Enclosures with hermetic feedthroughs

Abstract

Various embodiments of hermetically-scaled packages and systems are disclosed. The hermetically sealed packages or systems include one or more corrosion-resistant vias disposed in the substrate or housing. Each of the one or more corrosion-resistant vias include one or more sidewalls formed by the substrate or housing, a corrosion-resistant alloy, and a hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls.

What is claimed is: 
     
         1 . A hermetically-sealed package comprising:
 a housing;   one or more electronic devices disposed in the housing;   a substrate comprising ceramic, sapphire, or glass, the substrate hermetically sealed to the housing; and   one or more corrosion-resistant vias disposed in the substrate, each of the one or more corrosion-resistant vias comprising:
 one or more sidewalls formed by the substrate; 
 a corrosion-resistant alloy; and 
 a hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls. 
   
     
     
         2 . The hermetically-sealed package of  claim 1 , wherein the hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls comprises a reaction layer bonding the corrosion-resistant alloy and the one or more sidewalls. 
     
     
         3 . The hermetically-sealed package of  claim 2 , wherein the corrosion-resistant alloy comprises zirconium. 
     
     
         4 . The hermetically-sealed package of  claim 3 , wherein the corrosion-resistant alloy comprises 58 to 64.9 percent by weight zirconium. 
     
     
         5 . The hermetically-sealed package of  claim 1 , wherein the hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls comprises an interface layer bonding the corrosion-resistant alloy to the substrate. 
     
     
         6 . The hermetically-sealed package of  claim 5 , wherein the corrosion-resistant alloy comprises a gold alloy. 
     
     
         7 . The hermetically-sealed package of  claim 1 , further comprising a thin film component disposed on a surface of the substrate. 
     
     
         8 . The hermetically-sealed package of  claim 7 , wherein the thin film component comprises an antenna. 
     
     
         9 . The hermetically-sealed package of  claim 7 , wherein the thin film component comprises an electrode. 
     
     
         10 . The hermetically-sealed package of  claim 7 , wherein the thin film component has a thickness of at least 0.5 micrometers and no greater than 3 micrometers. 
     
     
         11 . The hermetically-sealed package of  claim 1 , further comprising a fixation element directly coupled to one of the one or more corrosion-resistant vias. 
     
     
         12 . The hermetically-sealed package of  claim 1 , further comprising a continuous electroplated conductive element disposed on an outer surface of the housing and an outer surface of the substrate. 
     
     
         13 . The hermetically-sealed package of  claim 1 , wherein the hermetically-sealed package comprises an implantable medical device. 
     
     
         14 . A system comprising a hermetically-sealed battery, the hermetically-sealed battery comprising:
 a battery housing comprising ceramic, sapphire, or glass;   an electrochemical cell disposed within the battery housing and comprising:
 an anode; 
 a cathode; 
 a separator arranged between the anode and the cathode, the separator configured to prevent direct contact between the anode and the cathode; and 
 an electrolyte to transport positively charged ions between the cathode and the anode; 
   a first electrode comprising a corrosion-resistant via disposed in the battery housing and electrically coupled to the anode of the electrochemical cell; and   a second electrode comprising a corrosion-resistant via disposed in the battery housing and electrically coupled to the cathode of the electrochemical cell;   wherein the corrosion-resistant via of the first electrode and the corrosion resistant via of the second electrode each comprise:
 one or more sidewalls formed by the battery housing; 
 a corrosion-resistant alloy; and 
 a hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls formed by the battery housing. 
   
     
     
         15 . The system of  claim 14 , further comprising a package hermetically sealed to the hermetically-sealed battery. 
     
     
         16 . The system of  claim 15 , wherein the package comprises:
 a package housing comprising ceramic, sapphire, or glass, the package housing hermetically sealed to the battery housing;   one or more electronic devices disposed inside the package housing; and   one or more corrosion-resistant vias disposed in the package housing, each of the one or more corrosion-resistant vias comprising:
 one or more sidewalls formed by the package housing; 
 a corrosion-resistant alloy; and 
 a hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls formed by the package housing. 
   
     
     
         17 . The system of  claim 14 , wherein the hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls comprises a reaction layer bonding the corrosion-resistant alloy and one or more sidewalls formed by the battery housing. 
     
     
         18 . The system of  claim 14 , wherein the corrosion-resistant alloy comprises zirconium. 
     
     
         19 . The system of  claim 14 , wherein the corrosion-resistant alloy comprises 58 to 64.9 percent by weight zirconium. 
     
     
         20 . The system of  claim 14 , wherein the hermetic and corrosion-resistant seal formed between the corrosion-resistant alloy and the one or more sidewalls comprises an interface layer bonding the corrosion-resistant alloy to the one or more sidewalls formed by the battery housing.