Masking member and film forming apparatus for metal film using same

Abstract

A masking member is for forming, by electroplating, a metal film in a predetermined pattern on the surface of the substrate on which a metal layer is formed. The masking member includes a mask portion in which a penetrating portion corresponding to the predetermined pattern is formed and a metal mesh as a conductive member that contacts the metal layer. The mask portion is made of an elastic material. The metal mesh is embedded in the mask portion such that a part of the metal mesh is exposed from a contact surface, which contacts the metal layer, of a surface of the mask portion.

What is claimed is: 
     
         1 . A masking member for forming, by electroplating, a metal film in a predetermined pattern on a surface of a substrate on which a metal layer is formed, the masking member comprising:
 a mask portion in which a penetrating portion corresponding to the predetermined pattern is formed; and   a conductive member disposed on a contact surface that contacts the metal layer,   wherein   the mask portion is made of an elastic material, and   the conductive member is embedded in the mask portion such that a part of the conductive member is exposed from the contact surface, which contacts the metal layer, of a surface of the mask portion.   
     
     
         2 . The masking member according to  claim 1 , wherein
 the conductive member is a metal mesh, and   the metal mesh is embedded in the mask portion so as to be exposed from the mask portion on the contact surface.   
     
     
         3 . The masking member according to  claim 2 , wherein the metal mesh is disposed so as to surround a periphery of the mask portion. 
     
     
         4 . The masking member according to  claim 2 , wherein the masking member comprises a resin mesh for fixing the mask portion, on a side opposite to the contact surface across the metal mesh. 
     
     
         5 . A film forming apparatus for a metal film, including the masking member according to  claim 1 , the film forming apparatus comprising:
 a container having an opening formed at a position facing the substrate, the opening covered with an electrolyte membrane with a plating solution contained in the container;   a moving mechanism configured to move at least one of the container or the substrate so that the container and the substrate can be separated from and contact with each other via the masking member;   a pressure increase mechanism configured to increase a hydraulic pressure of the plating solution contained in the container;   an anode disposed at a position facing the electrolyte membrane in the container; and   a power source that applies voltage between the anode and the substrate,   wherein   the masking member is disposed between the electrolyte membrane and the substrate, and   the conductive member is made conductive with a negative pole of the power source at least at a time of film formation.