Electrochemical-deposition apparatuses utilizing multiple electrolytic solutions

Abstract

An electrochemical-deposition apparatus that includes a printhead, an electric-power supply circuit, a controller. The controller is configured to sequentially direct the electric-power supply circuit to establish a first electric current through an electrolytic solution, an initial electrode, and at least one of a plurality of individually addressable transitional electrodes of the printhead, direct the electric-power supply circuit to terminate the first electric current, and direct the electric-power supply circuit to either establish a second electric current through the electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and a target electrode, or establish a third electric current through a second electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode.

What is claimed is: 
     
         1 . An electrochemical-deposition apparatus, comprising:
 a printhead, comprising a plurality of individually addressable transitional electrodes;   an electric-power supply circuit, electrically couplable with at least one of the plurality of individually addressable transitional electrodes;   a controller, configured to, sequentially:
 direct the electric-power supply circuit to establish a first electric current through an electrolytic solution, an initial electrode, and at least one of the plurality of individually addressable transitional electrodes when a surface of at least a portion of the initial electrode is in direct physical contact with the electrolytic solution, and a surface of at least a portion of at least the one of the plurality of individually addressable transitional electrodes is in direct physical contact with the electrolytic solution, so that a quantity of an electrically charged material in the electrolytic solution is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the surface of at least the portion of at least the one of the plurality of individually addressable transitional electrodes; 
 direct the electric-power supply circuit to terminate the first electric current through the electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the initial electrode; and 
 direct the electric-power supply circuit to either:
 establish a second electric current through the electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and a target electrode when a surface of at least a portion of the deposit is in direct physical contact with the electrolytic solution, and a surface of at least a portion of the target electrode is in direct physical contact with the electrolytic solution, so that:
 a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and 
 a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of at least the portion of the target electrode, or 
 
 establish a third electric current through a second electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode when a surface of at least a portion of the deposit is in direct physical contact with the second electrolytic solution, and a surface of at least a portion of the target electrode is in direct physical contact with the second electrolytic solution, so that:
 a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the second electrolytic solution, and one of: 
  a quantity of the electrically charged material in the second electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of at least the portion of the target electrode, or 
  a quantity of a second electrically charged material in the second electrolytic solution is converted to a quantity of a second electrically neutral material, which is electroplated onto the surface of at least the portion of the target electrode. 
 
 
   
     
     
         2 . The electrochemical-deposition apparatus according to  claim 1 , wherein:
 at least the one of the plurality of individually addressable transitional electrodes comprises a quantity of an electrode material; and   the electrically neutral material and the electrode material have different chemical compositions.   
     
     
         3 . The electrochemical-deposition apparatus according to  claim 2 , wherein each one of the plurality of individually addressable transitional electrodes comprises a quantity of the electrode material. 
     
     
         4 . The electrochemical-deposition apparatus according to  claim 2 , wherein the electrically neutral material is more electrochemically reactive than the electrode material. 
     
     
         5 . The electrochemical-deposition apparatus according to  claim 2 , wherein the electrode material is less electrochemically reactive than copper. 
     
     
         6 . The electrochemical-deposition apparatus according to  claim 5 , wherein the electrode material is one of platinum-group metals. 
     
     
         7 . The electrochemical-deposition apparatus according to  claim 5 , wherein the electrode material is one of platinum-group metals and/or corresponding oxides thereof. 
     
     
         8 . The electrochemical-deposition apparatus according to  claim 1 , wherein:
 at least the one of the plurality of individually addressable transitional electrodes consists of a quantity of an electrode material; and   the electrically neutral material and the electrode material have different chemical compositions.   
     
     
         9 . The electrochemical-deposition apparatus according to  claim 8 , wherein each one of the plurality of individually addressable transitional electrodes consists of a quantity of the electrode material. 
     
     
         10 . The electrochemical-deposition apparatus according to  claim 8 , wherein the electrically neutral material is more electrochemically reactive than the electrode material. 
     
     
         11 . The electrochemical-deposition apparatus according to  claim 8 , wherein the electrode material is less electrochemically reactive than copper. 
     
     
         12 . The electrochemical-deposition apparatus according to  claim 11 , wherein the electrode material is one of platinum-group metals and/or corresponding oxides thereof. 
     
     
         13 . The electrochemical-deposition apparatus according to  claim 1 , wherein at least the one of the plurality of individually addressable transitional electrodes is made of one of aluminum, copper, lead, nickel, tin, or zinc. 
     
     
         14 . The electrochemical-deposition apparatus according to  claim 1 , wherein the controller is configured to direct the electric-power supply circuit to establish the first electric current through the electrolytic solution, the initial electrode, and at least the one of the plurality of individually addressable transitional electrodes and also to direct the electric-power supply circuit to either establish the second electric current through the electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode, or to establish the third electric current through the second electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode, such that a rate of electroplating the quantity of the electrically neutral material onto the surface of at least the portion of at least the one of the plurality of individually addressable transitional electrodes is higher than a rate of electroplating the quantity of the electrically neutral material in the electrolytic solution or in the second electrolytic solution onto the surface of at least the portion of the target electrode. 
     
     
         15 . The electrochemical-deposition apparatus according to  claim 1 , wherein the second electric current is established through the electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode when the electrolytic solution is in direct physical contact with a surface of at least a portion of at least the one of the plurality of individually addressable transitional electrodes, which has a greater area than the surface of at least the portion of at least the one of the plurality of individually addressable transitional electrodes, onto which the electrically neutral material is electroplated as the deposit. 
     
     
         16 . The electrochemical-deposition apparatus according to  claim 15 , wherein the third electric current is established through the second electrolytic solution, at least the one of the plurality of individually addressable transitional electrodes, and the target electrode when the second electrolytic solution is in direct physical contact with a surface of at least a portion of at least the one of the plurality of individually addressable transitional electrodes, which has a greater area than the surface of at least the portion of at least the one of the plurality of individually addressable transitional electrodes, onto which the electrically neutral material is electroplated as the deposit. 
     
     
         17 . The electrochemical-deposition apparatus according to  claim 1 , wherein a shortest maximum distance between adjacent ones of the plurality of individually addressable transitional electrodes is less than 100 micrometers. 
     
     
         18 . The electrochemical-deposition apparatus according to  claim 1 , wherein a shortest maximum distance between adjacent ones of the plurality of individually addressable transitional electrodes is less than 50 micrometers. 
     
     
         19 . The electrochemical-deposition apparatus according to  claim 1 , wherein a shortest maximum distance between adjacent ones of the plurality of individually addressable transitional electrodes is less than 10 micrometers. 
     
     
         20 . The electrochemical-deposition apparatus according to  claim 1 , wherein any two of the plurality of individually addressable transitional electrodes have identical surface areas.