Power conversion device

Abstract

A power conversion device is equipped with a power module having a semiconductor device that converts DC power into AC power and a cooling passage that cools the semiconductor device, the power conversion device including a metal accommodating member a bottom surface of which is thermally connected to the cooling passage via a heat conduction member, wherein the accommodating member accommodates a plurality of smoothing capacitors for smoothing the DC power, and the plurality of smoothing capacitors are electrically connected to the semiconductor device via a DC busbar that is connected to the semiconductor device and that inputs the DC power to the semiconductor device.

1 . A power conversion device equipped with a power module having a semiconductor device that converts DC power into AC power and a cooling passage that cools the semiconductor device, the power conversion device comprising
 a metal accommodating member a bottom surface of which is thermally connected to the cooling passage via a heat conduction member,   wherein the accommodating member accommodates a plurality of smoothing capacitors for smoothing the DC power, and   the plurality of smoothing capacitors are electrically connected to the semiconductor device via a DC busbar that is connected to the semiconductor device and that inputs the DC power to the semiconductor device.   
     
     
         2 . The power conversion device according to  claim 1 ,
 wherein the power module includes a first power module having a three-phase AC output and a second power module having a three-phase AC output independent of the first power module, and   the DC busbar passes through a space between the first power module and the second power module.   
     
     
         3 . The power conversion device according to  claim 2 ,
 wherein the accommodating member includes first and second smoothing capacitor accommodating portions that accommodate the plurality of smoothing capacitors, and a pit portion through which the DC busbar penetrates the accommodating member, and   the first and second smoothing capacitor accommodating portions are arranged with the pit portion interposed therebetween.   
     
     
         4 . The power conversion device according to  claim 1 , further comprising
 a noise filter that is electrically connected to the smoothing capacitors and the semiconductor device via the DC busbar and that removes radio frequency noise from the DC power,   wherein the accommodating member includes a filter accommodating portion that accommodates the noise filter, and the first and second smoothing capacitor accommodating portions that accommodate the plurality of smoothing capacitors.   
     
     
         5 . The power conversion device according to  claim 4 ,
 wherein resin members are filled between the filter accommodating portion and the noise filter and between the first and second smoothing capacitor accommodating portions and the plurality of smoothing capacitors, respectively.   
     
     
         6 . The power conversion device according to  claim 4 ,
 wherein the noise filter includes the DC busbar that transmits the DC power, a magnetic core member disposed so as to surround the DC busbar, and a filter capacitor connected to the DC busbar,   the DC busbar has a positive electrode busbar and a negative electrode busbar,   the filter capacitor has a first filter capacitor and a second filter capacitor, and   the first filter capacitor has one end connected to the positive electrode busbar and another end connected to the negative electrode busbar, and the second filter capacitor has one end connected to either the positive electrode busbar or the negative electrode busbar and another end grounded to ground potential.   
     
     
         7 . The power conversion device according to  claim 1 , further comprising:
 a gate drive substrate that sends a control signal to the semiconductor device; and   a housing that is a passage formation body forming the cooling passage,   wherein the gate drive substrate is disposed to face the plurality of smoothing capacitors with the power module interposed between the gate drive substrate and the plurality of smoothing capacitors, and   the gate drive substrate is supported by the housing by connecting the gate drive substrate to the housing by means of the heat conduction member.   
     
     
         8 . The power conversion device according to  claim 7 , further comprising
 an electronic control board that controls operation of a motor driven by the AC power,   wherein the housing is connected to ground potential,   the accommodating member is electrically connected to the housing,   the electronic control board is disposed facing the plurality of smoothing capacitors with the power module interposed therebetween, and is disposed facing the power module with the housing interposed therebetween, and   the electronic control board is supported by the housing by connecting the electronic control board to the housing by means of the heat conduction member.