Polishing pad and manufacturing method of polishing pad and polishing method

Abstract

A polishing pad is provided. The polishing pad includes a polishing layer and at least one detection window. The at least one detection window is located in the polishing layer. The at least one detection window includes a center portion and a cover portion surrounding the center portion. The cover portion is joined to the polishing layer, and a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00.

What is claimed is: 
     
         1 . A polishing pad, comprising:
 a polishing layer; and   at least one detection window, located in the polishing layer, wherein the at least one detection window comprises a center portion and a cover portion surrounding the center portion, the cover portion is joined to the polishing layer, and a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00.   
     
     
         2 . The polishing pad according to  claim 1 , wherein a top surface of the center portion, a top surface of the cover portion, and a top surface of the polishing layer are all coplanar. 
     
     
         3 . The polishing pad according to  claim 1 , wherein a bottom surface of the center portion, a bottom surface of the cover portion, and a bottom surface of the polishing layer are all coplanar. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the center portion and the cover portion are in direct contact. 
     
     
         5 . The polishing pad according to  claim 1 , wherein a ratio of a hardness of the center portion to a hardness of the cover portion is not greater than about 1.8. 
     
     
         6 . The polishing pad according to  claim 1 , wherein the center portion is made of a first material, the cover portion is made of a second material, and the first material is different from the second material. 
     
     
         7 . The polishing pad according to  claim 6 , wherein the polishing layer is made of a third material, and the third material and the second material are a same material. 
     
     
         8 . The polishing pad according to  claim 6 , wherein the polishing layer is made of a third material, and the third material and the second material are different materials. 
     
     
         9 . The polishing pad according to  claim 6 , wherein the first material is a light-transmitting material under visible light. 
     
     
         10 . The polishing pad according to  claim 1 , wherein an outer contour of the center portion has a same shape as an outer contour of the cover portion. 
     
     
         11 . The polishing pad according to  claim 1 , wherein an outer contour of the center portion and an outer contour of the cover portion have different shapes. 
     
     
         12 . The polishing pad according to  claim 1 , wherein a shape of an outer contour of the cover portion is an irregular shape or a regular geometric shape. 
     
     
         13 . The polishing pad according to  claim 1 , wherein a shape of an outer contour of the center portion is an irregular shape or a regular geometric shape. 
     
     
         14 . The polishing pad according to  claim 1 , wherein a side surface of the center portion is a rough surface. 
     
     
         15 . The polishing pad according to  claim 1 , wherein a side surface of the cover portion is a rough surface. 
     
     
         16 . The polishing pad according to  claim 1 , further comprising a base layer configured below the polishing layer. 
     
     
         17 . A manufacturing method of a polishing pad, comprising:
 forming a detection window, comprising:
 pre-disposing a center portion in a first mold; and 
 filling the first mold with a covering material and performing a first curing process to form a cover portion covering the center portion; 
   pre-disposing the detection window in the second mold; and   filling a polishing layer material into the second mold and performing a second curing process to form a polishing layer joined to the cover portion.   
     
     
         18 . The manufacturing method of a polishing pad according to  claim 17 , wherein a top surface of the center portion, a top surface of the cover portion, and a top surface of the polishing layer are all coplanar. 
     
     
         19 . The manufacturing method of a polishing pad according to  claim 17 , wherein a bottom surface of the center portion, a bottom surface of the cover portion, and a bottom surface of the polishing layer are all coplanar. 
     
     
         20 . The manufacturing method of a polishing pad according to  claim 17 , wherein the center portion and the cover portion are in direct contact. 
     
     
         21 . The manufacturing method of a polishing pad according to  claim 17 , wherein a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00. 
     
     
         22 . The manufacturing method of a polishing pad according to  claim 17 , wherein a ratio of a hardness of the center portion to a hardness of the cover portion is not greater than about 1.8. 
     
     
         23 . The manufacturing method of a polishing pad according to  claim 17 , wherein the covering material is the same as the polishing layer material. 
     
     
         24 . The manufacturing method of a polishing pad according to  claim 17 , wherein the covering material is different from the polishing layer material. 
     
     
         25 . The manufacturing method of a polishing pad according to  claim 17 , wherein the center portion has a predetermined outer contour shape, and the outer contour shape is an irregular shape or a regular geometric shape. 
     
     
         26 . The manufacturing method of a polishing pad according to  claim 25 , wherein the method of forming the center portion comprises injecting a light-transmitting material into a third mold and performing a third curing process. 
     
     
         27 . The manufacturing method of a polishing pad according to  claim 26 , wherein the method of forming the center portion further comprises removing part of the center portion to form the predetermined outer contour shape. 
     
     
         28 . The manufacturing method of a polishing pad according to  claim 26 , wherein the covering material is different from the light-transmitting material. 
     
     
         29 . The manufacturing method of a polishing pad according to  claim 26 , wherein the light-transmitting material is light-transmissive under visible light. 
     
     
         30 . The manufacturing method of a polishing pad according to  claim 26 , wherein the first curing process, the second curing process, and the third curing process respectively comprise an illuminating process, a heating process, a pressurizing process, or a resting process. 
     
     
         31 . The manufacturing method of a polishing pad according to  claim 26 , wherein an outer contour of the first mold is the same as an outer contour of the third mold. 
     
     
         32 . The manufacturing method of a polishing pad according to  claim 26 , wherein an outer contour of the first mold is different from an outer contour of the third mold. 
     
     
         33 . The manufacturing method of a polishing pad according to  claim 26 , wherein forming the detection window further comprises removing part of the cover portion to form a predetermined shape. 
     
     
         34 . The manufacturing method of a polishing pad according to  claim 33 , wherein the predetermined shape is an irregular shape or a regular geometric shape. 
     
     
         35 . A polishing method, comprising:
 providing a polishing pad, wherein the polishing pad is the polishing pad according to  claim 1 ;   applying pressure to an object to press onto the polishing pad; and   providing relative movement between the object and the polishing pad to perform a polishing process.