US2025058430A1PendingUtilityA1
Cmp conditioning disc and method of manufacturing the cmp conditioning disc
Assignee: EHWA DIAMOND INDUSTRIAL COMPANY LTDPriority: Aug 17, 2023Filed: Aug 15, 2024Published: Feb 20, 2025
Est. expiryAug 17, 2043(~17 yrs left)· nominal 20-yr term from priority
B22F 2003/241B22F 3/24B22F 8/00B24D 18/0009B24B 37/20B24B 37/22B24B 53/12B24B 53/017B24D 3/10B24D 18/0072B24D 3/06B24D 18/00B24D 18/009B22F 7/064B22F 2302/406
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Claims
Abstract
A method of manufacturing a CMP conditioning disc, includes: a primary forming layer forming step of forming a primary forming layer on an outer surface of a shank base and arranging a plurality of diamonds on the primary forming layer; and a secondary forming layer forming step of forming a secondary forming layer on an upper surface of the primary forming layer and exposing at least a portion of the diamonds in the secondary forming layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for manufacturing a CMP (chemical mechanical polishing) conditioning disc, comprising:
forming a primary forming layer on an outer surface of a shank base; and arranging a plurality of diamonds on the primary forming layer; and forming a secondary forming layer on an upper surface of the primary forming layer; and exposing at least a portion of the diamonds in the secondary forming layer.
2 . The method of claim 1 , wherein in the forming the primary forming layer, the primary forming layer is formed through a brazing process or sintering process, and
in the forming the secondary forming layer, the secondary forming layer is formed through the brazing process.
3 . The method of claim 1 , wherein in the forming the primary forming layer,
a primary metal powder layer is provided and pre-sintered on the outer surface of the shank base, an adhesive layer is formed on an outer surface of the primary metal powder layer and the diamonds are temporarily fixed to an outer surface of the adhesive layer.
4 . The method of claim 3 , wherein in the fixing the diamonds temporarily, the plurality of diamonds are fixed to the primary forming layer in such a way that the diamonds maintain an upright posture extending downward from a top of a long axis.
5 . The method of claim 4 , wherein in the fixing the diamonds temporarily, the plurality of diamonds are held temporarily in a regular pattern in rows and columns on a suction pressure device, and the plurality of diamonds are pressed and fixed on the primary forming layer using the suction pressure device to maintain the upright posture of the plurality of diamonds.
6 . The method of claim 1 , wherein in the forming the secondary forming layer,
a secondary metal powder layer is pre-sintered on the outer surface of the primary forming layer to form a secondary forming layer, and the secondary forming layer is dry polished to cover all of the diamonds or to expose at least a portion of the diamonds.
7 . The method of claim 6 , wherein in the forming the secondary forming layer,
the diamonds are fixed completely in the secondary forming layer through shrinkage of the dry polished secondary forming layer.
8 . A CMP conditioning disc comprising:
a shank base; a primary forming layer formed on an outer surface of the shank base; a secondary forming layer formed on an outer surface of the primary forming layer; and a plurality of diamonds arranged in the primary forming layer and the secondary forming layer, at least a portion of the diamonds being exposed from the secondary forming layer.
9 . The CMP conditioning disc of claim 8 , wherein the plurality of diamonds are arranged in rows and columns to be spaced apart from each other in an outer surface of the secondary forming layer, and exposed to have the same exposure height from the outer surface of the secondary forming layer.
10 . The CMP conditioning disc of claim 8 , wherein the primary forming layer is formed at a melting point that is the same as, lower than, or higher than that of the secondary forming layer.
11 . The CMP conditioning disc of claim 8 , wherein a thickness between the outer surface of the primary forming layer and an outer surface of the secondary forming layer is larger than a thickness between the outer surface of the primary forming layer and the outer surface of the shank base.
12 . A CMP conditioning disc manufactured by the method set forth in claim 1 .Join the waitlist — get patent alerts
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