Polishing devices
Abstract
The present disclosure provides a polishing device comprising a frame (1), and a polishing disc (2), an assistant polishing disc (3), and a fixture (5) that are disposed on the frame (1). At least one polishing position (4) is disposed on the assistant polishing disc (3). The assistant polishing disc (3) is clamped by the fixture (5) and in contact with the polishing disc (2). The fixture (5) includes a plurality of claws (52), the plurality of claws (52) include at least a first claw extending from above the at least one polishing position (4) to an edge of the assistant polishing disc (3). A pre-tightening part is disposed on a position, corresponding to the at least one polishing position (4), of the first claw. The pre-tightening part includes a scale and a pre-tightening member. A scale value representing a polishing removal efficiency is preset on the scale.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A polishing device, comprising a frame, and a polishing disc, an assistant polishing disc, and a fixture that are disposed on the frame, wherein:
at least one polishing position is disposed on the assistant polishing disc and configured to place a workpiece to be polished; the assistant polishing disc is clamped by the fixture, the fixture includes a plurality of claws, the plurality of claws include at least a first claw extending from above the at least one polishing position to an edge of the assistant polishing disc; a pre-tightening part is disposed on a position, corresponding to the at least one polishing position, of the first claw, the pre-tightening part includes a scale and a pre-tightening member, a scale value representing a polishing removal efficiency is preset on the scale, and the pre-tightening member adjusts a polishing efficiency of the workpiece to be polished based on the scale value; and during a polishing process, the polishing disc rotates, and the assistant polishing disc rotates and/or swings to achieve polishing of the workpiece to be polished.
2 . The polishing device of claim 1 , further comprising a flatness detection mechanism and a pressure adjustment mechanism; wherein
the flatness detection mechanism is configured to detect whether a flatness of the polishing disc meets a preset requirement during the polishing process; and the pressure adjustment mechanism is configured to adjust a pressure applied to the polishing disc by the assistant polishing disc according to a detection result of the flatness detection mechanism.
3 . The polishing device of claim 2 , further comprising a driving mechanism, wherein the driving mechanism is connected with the fixture through a stylus and configured to drive the assistant polishing disc to rotate and/or swing.
4 . The polishing device of claim 3 , wherein
the pressure adjustment mechanism is disposed on the driving mechanism; and the pressure adjustment mechanism controls the stylus to apply an adjustable pressure to the assistant polishing disc; or the pressure adjustment mechanism is disposed on the fixture; and the pressure adjustment mechanism controls the fixture to apply an adjustable pressure in a direction of gravity to the assistant polishing disc.
5 . The polishing device of claim 1 , wherein a liquid guide tank is disposed on a polishing surface of the polishing disc, a width of the liquid guide tank being in a range of 1 mm-5 mm.
6 . The polishing device of claim 5 , wherein the width of the liquid guide tank is 3%-20% of a diameter of the workpiece to be polished.
7 . The polishing device of claim 5 , wherein when a diameter of the workpiece to be polished is less than 25.4 mm, the width of the liquid guide tank is in a range of 1 mm-3 mm.
8 . The polishing device of claim 5 , wherein when a diameter of the workpiece to be polished is in a range of 25.4 mm-50.8 mm, the width of the liquid guide tank is in a range of 2 mm-5 mm.
9 . The polishing device of claim 1 , wherein a diameter-to-thickness ratio of the assistant polishing disc is less than 8:1.
10 . The polishing device of claim 1 , wherein a diameter of the assistant polishing disc is 60%-80% of a diameter of the polishing disc.
11 . The polishing device of claim 10 , wherein the diameter of the assistant polishing disc is not less than 100 mm.
12 . The polishing device of claim 1 , wherein a material density of the assistant polishing disc is in a range of 5 g/cm 2 -20 g/cm 2 .
13 . The polishing device of claim 1 , wherein a diameter of the at least one polishing position is in a range of 8 mm-45 mm.
14 . The polishing device of claim 1 , wherein a total area of the at least one polishing position is less than 50% of an area of the assistant polishing disc.
15 . The polishing device of claim 1 , wherein a diameter of any one of the at least one polishing position accounts for 12%-60% of a diameter of the assistant polishing disc.
16 . The polishing device of claim 1 , wherein the at least one polishing position is evenly disposed on the assistant polishing disc.
17 . The polishing device of claim 1 , wherein a distance between two adjacent polishing positions of the at least one polishing position is in a range of 10 mm-15 mm.
18 . The polishing device of claim 1 , wherein a ratio of a diameter of the at least one polishing position to a diameter of the workpiece to be polished is in a range of 1.2-1.5.
19 . The polishing device of claim 1 , wherein a counterweight block is disposed in the at least one polishing position, and the counterweight block applies an adjustable pressure in a direction of gravity to the workpiece to be polished.
20 . The polishing device of claim 19 , wherein the counterweight block is connected with the workpiece to be polished in the at least one polishing position through an elastic member.Join the waitlist — get patent alerts
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