Three-dimensional heat transfer device

Abstract

A three-dimensional heat transfer device includes a first thermal conductive shell, a second thermal conductive shell that connects the first thermally conductive shell to form a liquid-tight chamber, a plurality of heat pipes disposed on the first thermally conductive shell, and in fluid communication with the liquid-tight chamber, at least one thermally conductive assembly of a hot area arranged in the liquid-tight chamber and disposed on the second thermally conductive shell, the at least one thermally conductive assembly of hot area includes a plurality of extended thermally conductive structures of hot area, and at least one thermally conductive assembly of a cold area arranged adjacent to the at least one thermally conductive assembly of hot area includes at least two extended thermally conductive structures of cold area that are separated to form a pressure drop notch therebetween.

What is claimed is: 
     
         1 . A three-dimensional heat transfer device comprising:
 a first thermal conductive shell;   a second thermal conductive shell that is connected with the first thermally conductive shell to form a liquid-tight chamber;   a plurality of heat pipes that are connected with the first thermally conductive shell and in fluid communication with the liquid-tight chamber;   at least one thermally conductive assembly of hot area arranged in the liquid-tight chamber and disposed on the second thermally conductive shell, the at least one thermally conductive assembly of hot area includes a plurality of extended thermally conductive structures of hot area; and   at least one thermally conductive assembly of cold area arranged adjacent to the at least one thermally conductive assembly of hot area, the at least one thermally conductive assembly of cold area includes at least two extended thermally conductive structures of cold area that are separated to form a pressure drop notch therebetween.   
     
     
         2 . The three-dimensional heat transfer device of  claim 1 , wherein the second thermally conductive shell includes a base plate, a first protruding structure, a second protruding structure, the first protruding structure protrudes from the base plate and away from the first thermally conductive shell, the second protruding structure protrudes from the first protruding structure and away from the first thermally conductive shell, the second protruding structure having an inner surface facing the first thermally conductive shell, and the at least one thermally conductive assembly of hot area and the at least one thermally conductive assembly of cold area protruding from the inner surface of the second protruding structure. 
     
     
         3 . The three-dimensional heat transfer device of  claim 2 , further comprises a plurality of supporting structures of hot area and a plurality of supporting structures of cold area, wherein the plurality of supporting structures of hot area protrude from the plurality of extended thermally conductive structures of hot area, the plurality of supporting structures of cold area protrude from the plurality of extended thermally conductive structures of cold area, and the plurality of supporting structures of hot area having lengths greater than the plurality of supporting structures of cold area. 
     
     
         4 . The three-dimensional heat transfer device of  claim 3 , further comprises a first capillary structure in contact with the first thermally conductive shell. 
     
     
         5 . The three-dimensional heat transfer device of  claim 4 , further comprises a second capillary structure in contact with the second thermally conductive shell, the at least one thermally conductive assembly of hot area, the at least one thermally conductive assembly of cold area, the plurality of supporting structures of hot area, and the plurality of supporting structures of cold area. 
     
     
         6 . The three-dimensional heat transfer device of  claim 5 , wherein the plurality of extended thermally conductive structures of hot area and the second capillary structure are integrated into a single structure. 
     
     
         7 . The three-dimensional heat transfer device of  claim 5 , wherein the plurality of extended thermally conductive structures of hot area are powder-sintered structures, which are independent structures that are different from the second protruding structure. 
     
     
         8 . The three-dimensional heat transfer device of  claim 5 , the second capillary structure and the extended thermally conductive structures of hot area can have different perforated capillary with pores. 
     
     
         9 . The three-dimensional heat transfer device of  claim 2 , wherein the second protruding structure includes a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one thermally conductive assembly of hot area is adjacent to the top side and the right side of the second protruding structure. 
     
     
         10 . The three-dimensional heat transfer device of  claim 2 , wherein the second protruding structure includes a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one thermally conductive assembly of hot area is adjacent to the bottom side and the left side of the second protruding structure. 
     
     
         11 . The three-dimensional heat transfer device of  claim 2 , wherein the second protruding structure includes a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one thermally conductive assembly of hot area is adjacent to the top side and the left side of the second protruding structure. 
     
     
         12 . The three-dimensional heat transfer device of  claim 2 , wherein the second protruding structure includes a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one thermally conductive assembly of hot area is adjacent to the bottom side and the right side of the second protruding structure. 
     
     
         13 . The three-dimensional heat transfer device of  claim 2 , wherein the second protruding structure includes a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one thermally conductive assembly of hot area is separated from the top side, the bottom side, the left side, and the right side of the second protruding structure.