US2025091160A1PendingUtilityA1
Method of manufacturing a multi-component part of a household and/or cooking appliance
Est. expiryJan 21, 2042(~15.5 yrs left)· nominal 20-yr term from priority
H05B 6/64F24C 15/08B23K 26/322B23K 26/21F24C 15/005H05B 6/6402
44
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Claims
Abstract
The underlying invention is in particular related to a method of manufacturing a multi-component part ( 1 ) of a cooking and/or household and/or kitchen appliance. the multi-component part ( 1 ) comprising a first component ( 2 ) and a second component ( 3 ) wherein the first and second components ( 2.3 ) are interconnected by a substance-to-substance bond ( 4 ).
Claims
exact text as granted — not AI-modified1 . A method of manufacturing a multi-component part of a cooking and/or household and/or kitchen appliance, the multi-component part comprising a first component and a second component wherein the first and second components are interconnected by a substance-to-substance bond,
the method comprising: a) providing the first component, the first component comprising on a first side a first bonding area defined by an overlay of at least two interconnected metal layers with a gap being provided between the at least two interconnected metal layers in the first bonding area, wherein at least a coating area on a second side of the first component averted from the first side and opposite to the first bonding area is coated with an anticorrosive layer; b) providing the second component, the second component comprising a second bonding area; c) positioning the second bonding area at or on the first bonding area; and d) joining the first and second components by providing a first substance-to-substance bond between the first and second bonding areas by applying bonding energy to the first and second bonding areas from the first side.
2 . The method of claim 1 , wherein the step a) of providing the first component comprises:
a1) establishing the first bonding area by interconnecting the at least two interconnected metal layers at the first side with a second substance-to-substance bond, the second substance-to-substance bond established at a distance from an intended location of the first substance-to-substance bond, and thereafter a2) coating the coating area with the anticorrosive layer.
3 . The method of claim 1 , wherein the gap is an air-gap having, at least in a region of and adjacent to the first boding area, a minimal gap height, the minimal gap height measured perpendicular to the at least two interconnected metal layers.
4 . The method of claim 1 , wherein the gap in the first bonding area is established by means of a spacer or spacer section, located outside the first bonding area, the spacer or spacer section keeping at least two consecutive metal layers of the at least two interconnected metal layers of the first bonding area at a distance from each other.
5 . The method of claim 4 , wherein the spacer or spacer section is provided as at least one of:
a projection, protrusion, or bulge provided on a side of the at least two interconnected metal layers facing each other, wherein the projection, protrusion, or bulge is formed integral with one of the at least two interconnected metal layers; a chamfer provided at an edge of one of the at least two interconnected metal layers and oriented towards an immediately adjacent metal layer of the at least two interconnected metal layers.
6 . The method of claim 1 , wherein the gap is established by a bending of at least one of the layers of the at least two interconnected metal layers, the bending leading to an interspace between at least two consecutive metal layers of the at least two interconnected metal layers in the first bonding area.
7 . The method of claim 1 , wherein a first metal layer of the at least two interconnected metal layers is provided as a metal sheet, and a second metal layer of the at least two interconnected metal layers is provided immediately adjacent to the metal sheet on the first side and is formed as a linear, or curved sheet metal band, and wherein the first bonding area is provided on or at the sheet metal band.
8 . The method of claim 1 , comprising, before joining the first and second components, cleaning at least one of the first and second bonding areas substantially to bare metal, the cleaning being carried out with a contactless cleaning tool and/or a contact-based cleaning tool; the contactless cleaning tool comprising a laser source for generating a laser beam and the cleaning comprising irradiating the first and/or second bonding area with the laser beam; the contact-based cleaning tool comprising an abrading, grinding and/or blasting tool.
9 . The method of claim 1 , the first component being a part of a cavity or a frame of a household and/or kitchen appliance, and the second component being a functional component for mounting to the cavity or the frame.
10 . The method of claim 9 , the first component being a part of the cavity, wherein the cavity is configured for heating objects via high-frequency radiation, the functional component being a waveguide section, the cavity comprising a cavity wall with a waveguide opening for feeding therethrough said high frequency radiation in a radio-frequency range and/or a microwave range supplied via the waveguide section attached to the cavity wall into the cavity, wherein the first bonding area is established on an outer side around the waveguide opening, and the second bonding area being established at the waveguide section, and adjoining the waveguide opening once connected to the cavity wall, the method comprising:
a) positioning the waveguide section at the waveguide opening with the second bonding area being placed in alignment with the first bonding area; and b) establishing the first substance-to-substance bond between the first and second bonding areas.
11 . The method of claim 1 , wherein a thickness of the first component in a region of the overlay is in a range between 0.8 mm and 2.0 mm, and a thickness of the first component outside the overlay is, in a range between 0.3 mm to 1.0 mm.
12 . The method of claim 1 , wherein a width of the first bonding area when measured perpendicular to its path on the first component and parallel to the overlay is substantially constant, and wherein said width is in a range from 0.5 cm to 2.0 cm.
13 . The method of claim 1 , wherein the first substance-to-substance bond is established by a contact-based joining technique and/or a contactless joining technique.
14 . The method according to claim 1 , comprising supervising at least one of the method steps by a computer-based supervision system, the supervision system comprising a control unit for controlling in an at least semi-automated manner, at least one of the positioning of the second bonding area at or on the first bonding area, and the joining of the first and second components, wherein the supervising system comprises a visual system, for visually inspecting the operation according to at least one of the method steps.
15 . A Household or kitchen appliance, comprising the multi-component part manufactured according to the method of claim 1 .
16 . A Household or kitchen appliance, comprising a cavity and/or frame, and a functional component, the cavity and/or frame, and the functional component being interconnected via a substance-to-substance joint obtained according to the method of claim 1 ; with the cavity and/or frame representing the first component, and the functional component representing the second component; the appliance comprising a heating source that emits high frequency radiation in a radio-frequency range or a microwave range, the functional component being a waveguide section joined via the substance-to-substance joint to the cavity such that the high frequency radiation emitted from heating source is fed via the waveguide section into the cavity.
17 . The method of claim 1 , wherein said anticorrosive layer is an enamel layer.
18 . A method of manufacturing a multi-component part of a cooking appliance, the multi-component part comprising a first component and a second component, the method comprising:
providing first and second metal layers, each having opposite first and second surfaces, respectively; overlaying the first and second metal layers such that the second surface of the first metal layer faces the first surface of the second metal layer; interconnecting said first and second metal layers to form the first component, said first and second metal layers being interconnected via a first substance-to-substance bond, wherein an air-gap is provided between the second surface of the first metal layer and the first surface of the second metal layer, wherein:
the first component defines opposite first and second sides, the first side corresponding to the second surface of the second metal layer and the second side corresponding to the first surface of the first metal layer,
a first bonding area is defined on the first side of the first component as an overlay of the first and second metal layers, and
wherein said air-gap is aligned with said first bonding area in a direction normal to said second surface of the first metal layer;
coating the first surface of the first metal layer with an enamel layer; providing the second component, said second component having a second bonding area defined thereon; positioning the second bonding area on the first bonding area; and applying bonding energy to the first and second bonding areas in a direction from the first side of the first component so as to join the first and second components by providing a second substance-to-substance bond between the first and second bonding areas, wherein the second substance-to-substance bond is laterally offset from the first substance-to-substance bond.
19 . The method of claim 18 , wherein the air-gap is established via a spacer located outside of the first bonding area.
20 . The method of claim 18 , wherein the first component is a wall of a cavity of the cooking appliance, said wall having an opening formed therein, wherein said second component is a waveguide section configured to guide high-frequency radiation into said cavity, and wherein said waveguide section is positioned at the waveguide opening after joining said first and second components.Join the waitlist — get patent alerts
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