Method, Apparatus, Equipment for Accurately Adjusting ADC Camera and Computer Storage Medium

Abstract

A method for accurately adjusting an automatic diameter control (ADC) camera includes before pulling a monocrystalline silicon ingot, obtaining a height variation value of an ADC camera from a solid-liquid interface of a melt by separately comparing variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and a previous monocrystalline silicon ingot. Based on a geometric relationship between the height variation value and a horizontal displacement of the ADC camera, a horizontal displacement of the ADC camera is obtained according to the height variation value, wherein the horizontal displacement is a first horizontal displacement or a second horizontal displacement. The method also includes moving the ADC camera horizontally to a target position according to the horizontal displacement of the ADC camera.

1 . A method for accurately adjusting an automatic diameter control (ADC) camera, comprising:
 before pulling a monocrystalline silicon ingot, obtaining a height variation value of an ADC camera from a solid-liquid interface of a melt by separately comparing variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and a previous monocrystalline silicon ingot;   based on a geometric relationship between the height variation value and a horizontal displacement of the ADC camera, obtaining a horizontal displacement of the ADC camera according to the height variation value, wherein the horizontal displacement is a first horizontal displacement or a second horizontal displacement; and   moving the ADC camera horizontally to a target position according to the horizontal displacement of the ADC camera.   
     
     
         2 . The method according to  claim 1 , wherein the variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and the previous monocrystalline silicon ingot include:
 a height variation of a thermal insulation cover plate in a monocrystalline puller, a length variation of a thermal shield, and a melt gap variation of the melt between pulling the monocrystalline silicon ingot and the previous monocrystalline silicon ingot.   
     
     
         3 . The method according to  claim 2 , wherein obtaining the height variation value of the ADC camera from the solid-liquid interface of the melt comprises:
 obtaining a height variation value Δh 1  of the thermal insulation cover plate, a length variation value Δh 2  of the thermal shield and a melt gap variation value Δh 3  of the melt respectively, by comparing the variations of the thermal field accessories provided corresponding to the monocrystalline silicon ingot and the previous monocrystalline silicon ingot; and wherein   when pulling the monocrystalline silicon ingot, according to the height variation value Δh 1  of the thermal insulation cover plate, the length variation value Δh 2  of the thermal shield and the melt gap variation value Δh 3  of the melt, obtaining the height variation value ΔH=Δh 1 +Δh 2 +Δh 3  of the ADC camera from the solid-liquid interface of the melt.   
     
     
         4 . The method according to  claim 3 , wherein obtaining the horizontal displacement of the ADC camera based on the height variation value comprises:
 based on a geometric relationship between the height variation value and a first horizontal displacement of the ADC camera, obtaining a first correspondence relationship between the height variation value ΔH and the first horizontal displacement ΔX 1  of the ADC camera: ΔX 1 =ΔH×tan θ, wherein θ represents an angle between a monitoring line of sight of the ADC camera and an outer wall of the monocrystalline silicon ingot in a vertical direction; and   according to the first correspondence relationship and the height variation value ΔH, obtaining the first horizontal displacement ΔX 1  of the ADC camera.   
     
     
         5 . The method according to  claim 3 , wherein obtaining the horizontal displacement of the ADC camera according to the height variation value comprises:
 when the ADC camera pivoted by an angle Δθ in a horizontal direction, based on a geometric relationship between the height variation value and the second horizontal displacement of the ADC camera, obtaining a second correspondence relationship between the height variation value ΔH and the second horizontal displacement ΔX 2  of the ADC camera: ΔX 2 =ΔH×tan (θ+Δθ); and   obtaining the second horizontal displacement of the ADC camera according to the second correspondence relationship and the height variation value.   
     
     
         6 . The method according to  claim 4 , wherein moving the ADC camera horizontally to the target position according to the horizontal displacement of the ADC camera comprises
 moving the ADC camera to the target position horizontally according to the first horizontal displacement or the second horizontal displacement of the ADC camera.   
     
     
         7 . An apparatus for accurately adjusting an ADC camera, comprising: a first obtaining portion, a second obtaining portion and a moving portion;
 wherein the first obtaining portion is configured to, before pulling a monocrystalline silicon ingot, obtain a height variation value of an ADC camera from a solid-liquid interface of a melt, by separately comparing variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and a previous monocrystalline silicon ingot;   the second obtaining portion is configured to, based on a geometric relationship between the height variation value and a horizontal displacement of the ADC camera, obtain a horizontal displacement of the ADC camera according to the height variation value, wherein the horizontal displacement is a first horizontal displacement or a second horizontal displacement;   the moving portion is configured to move the ADC camera to a target position horizontally according to the horizontal displacement of the ADC camera.   
     
     
         8 . Equipment for accurately adjusting an ADC camera, comprising: a communication interface, a memory and a processor, which are coupled together by a bus system;
 wherein the communication interface is configured to receive and send signals during a process of receiving and sending information with other external network elements;   the memory is configured to store one or more computer programs executed on the processor;   the processor is configured to execute the one or more computer programs to perform;   before pulling a monocrystalline silicon ingot, obtaining a height variation value of an ADC camera from a solid-liquid interface of a melt by separately comparing variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and a previous monocrystalline silicon ingot;   based on a geometric relationship between the height variation value and a horizontal displacement of the ADC camera, obtaining a horizontal displacement of the ADC camera according to the height variation value, wherein the horizontal displacement is a first horizontal displacement or a second horizontal displacement; and   controlling to move the ADC camera to a target position horizontally according to the horizontal displacement of the ADC camera.   
     
     
         9 . A computer storage medium, comprising a program for accurately adjusting an ADC camera stored therein; wherein the program for accurately adjusting the ADC camera is executed by at least one processor to implement the method according to  claim 1 . 
     
     
         10 . A computer program product stored in a non-volatile storage medium, wherein the computer program product, when executed by at least one processor, implements the method according to  claim 1 . 
     
     
         11 . The equipment according to  claim 8 , wherein the variations of thermal field accessories provided corresponding to the monocrystalline silicon ingot and a previous monocrystalline silicon ingot comprise:
 a height variation of a thermal insulation cover plate in a monocrystalline puller, a length variation of a thermal shield, and a melt gap variation of the melt when pulling the monocrystalline silicon ingot and the previous monocrystalline silicon ingot.   
     
     
         12 . The equipment according to  claim 11 , wherein before pulling a monocrystalline silicon ingot, when obtaining the height variation value of the ADC camera from the solid-liquid interface of the melt, the processor is configured to execute the one or more computer programs to perform:
 obtaining a height variation value Δh 1  of the thermal insulation cover plate, a length variation value Δh 2  of the thermal shield and a melt gap variation value Δh 3  of the melt respectively, by comparing the variations of the thermal field accessories provided corresponding to the monocrystalline silicon ingot and the previous monocrystalline silicon ingot; and   when pulling the monocrystalline silicon ingot, according to the height variation value Δh 1  of the thermal insulation cover plate, the length variation value Δh 2  of the thermal shield and the melt gap variation value Δh 3  of the melt, obtaining the height variation value ΔH=Δh 1 +Δh 2 +Δh 3  of the ADC camera to the solid-liquid interface of the melt.   
     
     
         13 . The equipment according to  claim 12 , wherein the processor is configured to execute the one or more computer program to obtain the horizontal displacement of the ADC camera based on the height variation value by:
 based on a geometric relationship between the height variation value and a first horizontal displacement of the ADC camera, obtaining a first correspondence relationship between the height variation value ΔH and the first horizontal displacement ΔX 1  of the ADC camera: ΔX 1 =ΔH×tan θ, wherein θ represents an angle between a monitoring line of sight of the ADC camera and an outer wall of the monocrystalline silicon ingot in a vertical direction; and   according to the first correspondence relationship and the height variation value ΔH, obtaining the first horizontal displacement ΔX 1  of the ADC camera.   
     
     
         14 . The equipment according to  claim 12 , wherein, when the processor is further configured to execute the one or more computer programs to obtain the horizontal displacement of the ADC camera according to the height variation value by:
 when the ADC camera pivoted by an angle  40  in a horizontal direction, based on a geometric relationship between the height variation value and the second horizontal displacement of the ADC camera, obtaining a second correspondence relationship between the height variation value ΔH and the second horizontal displacement ΔX 2  of the ADC camera: ΔX 2 =ΔH×tan (θ+Δθ); and   obtaining the second horizontal displacement of the ADC camera according to the second correspondence relationship and the height variation value.   
     
     
         15 . The equipment according to  claim 13 , wherein when moving the ADC camera horizontally to the target position according to the horizontal displacement of the ADC camera, the processor is further configured to execute the one or more computer programs to perform:
 controlling to move the ADC camera to the target position horizontally according to the first horizontal displacement or the second horizontal displacement of the ADC camera.