Deformed Mesh Thermal Ground Plane

Abstract

Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

1 . A thermal ground plane, including:
 a first casing layer;   a second casing layer where outer peripheries of the second casing layer are hermetically sealed with outer peripheries of the first casing layer to form a TGP housing case;   a deformed mesh disposed between the first casing layer and the second casing layer, the deformed mesh comprising:
 a plurality of undeformed portions; and 
 a plurality of deformed portions that are compressed relative to the undeformed portions; and 
   a working fluid filled between the first casing layer and the second casing layer.   
     
     
         2 . The thermal ground plane according to  claim 1 , wherein the plurality of undeformed portions comprise a plurality of pillars. 
     
     
         3 . The thermal ground plane according to  claim 1 , wherein the plurality of undeformed portions form a plurality of ridges. 
     
     
         4 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises a porous mesh. 
     
     
         5 . The thermal ground plane according to  claim 1 , wherein the plurality of deformed portions are formed from plastic deformation. 
     
     
         6 . The thermal ground plane according to  claim 1 , wherein the plurality of deformed portions are formed from inelastic deformation. 
     
     
         7 . The thermal ground plane according to  claim 1 , further comprising a permeable wick disposed between the first casing layer and the second casing layer. 
     
     
         8 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises a woven mesh. 
     
     
         9 . The thermal ground plane according to  claim 1 , wherein the deformed mesh includes a plurality of channels. 
     
     
         10 . The thermal ground plane according to  claim 1 , wherein plurality of deformed portions have a height less than about 0.2 mm. 
     
     
         11 . The thermal ground plane according to  claim 1 , wherein plurality of deformed portions have a height less than about 0.2 mm. 
     
     
         12 . The thermal ground plane according to  claim 1 , wherein plurality of deformed portions have a height less than about 0.2 mm. 
     
     
         13 . The thermal ground plane according to  claim 1 , wherein plurality of deformed portions have a width less than about 2 mm. 
     
     
         14 . The thermal ground plane according to  claim 1 , wherein plurality of deformed portions have a center-to-center pitch less than about 0.2 mm. 
     
     
         15 . The thermal ground plane according to  claim 1 , wherein plurality of the plurality of deformed portions are arranged in a pattern. 
     
     
         16 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises a metallic polymer, metal coated polymer, ceramic coated polymer, ALD coated polymer, copper coated steel, or copper coated stainless steel. 
     
     
         17 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises a plurality of mesh layers. 
     
     
         18 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises at least two different mesh layers. 
     
     
         19 . The thermal ground plane according to  claim 1 , wherein the deformed mesh comprises copper, steel, copper-coated steel, copper-coated polymer, ceramic coated polymer, or ceramic coated metal.