Pad conditioning brush

Abstract

Pad conditioning brushes are described. In particular, pad conditioning brushes including a carrier layer and a plurality of abrasive particle-free brush bristles extending from the carrier layer are described. The carrier layer and the plurality of brush bristles form a unitary body. Such brushes may provide excellent performance compared to traditional conditioning disks.

What is claimed is: 
     
         1 . A pad conditioning brush, comprising:
 a carrier layer;   a plurality of brush bristles extending from the carrier layer;   wherein the plurality of brush bristles are abrasive particle-free;   wherein the carrier layer and the plurality of brush bristles form a unitary body;   where the pad conditioning brush has sufficient stiffness to texture a chemical mechanical polishing pad with a hardness of 20 Shore A.   
     
     
         2 . The pad conditioning brush of  claim 1 , wherein the pad conditioning brush has a working surface defined by the side of the carrier layer from which the plurality of brush bristles extend, and wherein the working surface of the pad conditioning brush is metal-free. 
     
     
         3 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles include a first material and a second material at least partially overlaying the first material, wherein the second material is harder than the first material. 
     
     
         4 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles are hydrophilic. 
     
     
         5 . The pad conditioning brush of  claim 1 , wherein the pad conditioning brush has sufficient stiffness to texture a chemical mechanical polishing pad with a hardness of 80 Shore A. 
     
     
         6 . The pad conditioning brush of claim  6 , wherein the pad conditioning brush has sufficient stiffness to texture a chemical mechanical polishing pad with a hardness of 65 Shore D. 
     
     
         7 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles include a composite including a polymer, an impact modifier, and a stiffening fiber. 
     
     
         8 . The pad conditioning brush of  claim 7 , wherein the polymer includes an aliphatic polyamide. 
     
     
         9 . The pad conditioning brush of  claim 7 , wherein the stiffening fiber includes at least one of a meta-aramid fiber or a carbon fiber. 
     
     
         10 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles includes bristles that have a regular shape. 
     
     
         11 . The pad conditioning brush of  claim 10 , wherein the plurality of brush bristles include bristles that have a cylindrical, conical, or tetrahedral shape. 
     
     
         12 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles include bristles that have an irregular shape. 
     
     
         13 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles include bristles that have a combination of shapes. 
     
     
         14 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles include bristles that have an aspect ratio between 1.5:1 and 10:1. 
     
     
         15 . The pad conditioning brush of  claim 1 , wherein the plurality of brush bristles each have an aspect ratio greater than 1.5:1. 
     
     
         16 . A pad conditioning brush, comprising:
 a carrier layer;   a plurality of brush bristles extending from the carrier layer,   wherein the plurality of brush bristles are abrasive particle-free;   wherein the carrier layer and the plurality of brush bristles form a unitary body;   wherein the plurality of brush bristles include a composite including a polymer and an impact modifier.   
     
     
         17 . A method of conditioning a chemical mechanical polishing pad, comprising:
 providing a chemical mechanical polishing pad;   providing a pad conditioning brush as in  claim 1 ;   contacting the pad conditioning brush to the chemical mechanical polishing pad; and   texturing the chemical mechanical polishing pad.   
     
     
         18 . The method of  claim 17 , wherein the chemical mechanical polishing pad has a hardness between 20 Shore A and 75 Shore D. 
     
     
         19 . The method of  claim 17 , wherein contacting the pad conditioning brush to the chemical mechanical polishing pad occurs in the presence of a slurry. 
     
     
         20 . A method of conditioning a chemical mechanical polishing pad, comprising:
 providing a pad conditioner including a unitary working surface that is metal-free and abrasive particle-free;   providing a chemical mechanical polishing pad;   contacting the pad conditioner to the chemical mechanical polishing pad; and   texturing the chemical mechanical polishing pad.