Electromechanical switches on input/output (i/o) components

Abstract

Input/output (I/O) components can include electromechanical switches that can be placed respectively on signal lines coupled between transceivers and I/O pads. Electromechanical switches can operate to isolate respective transceivers from the other transceivers and/or I/O pads to protect those transceivers from ESD events. Electromechanical switches of I/O components can be micro-electromechanical systems (MEMS) switches.

What is claimed is: 
     
         1 . An apparatus, comprising:
 an input/output (I/O) pad;   an input driver coupled to the I/O pad;   an output driver coupled to the I/O pad; and   a first microelectromechanical systems (MEMS) switch coupled to the I/O pad and to one of the input and output drivers, wherein the first MEMS switch is operable to isolate the one of the input and output drivers from the I/O pad when the other of the input and output drivers is actively driving a signal.   
     
     
         2 . The apparatus of  claim 1 , wherein the apparatus comprises a bidirectional I/O component. 
     
     
         3 . The apparatus of  claim 2 , wherein operation of the first MEMS switch provides sufficient electrical isolation that the bidirectional I/O component does not include a separate electrostatic discharge (ESD) protection circuit. 
     
     
         4 . The apparatus of  claim 1 , further comprising a second MEMS switch coupled to the I/O pad and to the other of the input and output drivers, wherein the second MEMS switch is operable to isolate the other of the input and output drivers from the one of the input and output drivers when the one of the input and output drivers is actively driving a signal. 
     
     
         5 . The apparatus of  claim 1 , wherein the one of the input and output drivers is a receiver driver and the other of the input and output drivers is a transmit driver. 
     
     
         6 . The apparatus of  claim 1 , wherein the first MEMS switch is operable to isolate the one of the input and output drivers from the I/O pad when the first MEMS switch is in an open position. 
     
     
         7 . A system, comprising:
 an input/output (I/O) component comprising:
 an I/O pad coupled to an output driver and an input driver; 
 a first microelectromechanical systems (MEMS) switch coupled between the I/O pad and the output driver, the first MEMS switch operable to isolate the output driver from the I/O pad and the input driver; and 
   
       a second MEMS switch coupled between the I/O pad and the input driver, the second MEMS switch operable to isolate the input driver from the I/O pad and the output driver;
 a controller coupled to the I/O component; the controller configured to:
 place, to cause the output driver to drive a signal, the first MEMS switch in a closed position; and 
 place, to cause the input driver to drive a signal, the first MEMS switch in an open position to isolate the output driver from the I/O pad and the input driver. 
 
 
     
     
         8 . The system of  claim 7 , wherein:
 the output driver is operable to drive a signal to the I/O pad; and   the input driver is operable to drive a signal received from the I/O pad.   
     
     
         9 . The system of  claim 7 , wherein the controller is configured to place the first MEMS switch or second MEMS switch in an open or closed position during operation of the system. 
     
     
         10 . The system of  claim 7 , wherein the controller is configured to place, while the output driver is actively driving a signal, the second MEMS switch in an open position to isolate the input driver from the I/O pad and the output driver. 
     
     
         11 . The system of  claim 7 , wherein the controller is configured to place, to cause the input driver to drive a signal, the second MEMS in a closed position to couple the input driver to the I/O pad. 
     
     
         12 . The system of  claim 11 , wherein the controller is configured to place, while the input driver is actively driving a signal, the first MEMS switch in an open position to isolate the output driver from the I/O pad and the input driver. 
     
     
         13 . The system of  claim 7 , wherein the controller is configured to place both the first and second MEMS switches in an open position to isolate both the input and output drivers from the I/O pad. 
     
     
         14 . The system of  claim 7 , wherein the input and output drivers are coupled to the I/O pad without being coupled to an electrostatic discharge (ESD) protection circuit. 
     
     
         15 . The system of  claim 7 , wherein:
 the output driver corresponds to a transmitter; and   the input driver corresponds to a receiver.   
     
     
         16 . A method, comprising:
 in association with driving a signal via an output driver of an input/output (I/O) component, closing a first microelectromechanical systems (MEMS) switch coupled between the output driver and an I/O pad of the I/O component; and   while the output driver is actively driving the signal, maintaining a second MEMS switch in an open position, wherein the second MEMS switch is coupled between an input driver of the I/O component and the I/O pad.   
     
     
         17 . The method of  claim 16 , further comprising, in association with driving a signal via the input driver, closing the second MEMS switch. 
     
     
         18 . The method of  claim 17 , further comprising, while the input driver is actively driving the signal, maintaining the first MEMS switch in an open position to isolate the output driver from the I/O pad. 
     
     
         19 . The method of  claim 16 , further comprising opening the first and second MEMS switches, while the input and output drivers are not actively driving a signal. 
     
     
         20 . The method of  claim 16 , further comprising dynamically opening and closing the first and the second MEMS switches during operation of a computing device including the I/O component.