Zeolite, method for producing zeolite, composition, liquid sealing agent, resin composite material, sealing material, method for producing sealing material, and electronic device

Abstract

A zeolite may be a spherical aluminosilicate having a particle size of 0.05 μm or more and less than 1.0 μm and having d6r as a composite building unit. Such a zeolite may have a small thermal expansion coefficient. Such a zeolite may have a sphericity of 0.7 or more. Such a zeolite may be a CHA-type zeolite. A composition may include such a zeolite and a resin.

1 . A zeolite, which is a spherical aluminosilicate having a particle size in a range of from 0.05 to less than 1.0 μm,
 wherein the zeolite has d6r as a composite building unit. 
 
     
     
         2 . The zeolite of  claim 1 , having a sphericity of 0.7 or more. 
     
     
         3 . The zeolite of  claim 2 , which is a CHA zeolite. 
     
     
         4 . A composition, comprising:
 the zeolite of claim  3 ; and   a resin.   
     
     
         5 . The composition of  claim 4 , wherein the resin comprises an epoxy resin and/or a polyimide resin. 
     
     
         6 . The composition of  claim 5 , further comprising:
 an inorganic filler having a particle size in a range of from 1.0 to 10 μm.   
     
     
         7 . The composition of  claim 5 , wherein a content of the zeolite in all fillers is 90% by mass or more. 
     
     
         8 . The composition of  claim 5 , comprising the zeolite in a range of from 40 to 70% by mass,
 wherein the resin is an epoxy resin, and   wherein the composition has a viscosity at 23° C. in a range of from 0.1 to 250 Pa·s.   
     
     
         9 . A resin composite material, comprising:
 the composition of  claim 5 ,   wherein the zeolite is present in the resin composite material in a range of from 40 to 70% by mass,   wherein the resin is an epoxy resin, and   wherein an average thermal expansion coefficient of the resin composite material at 25 to 100° C. is in a range of from 10 to 30 ppm/K.   
     
     
         10 . A liquid sealing agent, comprising:
 the composition of  claim 5 .   
     
     
         11 . A sealing material, comprising:
 the resin composite material of claim  9 .   
     
     
         12 . An electronic device, comprising:
 the resin composite material of claim  9 .   
     
     
         13 . A method for producing a sealing material, the method comprising:
 filling a gap with the composition of claim  8 ; and then   curing the composition.   
     
     
         14 . A method for producing a zeolite, the method comprising:
 hydrothermally synthesizing a raw material composition comprising a silicon atom raw material, a water-soluble aluminum atom raw material, an organic structure directing agent, a silane coupling agent, and water.   
     
     
         15 . The method  claim 14 , further comprising:
 firing the raw material composition.   
     
     
         16 . The composition of  claim 4 , wherein the resin comprises an epoxy resin. 
     
     
         17 . The composition of  claim 4 , wherein the resin comprises a polyimide resin.