Recycle grinding device

Abstract

A recycle grinding device is provided. A grinding device for cleaning probes includes a placement platform and a grinding block. The grinding block is located in the placement space. The grinding block includes a base layer and a grinding layer. The grinding layer covers the base layer and is integrally formed with the base layer, wherein the thickness of the grinding layer is greater than or equal to 1 millimeter. Therefore, the invention provides users with convenient cleaning, reduced replacement frequency, and improved performance and quality.

What is claimed is: 
     
         1 . A recycle grinding device, comprising:
 a placement platform, having a placement space; and   a grinding block, located in the placement space, the grinding block comprising a base layer and a grinding layer, wherein the grinding layer is sintered to be formed on the base layer, and a thickness of the grinding layer is greater than or equal to 1 millimeter (mm).   
     
     
         2 . The recycle grinding device according to  claim 1 , wherein the thickness of the grinding layer is between 1 mm and 10 mm. 
     
     
         3 . The recycle grinding device according to  claim 1 , wherein a grinding particle granularity of the grinding layer is between #1000 and #5000. 
     
     
         4 . The recycle grinding device according to  claim 3 , wherein the grinding layer comprises a plurality of grinding particles, and the grinding particle diameter of the plurality of grinding particles is between 0.00321 mm and 0.016 mm. 
     
     
         5 . The recycle grinding device according to  claim 1 , wherein the grinding layer is made of silicon carbide or diamond. 
     
     
         6 . The recycle grinding device according to  claim 1 , wherein the grinding layer is sintered on the base layer at a predetermined temperature, and the grinding layer formed by sintering forms a grinding surface and a first welded surface that are opposite to each other; the base layer has a second welded surface and a bottom surface, and the first welded surface is bonded to the second welded surface after sintering formation. 
     
     
         7 . The recycle grinding device according to  claim 6 , wherein a parallelism between the grinding surface and the bottom surface of the base layer is less than or equal to 0.0003 (m/m). 
     
     
         8 . The recycle grinding device according to  claim 1 , wherein the placement platform further comprises a driving transmission mechanism, on which the grinding block is located, so as to control a movement of the grinding block through the driving transmission mechanism. 
     
     
         9 . The recycle grinding device according to  claim 1 , wherein the placement platform is provided with a plurality of first positioning members, and both ends of the plurality of first positioning members are a fixed end and an inserted end; the fixed end is located on a surface of the placement space, and the fixed end protrudes outward to form the inserted end; a position of a bottom surface of the base layer corresponding to the plurality of first positioning members is provided with a plurality of first positioning holes, the inserted end is inserted in the first positioning hole, and the bottom surface of the base layer is adjacent to the fixed end for positioning the grinding block on the placement platform. 
     
     
         10 . The recycle grinding device according to  claim 1 , wherein the placement platform is provided with a plurality of second positioning members, and a side wall of the base layer corresponding to the plurality of second positioning members is provided with a plurality of second positioning holes, and the plurality of second positioning members are locked in the plurality of second positioning holes for positioning the grinding block on the placement platform. 
     
     
         11 . The recycle grinding device according to  claim 1 , wherein the placement space is recessed on the placement platform, and an inner side wall of the placement space is provided with a protrusion; the base layer is provided with a groove, and the protrusion in the placement space is engaged with the groove for positioning and placing the grinding block in the placement space.