Masking member and film forming apparatus for metal film

Abstract

A masking member includes a mesh portion, a mask portion provided on front and back sides of the mesh portion and sandwiched between the electrolyte membrane and substrate, and a penetrating portion penetrating the mask portion in accordance with a predetermined pattern to expose the mesh portion. The masking member includes a connecting channel provided in a part of the mask portion sandwiched between the electrolyte membrane and mesh portion, the connecting channel connecting adjacent two penetrating portions or the penetrating portion and a space facing a region where the predetermined pattern is not formed on the substrate so as to allow a plating solution to flow therethrough.

What is claimed is: 
     
         1 . A masking member for forming a metal film in a predetermined pattern on a surface of a substrate by electroplating, the masking member disposed between an electrolyte membrane and the substrate, the masking member comprising:
 a mesh portion that allows a plating solution for the electroplating to pass therethrough;   a mask portion provided on a front side and a back side of the mesh portion and sandwiched between the electrolyte membrane and the substrate;   a penetrating portion penetrating the mask portion in accordance with the predetermined pattern so as to expose the mesh portion; and   a connecting channel provided in a part of the mask portion sandwiched between the electrolyte membrane and the mesh portion, the connecting channel connecting two of the penetrating portions adjacent to each other or the penetrating portion and a space facing a region where the predetermined pattern is not formed on the substrate so as to allow the plating solution to flow therethrough.   
     
     
         2 . The masking member according to  claim 1 , wherein the connecting channel is a recessed groove provided on a surface of the mask portion, the surface facing the electrolyte membrane. 
     
     
         3 . The masking member according to  claim 2 , wherein a width of the connecting channel is equal to or greater than 100 μm and equal to or smaller than 500 μm. 
     
     
         4 . A film forming apparatus for a metal film provided with the masking member according to  claim 1 , the film forming apparatus comprising:
 a container containing the plating solution, with an opening facing the substrate covered with the electrolyte membrane;   a moving mechanism configured to move at least one of the container or the substrate from a state in which the container and the substrate are separated from each other so as to sandwich the masking member between the electrolyte membrane and the substrate;   a pressure increase mechanism configured to increase a pressure of the plating solution contained in the container;   an anode disposed facing the electrolyte membrane inside the container;   a power source configured to apply voltage between the anode and the substrate; and   the masking member disposed between the electrolyte membrane and the substrate.