurality of heat sources arranged at intervals, and the second heat dissipation columns are arrange to correspond to gaps between adjacent heat sources of the plurality of heat sources. 
     
     
         8 . The cooling panel as claimed in  claim 1 , wherein, the plurality of heat dissipation columns is arranged in a plurality of lines, the heat dissipation columns of two adjacent lines of the plurality of lines are interlaced. 
     
     
         9 . A cooling device, comprising:
 at least one heat generating element,   a housing, and   a cooling panel, wherein the cooling panel comprises:
 a panel body, the at least one heat generating element is arranged on a side surface of the panel body away from the housing, and 
 a plurality of heat dissipation columns, wherein the plurality of heat dissipation columns is arranged at intervals on a surface of the panel body, the plurality of heat dissipation columns on the panel body are received in an inner cavity of the housing, and the plurality of heat dissipation columns is configured for heat exchange with a heat dissipation medium, and 
 in a flow direction of the heat dissipation medium, a spacing between adjacent heat dissipation columns of a part of the plurality of heat dissipation columns is less than a spacing between adjacent heat dissipation columns of another part of the plurality of heat dissipation columns, 
   the heat generating element is positioned at a side of the housing opposite to the cooling panel, the housing is detachably connected to the cooling panel, the plurality of heat dissipation columns is received in an inner cavity of the housing, the heat dissipation medium flows in the inner cavity of the housing.   
     
     
         10 . The cooling device as claimed in  claim 9 , wherein, a first hole and a second hole are defined on the housing, the first hole and the second hole are arranged at opposite sides of the housing respectively, the first hole is configured to import the heat dissipation medium, and the second hole is configured to export the heat dissipation medium. 
     
     
         11 . The cooling device as claimed in  claim 9 , wherein, in the flow direction of the heat dissipation medium, spacings between each two adjacent heat dissipation columns of the plurality of heat dissipation columns gradually decreases. 
     
     
         12 . The cooling device as claimed in  claim 11 , wherein, a range of variation in spacing between adjacent heat dissipation columns is 2.55 mm to 1 mm. 
     
     
         13 . The cooling device as claimed in  claim 9 , wherein,
 the plurality of heat dissipation columns comprises a plurality of first heat dissipation columns and a plurality of second heat dissipation columns,   the plurality of first heat dissipation columns and the plurality of second heat dissipation columns are arranged in a plurality of lines in the flow direction of heat dissipation medium, and a distance between adjacent lines of the second heat dissipation columns is greater than a distance between adjacent lines of first heat dissipation columns;   a cross-sectional area of gaps between heat dissipation columns in each the plurality of lines is a cross-sectional area of a flow channel in the respective line, and the cross-sectional area of the flow channel in any line of the second heat dissipation columns is smaller than the cross-sectional area of the flow channel in any line of the first heat dissipation columns.   
     
     
         14 . The cooling device as claimed in  claim 13 , wherein, a cross-sectional area of one first heat dissipation column is smaller than a cross-sectional area of one second heat dissipation column. 
     
     
         15 . The cooling device as claimed in  claim 14 , wherein, in the flow direction of the heat dissipation medium, spacings between each two adjacent first heat dissipation columns of the plurality of first heat dissipation columns gradually decreases. 
     
     
         16 . The cooling device as claimed in  claim 13 , wherein, the at least one heat generating element comprises a plurality of heat generating elements, the plurality of heat generating elements is arranged at intervals on the side surface of the panel body, the second heat dissipation columns are arranged to correspond to gaps between adjacent heat generating elements of the plurality of heat generating elements. 
     
     
         17 . The cooling device as claimed in  claim 9 , wherein, the plurality of heat dissipation columns is arranged in a plurality of lines, the heat dissipation columns of two adjacent lines of the plurality of lines are interlaced.