Systems and method for treating a substrate

Abstract

Disclosed herein is a pretreatment composition comprising a Group IVB metal in an amount of 200 ppm to 5.000 ppm based on total weight of the pretreatment composition, total fluoride in an amount of 1.000 ppm to 25.000 ppm based on total weight of the pretreatment composition and an electropositive metal. Also disclosed herein is a pretreatment composition comprising a Group IVB metal in an amount greater than 500 ppm based on total weight of the pretreatment composition and free fluoride in an amount of 50 ppm to 750 ppm based on total weight of the pretreatment composition, wherein the pretreatment composition has a pHI greater than 4. Also disclosed herein are systems and methods for treating a substrate. Also disclosed herein are treated substrates.

1 . A pretreatment composition comprising:
 a Group IVB metal present in an amount of 200 ppm to 5,000 ppm based on total weight of the pretreatment composition;   total fluoride in an amount of 1,000 ppm to 25,000 ppm based on total weight of the pretreatment composition; and   an electropositive metal comprising copper.   
     
     
         2 . The pretreatment composition of  claim 1 , wherein the pretreatment composition is substantially free of a second electropositive metal. 
     
     
         3 . The pretreatment composition of  claim 1 , wherein the pretreatment composition is substantially free of a third metal. 
     
     
         4 - 5 . (canceled) 
     
     
         6 . The pretreatment composition of  claim 1 , wherein copper is present in an amount of 2 ppm to 200 ppm based on total weight of the pretreatment composition. 
     
     
         7 . The pretreatment composition of  claim 1 , wherein the composition comprises a pH of 1 to 5. 
     
     
         8 . A pretreatment composition comprising:
 a Group IVB metal in an amount of greater than 500 ppm based on total weight of the pretreatment composition; and   free fluoride in an amount of 50 ppm to 750 ppm based on total weight of the pretreatment composition,   wherein the pretreatment composition has a pH greater than 4.   
     
     
         9 . The pretreatment composition of  claim 8 , further comprising a Group IIIB metal. 
     
     
         10 . The pretreatment composition of  claim 9 , wherein the Group IIIB metal is present in an amount of at least 10 ppm based on total weight of the pretreatment composition. 
     
     
         11 . The pretreatment composition of  claim 8 , wherein the Group IIIB metal comprises yttrium. 
     
     
         12 - 19 . (canceled) 
     
     
         20 . A method of treating a substrate, comprising contacting at least a portion of a surface of the substrate with the pretreatment composition of  claim 1 . 
     
     
         21 . The method of  claim 20 , wherein the method excludes contacting the substrate surface with a second pretreatment composition. 
     
     
         22 . (canceled) 
     
     
         23 . A system for treating a substrate comprising:
 a pretreatment composition of  claim 1 ; and   a cleaner composition and/or a film-forming resin.   
     
     
         24 . The system of  claim 23 , wherein the system excludes a second pretreatment composition. 
     
     
         25 . A system for treating a substrate comprising:
 a first pretreatment composition comprising a Group IVB metal and free fluoride; and   a second pretreatment composition comprising a Group IVB metal present in an amount of 200 ppm to 5,000 ppm based on total weight of the pretreatment composition, total fluoride in an amount of 1,000 ppm to 25,000 ppm based on total weight of the pretreatment composition, and an electropositive metal.   
     
     
         26 . The system of  claim 25 , wherein the second pretreatment composition comprises the electropositive metal in an amount of 2 ppm to 200 ppm, based on total weight of the second pretreatment composition. 
     
     
         27 . The system of  claim 25 , wherein the second pretreatment composition comprises a pH of 1 to 5. 
     
     
         28 . (canceled) 
     
     
         29 . A substrate comprising a film formed on at least a portion thereof, wherein the film is formed from the pretreatment composition of  claim 1 . 
     
     
         30 . A substrate comprising a film formed on at least a portion thereof, wherein the film is formed from the pretreatment composition of  claim 8 . 
     
     
         31 - 33 . (canceled) 
     
     
         34 . The substrate of  claim 30 , wherein the substrate comprises aluminum, steel, and/or magnesium. 
     
     
         35 - 40 . (canceled) 
     
     
         41 . A system for treating a substrate comprising:
 a pretreatment composition of  claim 8 ; and   a cleaner composition and/or a film-forming resin.   
     
     
         42 . A method for treating a substrate, comprising contacting at least a portion of a surface of the substrate with the pretreatment composition of  claim 8 .