Silver plating solution

Abstract

An electroless silver plating solution is provided. The electroless silver plating solution includes a silver complex solution and a reducing agent solution. The silver complex solution includes a silver carboxylate represented by Formula 1: R1—COOAg, a nitrogen-containing compound as a complexing agent, and a solvent. The reducing agent solution includes a reducing agent selected from the group consisting of glucose, hydrazine, hydroquinone, and derivatives thereof and a solvent. The electroless silver plating is based on a silver mirror reaction between the silver complex solution and the reducing agent solution.

1 . An electroless silver plating solution comprising a silver complex solution and a reducing agent solution wherein the silver complex solution comprises a silver carboxylate represented by Formula 1:
   R 1 —COOAg  [Formula 1]
   wherein R 1  is hydrogen, substituted or unsubstituted C 1 -C 22  alkyl, substituted or unsubstituted C 3 -C 30  cycloalkyl, substituted or unsubstituted C 6 -C 30  aralkyl, substituted or unsubstituted C 1 -C 30  heteroalkyl, substituted or unsubstituted C 2 -C 30  heterocycloalkyl or substituted or unsubstituted C 5 -C 30  heteroaralkyl, and the electroless silver plating is based on a silver mirror reaction between the silver complex solution and the reducing agent solution.   
     
     
         2 . The electroless silver plating solution according to  claim 1 , wherein the silver complex solution further comprises a nitrogen-containing compound as a complexing agent and a solvent. 
     
     
         3 . The electroless silver plating solution according to  claim 2 , wherein the nitrogen-containing compound is selected from the group consisting of ammonia, amines, quaternary ammonium salts, polyamines, and mixtures thereof. 
     
     
         4 . The electroless silver plating solution according to  claim 3 , wherein the nitrogen-containing compound is an amine represented by Formula 2:
   (R 2 R 3 R 4 )N  [Formula 2]
   wherein R 2  to R 4  are the same as or different from each other and are each independently hydrogen, substituted or unsubstituted C 1 -C 20  alkyl, substituted or unsubstituted C 6 -C 30  aryl, substituted or unsubstituted C 3 -C 30  cycloalkyl, substituted or unsubstituted C 6 -C 30  aralkyl, substituted or unsubstituted C 1 -C 30  heteroalkyl, substituted or unsubstituted C 2 -C 30  heterocycloalkyl, substituted or unsubstituted C 5 -C 30  heteroaryl or substituted or unsubstituted C 5 -C 30  heteroaralkyl, or a quaternary ammonium salt compound represented by Formula 3:
   (R 5 R 6 R 7 R 8 )N + X  [Formula 3]
 
   wherein R 5  to R 8  are as defined for R 2  to R 4  in Formula 2 and X is F − , Cl − , Br − , I − , OH − , hydrogen sulfate, bicarbonate, carbamate or perchlorate.   
     
     
         5 . The electroless silver plating solution according to  claim 2 , wherein the nitrogen-containing compound is ammonia or an alkylamine. 
     
     
         6 . The electroless silver plating solution according to  claim 2 , wherein the solvent is water, ethanol, ethylene glycol, glycerin or a mixed solvent thereof. 
     
     
         7 . The electroless silver plating solution according to  claim 2 , wherein the complexing agent is present in a molar ratio 0.1-10.0 relative to the silver carboxylate. 
     
     
         8 . The electroless silver plating solution according to  claim 2 , wherein the complexing agent binds to a silver ion of the silver carboxylate to form a complex ion. 
     
     
         9 . The electroless silver plating solution according to  claim 1 , wherein the reducing agent solution comprises a reducing agent selected from the group consisting of glucose, hydrazine, hydroquinone, and derivatives thereof and a solvent. 
     
     
         10 . The electroless silver plating solution according to  claim 9 , wherein the solvent is water, ethanol, ethylene glycol, glycerin or a mixed solvent thereof. 
     
     
         11 . The electroless silver plating solution according to  claim 10 , wherein the solvent is a mixed solvent comprising 1 to 80% by weight of water. 
     
     
         12 . The electroless silver plating solution according to  claim 9 , wherein the reducing agent solution further comprises one or more additives comprising an ammonium salt. 
     
     
         13 . The electroless silver plating solution according to  claim 12 , wherein the ammonium salt is present in an amount of 0.01 to 10.0% by weight, based on the weight of the final plating solution. 
     
     
         14 . The electroless silver plating solution according to  claim 1 , wherein the silver carboxylate is a silver alkanoate. 
     
     
         15 . The electroless silver plating solution according to  claim 1 , wherein the content of silver is 0.05 to 5.0% by weight, based on the weight of the final plating solution. 
     
     
         16 . The electroless silver plating solution according to  claim 1 , wherein the reducing agent is present in a molar ratio of 0.1-5.0 relative to the silver carboxylate. 
     
     
         17 . A silver-plated product manufactured by reaction with the silver plating solution according to  claim 1  at 5 to 50° C.