Heat Pipe for Preventing Icing Expansion

Abstract

A heat pipe includes a pipe body having a sealed cavity. A heat transfer medium and a capillary structure are disposed in the sealed cavity. The pipe body includes a first additional pipe section and a main pipe section including an evaporation section, a heat insulation section, and a condensation section. The first additional pipe section, where a first additional cavity is disposed, is connected to an end part of the evaporation section. The first additional cavity is used to accommodate all or a part of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, and when the heat pipe is mounted on a heat dissipation device that requires heat dissipation, the first additional pipe section is not in contact with a heat emitting component of the heat dissipation device.

What is claimed is: 
     
         1 . A heat pipe comprising:
 a pipe body comprising:
 a sealed cavity comprising, a capillary structure and a heat transfer medium; 
 a main pipe section comprising a heat exchange cavity, wherein the main pipe section is sequentially divided, in a length direction, into an evaporation section comprising a first end part, a heat insulation section, and a condensation section, and wherein the capillary structure is located in the heat exchange cavity; and 
 a first additional pipe section comprising a first additional cavity, wherein the first additional pipe section is connected to the first end part, wherein the first additional cavity is configured to accommodate a portion of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, wherein the portion is all or a part of the heat transfer medium, and wherein the first additional pipe section is configured to not be in contact with a heat emitting component of a heat producing device when the heat pipe is mounted on the heat producing device. 
   
     
     
         2 . The heat pipe of  claim 1 , wherein the first additional cavity is further configured to accommodate, when the heat pipe is vertically placed and the first additional pipe section is located below the gravity direction, all heat transfer media that fail to be maintained inside the capillary structure. 
     
     
         3 . The heat pipe of  claim 1 , wherein the pipe body further comprises a second additional pipe section comprising a second additional cavity, wherein condensation section comprises a second end part connected to the second additional pipe section and wherein the second additional cavity is configured to accommodate, when the heat pipe is vertically placed and the second additional pipe section is located below the gravity direction, the portion of the heat transfer medium. 
     
     
         4 . The heat pipe of  claim 1 , wherein a first cross-sectional area of the first additional cavity is greater than a second cross-sectional area of the heat exchange cavity. 
     
     
         5 . The heat pipe of  claim 1 , wherein the first additional pipe section is bent towards one side relative to the evaporation section to form an included angle between the first additional pipe section and the evaporation section. 
     
     
         6 . The heat pipe of  claim 1 , wherein the capillary structure extends into the first additional cavity. 
     
     
         7 . The heat pipe of  claim 1 , wherein the first additional pipe section comprises an end pipe section and a transition pipe section, wherein the end pipe section is connected to the evaporation section through the transition pipe section, wherein the evaporation section is a flat pipe, and wherein the end pipe section is a circular pipe. 
     
     
         8 . The heat pipe of  claim 1 , wherein the heat insulation section is a bent pipe section capable of elastic deformation. 
     
     
         9 . The heat pipe of  claim 1 , wherein the capillary structure is a wick, and wherein the wick is attached to an inner wall of the pipe body. 
     
     
         10 . A heat dissipation device comprising:
 a circuit board;   a heat emitter disposed on the circuit board; and   a heat dissipator configured to dissipate heat for the heat emitter, wherein the heat dissipator comprises:
 a first heat sink; 
 a second heat sink; and 
   a heat pipe comprising a pipe body, wherein the pipe body comprises:   a sealed cavity, wherein the sealed cavity comprises a capillary structure and a heat transfer medium;   a main pipe section comprising a heat exchange cavity, wherein the main pipe section is sequentially divided, in a length direction, into an evaporation section connected to the first heat sink, a heat insulation section, and a condensation section connected to the second heat sink, wherein the evaporation section comprises a first end part, and wherein the capillary structure is located in the heat exchange cavity of the main pipe section; and   a first additional pipe section comprising a first additional cavity, wherein the first additional pipe section is connected to the first end part, wherein the first additional cavity is configured to accommodate a portion of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, wherein the portion is all or a part of the heat transfer medium, wherein the first additional pipe section is spaced apart from and is not in contact with the first heat sink and the second heat sink, and wherein the first additional pipe section is configured to not be in contact with a heat emitting component of a heat producing device when the heat pipe is mounted on the heat producing device.   
     
     
         11 . The heat dissipation device of  claim 10 , wherein the first heat sink comprises a first substrate and a first fin, wherein the first fin is disposed on the first substrate, wherein the evaporation section is attached to the first substrate, wherein the second heat sink comprises a second substrate and a second fin, wherein the second fin is disposed on the second substrate, and wherein the condensation section is attached to the second substrate. 
     
     
         12 . The heat dissipation device of  claim 10 , further comprising a plurality of heat emitting components, wherein the first heat sink is connected to a first set of the heat emitting components of the plurality of heat emitting components, and wherein the second heat sink is connected to the other a second set of the heat emitting components of the plurality of heat emitting components. 
     
     
         13 . The heat dissipation device of  claim 10 , wherein the heat dissipation device further comprises a heat dissipation fan configured to dissipate heat for the heat dissipator. 
     
     
         14 . The heat dissipation device of  claim 10 , further comprising a plurality of heat dissipators and a plurality of heat emitting components, wherein the plurality of heat dissipators are configured to dissipate heat for the plurality of heat emitting components. 
     
     
         15 . The heat dissipation device of  claim 10 , wherein when the heat pipe is vertically placed and the first additional pipe section is located below the gravity direction, the first additional cavity is further configured to accommodate all heat transfer media that fail to be maintained inside the capillary structure. 
     
     
         16 . The heat dissipation device of  claim 10 , wherein the pipe body further comprises a second additional pipe section, wherein the condensation section comprises a second end part connected to the second additional pipe section, and wherein the second additional pipe section comprise a second additional cavity configured to accommodate the portion of the heat transfer medium when the heat pipe is vertically placed and the second additional pipe section is located below the gravity direction. 
     
     
         17 . The heat dissipation device of  claim 10 , wherein a first cross-sectional area of the first additional cavity is greater than a second cross-sectional area of the heat exchange cavity. 
     
     
         18 . The heat dissipation device of  claim 10 , wherein the first additional pipe section is bent towards one side relative to the evaporation section, to form an included angle between the first additional pipe section and the evaporation section. 
     
     
         19 . The heat dissipation device of  claim 10 , wherein the capillary structure extends into the first additional cavity. 
     
     
         20 . A heat dissipation device, comprising:
 a heat emitter;   a heat dissipator; and   a heat pipe comprising a pipe body, wherein the pipe body comprises:
 a sealed cavity, 
   wherein the sealed cavity comprises a capillary structure and a heat transfer medium are disposed in the sealed cavity;
 a main pipe section comprising a heat exchange cavity, wherein the main pipe section is sequentially divided, in a length direction, into an evaporation section comprising a first end part, a heat insulation section, and a condensation section, 
   wherein, the capillary structure is located in heat exchange cavity, wherein the evaporation section is connected to the heat emitter, and wherein the heat dissipator is configured to dissipate heat for the condensation section; and   a first additional pipe section comprising a first additional cavity, wherein the first additional pipe section is connected to the first end part and is not in contact with the heat emitter, wherein the first additional cavity is configured to accommodate all or a part of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, and wherein the first additional pipe section is configured to not be in contact with a heat emitting component of a heat producing device when the heat pipe is mounted on the heat producing device.