Cooling systems and methods using two circuits with water flow in a counter flow and in a series or parallel arrangement

Abstract

The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

What is claimed is: 
     
         1 . A cooling system comprising:
 a first evaporator coil in thermal communication with an air intake flow to a heat load;   a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit;   a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow to the heat load;   a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit;   a water circuit in thermal communication with the first fluid circuit and second fluid circuit; and   a chiller circuit in thermal communication with the water circuit.   
     
     
         2 . The cooling system according to  claim 1 , wherein the first and second evaporator coils are microchannel evaporator coils. 
     
     
         3 . The cooling system according to  claim 1 , wherein the chiller loop includes a trim condenser having a first side and a second side, an ACS evaporator having a first side and a second side, the first side of the ACS evaporator being in fluid communication with the first side of the trim condenser, and a compressor in fluid communication with the fluid output of the first side of the ACS evaporator and with the fluid input of the first side of the trim condenser,
 wherein the first fluid circuit includes a first main condenser having a first side and a second side, a first fluid receiver in fluid communication with the first side of the first main condenser, and a refrigerant pump in fluid communication with the first fluid receiver, the second side of the first main condenser being in fluid communication with the second side of the ACS evaporator,   wherein the second fluid circuit includes a second main condenser having a first side and a second side, a second fluid receiver in fluid communication with the first side of the second main condenser, and a refrigerant pump in fluid communication with the second fluid receiver, the second side of the second main condenser being in fluid communication with the second side of the first main condenser and the water circuit, and   wherein the water circuit is in fluid communication with the second side of the trim condenser.   
     
     
         4 . The cooling system according to  claim 3 , wherein chilled water from the ACS evaporator is in thermal communication with the first and second fluid circuits, and
 wherein the chilled water and the refrigerant flowing through the first and second fluid circuits are in thermal counter flow.   
     
     
         5 . The cooling system according to  claim 3 , wherein the water flow through the trim condenser and the water flow through the ACS evaporator, the first main condenser, and the second main condenser, are in a series or in a parallel arrangement.