Printed circuit board assembly

Abstract

A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.

1 . A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, a potting compound being provided, which covers the printed circuit board and contacts the gap filler. 
     
     
         2 . The printed circuit board assembly according to  claim 1 , wherein the electronic component is fastened to the bearing surface by means of the gap filler. 
     
     
         3 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is adhesive so that the printed circuit board is bonded onto the bearing surface via the electronic component by means of the gap filler. 
     
     
         4 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is thermally conductive and in that the electronic component is connected to the housing in a thermally conductive manner. 
     
     
         5 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is elastic so that the gap filler acts as a mechanical damper. 
     
     
         6 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is made of an elastomer. 
     
     
         7 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is made of a thermoset material. 
     
     
         8 . The printed circuit board assembly according to  claim 7 , wherein the gap filler is made of a polyurethane or an epoxide. 
     
     
         9 . The printed circuit board assembly according to  claim 1 , wherein the gap filler is provided with a thermally conductive additive. 
     
     
         10 . The printed circuit board assembly according to  claim 9 , wherein the thermally conductive additive is a ceramic powder or a mineral material. 
     
     
         11 . The printed circuit board assembly according to  claim 1 , wherein the potting compound completely covers an upper side of the printed circuit board, which is opposite to a lower side of the printed circuit board to which the electronic component is fastened. 
     
     
         12 . The printed circuit board assembly according to  claim 1 , wherein the potting compound seals the electronic component to the outside. 
     
     
         13 . The printed circuit board assembly according to  claim 1 , wherein the housing is formed in a pot shape and has a housing bottom and sidewalls. 
     
     
         14 . The printed circuit board assembly according to  claim 13 , wherein the bearing surface is parallel to the housing bottom. 
     
     
         15 . The printed circuit board assembly according to  claim 13 , wherein the housing has a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, the bearing surface being formed on the shoulder portion. 
     
     
         16 . The printed circuit board assembly according to  claim 1 , wherein the printed circuit board is mounted in the housing spaced apart from the sidewalls. 
     
     
         17 . A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, and wherein the gap filler is electrically non-conductive. 
     
     
         18 . The printed circuit board assembly according to  claim 17 , wherein a potting compound is provided, which covers the printed circuit board and contacts the gap filler. 
     
     
         19 . A printed circuit board assembly for a field bus device, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board, the printed circuit board being arranged in the housing, wherein the housing is formed in a pot shape and has a housing bottom and sidewalls, and the housing having at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler, wherein the housing has a shoulder portion which is provided in a transition area from the housing bottom to at least one of the sidewalls, the bearing surface being formed on the shoulder portion such that the bearing surface is parallel to the housing bottom. 
     
     
         20 . The printed circuit board assembly according to  claim 19 , wherein a potting compound is provided, which covers the printed circuit board and contacts the gap filler.