Deformed Mesh Thermal Ground Plane

Abstract

Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

1 . A passive thermal management device comprising:
 a first casing;   a second casing where outer peripheries of the second casing are hermetically sealed with outer peripheries of the first casing to form a housing;   a deformed mesh disposed between the first casing and the second casing, the deformed mesh comprising:
 a plurality of undeformed portions; and 
 a plurality of deformed portions that are compressed relative to the undeformed portions; and 
   a working fluid filled between the first casing and the second casing.   
     
     
         2 . The passive thermal management device according to  claim 1 , wherein the plurality of undeformed portions comprise a plurality of pillars. 
     
     
         3 . The passive thermal management device according to  claim 1 , wherein the plurality of undeformed portions form a plurality of ridges. 
     
     
         4 . The passive thermal management device according to  claim 1 , wherein some of the plurality of undeformed portions include one or more support pillars that extend from the undeformed portions. 
     
     
         5 . The passive thermal management device according to  claim 1 , wherein the plurality of deformed portions are formed from plastic deformation. 
     
     
         6 . The passive thermal management device according to  claim 1 , wherein the plurality of deformed portions are formed from inelastic deformation. 
     
     
         7 . The passive thermal management device according to  claim 1 , further comprising a permeable wick disposed between the first casing and the second casing. 
     
     
         8 . The passive thermal management device according to  claim 1 , wherein the deformed mesh comprises a woven mesh. 
     
     
         9 . The passive thermal management device according to  claim 1 , wherein the deformed mesh includes a plurality of channels. 
     
     
         10 . The passive thermal management device according to  claim 1 , wherein the deformed mesh comprises a mesh that is flattened prior to deformation. 
     
     
         11 . The passive thermal management device according to  claim 1 , wherein the deformed mesh is coated with microparticles or nanoparticles. 
     
     
         12 . The passive thermal management device according to  claim 1 , wherein the deformed mesh comprises compressed portions that form caps that prevent vapor from penetrating into liquid channels. 
     
     
         13 . The passive thermal management device according to  claim 1 , wherein plurality of the plurality of undeformed portions are arranged in a pattern of arteries with vapor channels. 
     
     
         14 . The passive thermal management device according to  claim 1 , wherein the deformed mesh comprises copper, steel, metallic polymer, metal coated polymer, ceramic coated polymer, ALD coated polymer, copper coated steel, or copper coated stainless steel. 
     
     
         15 . The passive thermal management device according to  claim 1 , wherein the deformed mesh comprises a plurality of mesh layers. 
     
     
         16 . The passive thermal management device according to  claim 14 , wherein different mesh layers of the plurality of mesh layers include different weave types, thread count, wire diameter, and/or mesh material. 
     
     
         17 . A passive thermal management device comprising:
 a first casing;   a second casing where outer peripheries of the second casing are hermetically sealed with outer peripheries of the first casing to form a Housing;   a mesh disposed between the first casing and the second casing, the mesh comprising an array of compressed portions distributed throughout the mesh such that the compressed portions are compressed and thinner relative to other areas of the mesh; and   a working fluid filled between the first casing and the second casing.   
     
     
         18 . A passive thermal management device comprising:
 a first casing;   a second casing where outer peripheries of the second casing are hermetically sealed with outer peripheries of the first casing to form a sealed housing;   a mesh layer disposed within the sealed housing, the mesh layer comprising a plurality of woven fibers that has been flattened and then deformed to include to include a pattern having a plurality of pillars; and   a working fluid filled within the housing.