Vapor chamber device
Abstract
A vapor chamber device includes a first casing, a first capillary structure, and a second casing. The first casing includes a first plate portion, multiple first protrusions, and a first side wall. The first capillary structure is disposed above an inner surface of the first plate portion and surrounds the first protrusions. The second casing is stacked on the first casing, and the second casing includes a second plate portion, multiple second protrusions, and a second side wall. The first side wall is connected to the second side wall, and multiple steam passages are formed between the second protrusions. The second plate portion includes multiple connecting regions yielded by the second protrusions, and the first protrusions are connected to the connecting regions. The second protrusions rest against the first capillary structure.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A vapor chamber device adapted to be thermally coupled to a heat source, the vapor chamber device comprising:
a first casing comprises a first plate portion, a plurality of first protrusions protruding from an inner surface of the first plate portion, and a first side wall protruding from the inner surface and surrounding the first protrusions, wherein the heat source is adapted to contact an outer surface of the first plate portion; a first capillary structure disposed above the inner surface of the first plate portion and surrounding the first protrusions; and a second casing stacked on the first casing, the second casing comprising a second plate portion, a plurality of second protrusions protruding from the second plate portion, and a second side wall protruding from the second plate portion and surrounding the second protrusions, wherein the first side wall is connected to the second side wall, a plurality of steam passages are formed between the second protrusions, the second plate portion comprises a plurality of connecting regions yielded by the second protrusions, the first protrusions are connected to the connecting regions, and the second protrusions rest against the first capillary structure.
2 . The vapor chamber device according to claim 1 , wherein a number of the second protrusions is greater than a number of the first protrusions, and a size of the first protrusion is greater than a size of the second protrusion.
3 . The vapor chamber device according to claim 1 , wherein a difference value between a height of the first protrusion protruding from the first plate portion and a height of the second protrusion protruding from the second plate portion is a height of a capillary layer.
4 . The vapor chamber device according to claim 1 , wherein each of the first protrusions is columnar or strip-shaped, and the first protrusions are evenly distributed on the inner surface.
5 . The vapor chamber device according to claim 1 , wherein the second protrusions comprise a plurality of first support columns and a plurality of second support columns, a shape of the first support columns is different from a shape of the second support columns, the first support columns are disposed at positions corresponding to the heat source, and the second support columns are located next to the first support columns and extend in an axial direction.
6 . The vapor chamber device according to claim 1 , wherein a part of the second protrusions is disposed at a position corresponding to the heat source, and the other part of the second protrusions is arranged radially around the part.
7 . The vapor chamber device according to claim 1 , wherein the first capillary structure is a mesh structure woven by a plurality of wires, a non-woven mesh structure, or a metal foam layer, and sintered metal powder, and the first capillary structure comprises a plurality holes.
8 . The vapor chamber device according to claim 1 , wherein the first casing comprises a second capillary structure protruding integrally from the inner surface of the first plate portion, the second capillary structure comprises a plurality of grooves formed between a plurality of convex bars to serve as fluid channels, and the first capillary structure is disposed between the second capillary structure and the second protrusions of the second casing.
9 . The vapor chamber device according to claim 8 , wherein at least a part of the grooves are radially arranged.
10 . The vapor chamber device according to claim 9 , wherein the first protrusions and at least a part of the convex bars are radially arranged together.
11 . The vapor chamber device according to claim 8 further comprising a third capillary structure filled in the grooves in regions corresponding to the heat source, and the third capillary structure comprises metal powder, non-woven metal wool, or nanostructures.
12 . The vapor chamber device according to claim 1 further comprising a plurality of extended capillary layers extending from the first capillary structure and integrated with the first capillary structure, and the extended capillary layers surround the first protrusions.
13 . The vapor chamber device according to claim 8 further comprising a plurality of extended capillary layers extending from the first capillary structure and integrated with the first capillary structure, and the extended capillary layers surround the first protrusions.
14 . The vapor chamber device according to claim 11 further comprising a plurality of extended capillary layers extending from the first capillary structure and integrated with the first capillary structure, and the extended capillary layers surround the first protrusions.
15 . The vapor chamber device according to claim 1 , wherein one of the first side wall and the second side wall comprises a ring-shaped convex bar, the ring-shaped convex bar surrounds corresponding first protrusions or second protrusions, and the other one of the first side wall and the second side wall comprises a ring-shaped groove surrounding corresponding first protrusions or second protrusions, and the ring-shaped convex bar is embedded in the ring-shaped groove.
16 . The vapor chamber device according to claim 15 , wherein the first side wall and the second side wall have a sealing region at edges, the sealing region seals the edges of the first side wall and the second side wall by pinching, diffusion bonding, brazing, soldering, laser welding, or arc welding, and the sealing region surrounds or covers the ring-shaped convex bar and the ring-shaped groove.
17 . The vapor chamber device according to claim 1 , wherein the first side wall and the second side wall have a sealing region at edges, and the sealing region seals the edges of the first side wall and the second side wall by pinching, diffusion bonding, brazing, soldering, laser welding, or arc welding.
18 . The vapor chamber device according to claim 8 , wherein the first side wall and the second side wall have a sealing region at edges, and the sealing region seals the edges of the first side wall and the second side wall by pinching, diffusion bonding, brazing, soldering, laser welding, or arc welding.
19 . The vapor chamber device according to claim 11 , wherein the first side wall and the second side wall have a sealing region at edges, and the sealing region seals the edges of the first side wall and the second side wall by pinching, diffusion bonding, brazing, soldering, laser welding, or arc welding.
20 . The vapor chamber device according to claim 1 , wherein a material of the first casing and the second casing comprises aluminum or aluminum alloy.Join the waitlist — get patent alerts
Track US2024344773A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.