Water heater appliance and heat transfer assembly

Abstract

A water heater appliance or heat transfer assembly may include a refrigeration system, an electronics board, a conductive interface, and a conduction line. The refrigeration system may include a sealed refrigerant loop attached to a housing. The electronics board may be attached to the housing apart from the refrigeration system. The conductive interface may be proximal to the electronics board and spaced apart from the sealed refrigerant loop. The conductive interface may include a plurality of fins extending away from the electronics board. The conduction line may extend from a first end proximal to the conductive interface to a second end proximal to the sealed refrigerant loop and above the first end to convey waste heat from the electronics board to the sealed refrigerant loop. The conductive interface may define an internal channel within which a portion of the conduction line is disposed.

What is claimed is: 
     
         1 . A water heater appliance comprising:
 a housing;   a tank attached to the housing, the tank defining an interior volume;   a refrigeration system comprising a sealed refrigerant loop in thermal communication with the tank to heat the interior volume;   an electronics board attached to the housing apart from the tank;   a conductive interface proximal to the electronics board and spaced apart from the sealed refrigerant loop, the conductive interface comprising a plurality of fins; and   a conduction line extending between the conductive interface and the sealed refrigerant loop to convey waste heat from the electronics board to the sealed refrigerant loop.   
     
     
         2 . The water heater appliance of  claim 1 , wherein the conductive interface defines an internal channel encapsulating the conduction line, and wherein an outer surface of the conduction line is in conductive thermal contact with an inner surface of the internal channel of the conductive interface. 
     
     
         3 . The water heater appliance of  claim 2 , wherein the conductive interface is connected to the electronics board in conductive thermal communication therewith to draw heat from the electronics board to the conductive interface. 
     
     
         4 . The water heater appliance of  claim 1 , wherein the conduction line is clipped to the sealed refrigerant loop. 
     
     
         5 . The water heater appliance of  claim 1 , wherein the conduction line extends from a first end proximal to the conductive interface to a second end proximal to the sealed refrigerant loop and above the first end. 
     
     
         6 . The water heater appliance of  claim 5 , wherein the sealed refrigerant loop comprises an evaporator, and wherein the second end of the conduction line is proximal to the evaporator in conductive thermal communication therewith. 
     
     
         7 . The water heater appliance of  claim 6 , further comprising a plurality of conductor wings extending horizontally between the conduction line and the evaporator. 
     
     
         8 . The water heater appliance of  claim 7 , wherein the first end is horizontally offset from the second end. 
     
     
         9 . The water heater appliance of  claim 7 , wherein the plurality of conductor wings horizontally bound a portion of the evaporator and restrain relative movement between the conduction line and the evaporator. 
     
     
         10 . The water heater appliance of  claim 1 , wherein the electronics board and the conduction line are disposed directly above the tank. 
     
     
         11 . A heat-transfer assembly comprising:
 a refrigeration system comprising a sealed refrigerant loop attached to a housing;   an electronics board attached to the housing apart from the refrigeration system;   a conductive interface proximal to the electronics board and spaced apart from the sealed refrigerant loop, the conductive interface comprising a plurality of fins extending away from the electronics board; and   a conduction line extending from a first end proximal to the conductive interface to a second end proximal to the sealed refrigerant loop and above the first end to convey waste heat from the electronics board to the sealed refrigerant loop,   wherein the conductive interface defines an internal channel within which a portion of the conduction line is disposed.   
     
     
         12 . The heat-transfer assembly of  claim 11 , wherein the conductive interface comprises a plurality of plates rigidly attached together, and wherein the plurality of plates define matching grooves defining the internal channel of the conductive interface. 
     
     
         13 . The heat-transfer assembly of  claim 11 , wherein the conduction line is clipped to the sealed refrigerant loop. 
     
     
         14 . The heat-transfer assembly of  claim 11 , wherein the conduction line extends from a first end proximal to the conductive interface to a second end proximal to the sealed refrigerant loop and above the first end. 
     
     
         15 . The heat-transfer assembly of  claim 14 , wherein the sealed refrigerant loop comprises an evaporator, and wherein the second end of the conduction line is proximal to the evaporator in conductive thermal communication therewith. 
     
     
         16 . The heat-transfer assembly of  claim 15 , further comprising a plurality of conductor wings extending horizontally between the conduction line and the evaporator. 
     
     
         17 . The heat-transfer assembly of  claim 16 , wherein the first end is horizontally offset from the second end. 
     
     
         18 . The heat-transfer assembly of  claim 17 , wherein the plurality of conductor wings horizontally bound a portion of the evaporator and restrain relative movement between the conduction line and the evaporator.