US2025003104A1PendingUtilityA1

Resin-metal composite body and method of manufacturing resin-metal composite body

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Assignee: SAITO AKIRAPriority: Jun 30, 2023Filed: Jun 26, 2024Published: Jan 2, 2025
Est. expiryJun 30, 2043(~17 yrs left)· nominal 20-yr term from priority
C23C 18/1653C25D 5/56C23C 18/36
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Claims

Abstract

A resin-metal composite body is provided that includes a resin base material having a surface roughness Sq of 1.5 μm or more and a surface roughness Sku of 4.5 μm or less, and a metal plating on the resin base material.

Claims

exact text as granted — not AI-modified
1 . A resin-metal composite body, comprising:
 a resin base material having a surface roughness Sq of 1.5 μm or more and a surface roughness Sku of 4.5 μm or less; and   a metal plating on the resin base material.   
     
     
         2 . The resin-metal composite body according to  claim 1 , wherein the resin base material includes a filler. 
     
     
         3 . The resin-metal composite body according to  claim 2 , wherein the filler includes at least one of a cellulose nanofiber, a glass fiber, and a bismaleimide resin. 
     
     
         4 . The resin-metal composite body according to  claim 1 , wherein the metal plating has an average film thickness of 20 μm or more. 
     
     
         5 . The resin-metal composite body according to  claim 1 , wherein the metal plating includes at least one of a copper plating and a nickel plating. 
     
     
         6 . The resin-metal composite body according to  claim 1 , wherein the metal plating includes a copper plating and a nickel plating, and a thickness of the copper plating is one time or more with respect to a thickness of the nickel plating. 
     
     
         7 . The resin-metal composite body according to  claim 1 , wherein the resin base material has neither an acid treatment nor a blast treatment. 
     
     
         8 . A method of manufacturing a resin-metal composite body, the method comprising:
 subjecting a resin base material having a surface roughness Sq of 1.5 μm or more and a surface roughness Sku of 4.5 μm or less to a plating treatment.   
     
     
         9 . The method according to  claim 8 , wherein the plating treatment includes:
 forming an underlayer by electroless plating; and   forming an electrolytic plating layer by electrolytic plating.   
     
     
         10 . The method according to  claim 9 , wherein the plating treatment further includes:
 forming an electroless plating layer, after the forming the electrolytic plating layer, by using an electroless nickel solution including a phosphorus-nickel compound having a phosphorus content of 5% or more.   
     
     
         11 . The method according to  claim 8 , wherein the method does not include subjecting the resin base material to an acid treatment or a blast treatment.

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