US2025037943A1PendingUtilityA1
Integrated Bypass Diode Schemes for Solar Modules
Est. expiryDec 22, 2042(~16.4 yrs left)· nominal 20-yr term from priority
H10K 30/40H01G 9/2072H10K 30/30H10K 30/57H10K 19/20H01G 9/2081H01G 9/2009H01G 9/0036Y02E10/549
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Claims
Abstract
Hybrid solar cell plates with integrated bypass diodes and modules thereof are described. In an embodiment, a hybrid solar cell plate includes a step surface including a floor and a step edge extending from the floor and across a thickness of a top subcell. A bypass diode is over the floor and laterally adjacent to the step edge.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A hybrid solar cell plate comprising:
a bottom electrode layer; a top subcell over the bottom electrode layer; a step surface including a floor and a step edge extending from the floor and across a thickness of the top subcell; a bypass diode spanning over the floor and the top subcell; and a patterned metal layer spanning over the bypass diode.
2 . The hybrid solar cell plate of claim 1 , wherein the patterned metal layer comprises a plurality of metal finger electrodes spanning over the top subcell.
3 . The hybrid solar cell plate of claim 2 , wherein the patterned metal layer comprises a metal busbar substantially located over the floor.
4 . The hybrid solar cell plate of claim 3 , wherein the bypass diode is characterized by a finger and busbar pattern underlying a portion of the plurality of metal finger electrodes and the metal busbar.
5 . The hybrid solar cell plate of claim 1 , wherein:
the step edge is adjacent to and parallel to a peripheral edge of the hybrid solar cell plate; the top subcell is a portion of an only solar cell of the hybrid solar cell plate; and the bypass diode is an only bypass diode of the hybrid solar cell plate.
6 . The hybrid solar cell plate of claim 1 , further comprising a bottom subcell, wherein:
the top subcell comprises:
a first bottom junction layer of a first carrier type; and
a first top junction layer of a second carrier type opposite the first carrier type; and
the bottom subcell comprises:
a second bottom junction layer of the first carrier type; and
a second top junction layer of the second carrier type opposite the first carrier type.
7 . The hybrid solar cell plate of claim 6 , wherein the step edge extends across a thickness of the second top junction layer.
8 . The hybrid solar cell plate of claim 7 , wherein the floor spans over the first bottom junction layer.
9 . The hybrid solar cell plate of claim 7 , further comprising a bottom bypass electrode on the floor, wherein the bypass diode spans over the bottom bypass electrode.
10 . The hybrid solar cell plate of claim 9 , wherein the bottom bypass electrode fills a substantial height of the step edge of the step surface.
11 . The hybrid solar cell plate of claim 10 , further comprising an insulator material that fills a gap laterally between the top subcell and the bottom bypass electrode.
12 . The hybrid solar cell plate of claim 6 , wherein:
the second bottom junction layer is p-doped silicon; the first bottom junction layer is a hole transport layer; the first top junction layer is an electron transport layer; and further comprising a perovskite absorber layer between the first bottom junction layer and the first top junction layer.
13 . The hybrid solar cell plate of claim 1 , further comprising a top transparent electrode layer.
14 . The hybrid solar cell plate of claim 13 , wherein the step edge extends across a thickness of the top transparent electrode layer.
15 . The hybrid solar cell plate of claim 14 , wherein the patterned metal layer spans over the bypass diode and the top transparent electrode layer.
16 . The hybrid solar cell plate of claim 15 , wherein the patterned metal layer includes a plurality of metal finger electrodes spanning over the top subcell.
17 . The hybrid solar cell plate of claim 16 , wherein the patterned metal layer includes a metal busbar substantially located over the floor.
18 . A solar module comprising:
a first hybrid solar cell plate comprising:
a first bottom electrode layer;
a first top subcell over the first bottom electrode layer;
a first step surface including a first floor and a first step edge extending from the first floor across a first thickness of the first top subcell;
a first bypass diode spanning over the first floor and the first top subcell; and
a first patterned metal layer spanning over the first bypass diode; and
a second hybrid solar cell plate comprising:
a second bottom electrode layer;
a second top subcell over the second bottom electrode layer;
a second step surface including a second floor and a second step edge extending from the second floor across a second thickness of the second top subcell;
a second bypass diode over the second floor and the second top subcell; and
a second patterned metal layer spanning over the second bypass diode;
wherein the first patterned metal layer is connected to the second bottom electrode layer.
19 . The solar module of claim 18 , wherein the first patterned metal layer is connected to the second bottom electrode layer with a ribbon or wiring.
20 . The solar module of claim 18 , wherein the first patterned metal layer is connected to the second bottom electrode layer with a conductive film, conductive paste, or solder.Join the waitlist — get patent alerts
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