Bonded abrasive article and method of making the same

Abstract

An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

What is claimed is: 
     
         1 . An abrasive article comprising:
 a substrate;   a plurality of bodies attached to the substrate;   wherein each body of the plurality of bodies comprises abrasive particles contained in a bond material including a vitreous material;   the plurality of bodies comprises a plurality of pores; and wherein each body of the plurality of bodies comprises a normalized defect amount (nDFA) of not greater than 5, the nDFA being defined as a total amount of particle agglomerates per mm2 having a diameter size of 18 microns or greater.   
     
     
         2 . The abrasive article of  claim 1 , wherein each body of the plurality of bodies comprises:
 a) a porosity of at least 40 vol % and not greater than 70 vol % for a total volume of the body;   b) a content of abrasive particles of at least 10 wt % and not greater than 94 wt % for a total weight of the body;   c) an average particle size (D50) of the abrasive particles of at least 0.05 microns and not greater than 5 microns; and   d) an average pore size (D50) of the plurality of pores being at least 0.1 microns and not greater than 5 microns.   
     
     
         3 . The abrasive article of  claim 1 , wherein each body of the plurality of bodies comprises a porosity of at least 50 vol % and not greater than 70 vol % for a total volume of the body. 
     
     
         4 . The abrasive article of  claim 1 , wherein the amount of bond material in each body of the plurality of bodies is at least 5 wt % and not greater than 15 wt % based on the total weight of the body. 
     
     
         5 . The abrasive article of  claim 1 , wherein the amount of abrasive particles in each body of the plurality of bodies is at least 60 wt % and not greater than 93 wt % based on the total weight of the body. 
     
     
         6 . The abrasive article of  claim 1 , wherein each body of the plurality of bodies comprises a weight percent ratio [C b :C a ] of the bond material [C b ] to the abrasive particles [C a ] in a range from 1:15 to 10:1. 
     
     
         7 . The abrasive article of  claim 1 , wherein an average particle size (D50) of the abrasive particles is at least 0.05 microns and not greater than 2 microns. 
     
     
         8 . The abrasive article of  claim 1 , wherein an average pore size (D50) of the plurality of pores is at least 0.1 microns and not greater than 2 microns. 
     
     
       9. The abrasive article of  claim 1 , wherein the abrasive particles include diamond, cubic boron nitride, or a combination thereof. 
     
     
         10 . The abrasive article of  claim 9 , wherein the abrasive particles consist essentially of diamond. 
     
     
         11 . The abrasive article of  claim 1 , wherein the bond material consists essentially of a vitreous material. 
     
     
         12 . The abrasive article of  claim 1 , wherein the plurality of pores comprises a D90 of not greater than 10 microns. 
     
     
         13 . The abrasive article of  claim 1 , wherein the abrasive article is configured to conduct a material removal operation on a silicon carbide wafer or a silicon carbide ingot. 
     
     
         14 . The abrasive article of  claim 1 , wherein the plurality of pores define a pore size distribution having a 10th percentile value (D10), and further wherein the distance between the 10th percentile (D10) and an average pore size (D50) is not greater than 1 micron, and further wherein the distance between the average pore size (D50) and the 90 th  percentile value (D90) can be not greater than 1 micron, and wherein the plurality of pores has a D90 value of at least 0.5 microns and not greater than 5 microns, and further wherein the plurality of pores has a D10 value of at least 0.05 microns and not greater than 0.7 micron. 
     
     
         15 . The abrasive article of  claim 1 , wherein the body comprises an elastic modulus (EMOD) according to ASTM E1876 of at least 10 GPa. 
     
     
         16 . The abrasive article of  claim 1 , wherein the amount of the plurality of bodies attached to the substrate is at least 15 bodies and not greater than 500 bodies. 
     
     
         17 . The abrasive article of  claim 1 , wherein the plurality of bodies comprises a combined volume of at least 0.20 cm 3  and not greater than 20 cm 3 . 
     
     
         18 . The abrasive article of  claim 1 , wherein the plurality of bodies comprises a normalized Porosity Content Variation (PCV) value of not greater than 1.3. 
     
     
         19 . The abrasive article of  claim 5 , wherein the amount of the abrasive particles is at least 80 wt % and not greater than 93 wt %. 
     
     
         20 . The abrasive article of  claim 1 , further comprising a plurality of bodies attached to a substrate, wherein the abrasive article is configured to be moved relative to a surface of the silicon carbide wafer to reduce the surface roughness (Ra) of the silicon carbide wafer to not greater than 50 Å, wherein the silicon carbide wafer has a diameter of at least 200 mm and a total thickness variation of not greater than 2 microns.