Heat transfer device and a manufacturing method thereof

Abstract

This disclosure is directed to a heat transfer device and a manufacturing method thereof. The method has steps of: providing a metal powder, firstly sintering the metal powder to form a plurality of sintered balls that each sintered ball has a plurality of first pores; provide a thermally conductive housing, the sintered balls are secondly sintered to form a capillary structure combined with the thermally conductive housing, wherein at least a part of an internal wall of the thermally conductive shell is cover with the sintered balls, a plurality of second pores are defined between the sintered balls, and each first pore is smaller than each second pore; filling a working fluid into the thermally conductive housing; and sealing the thermally conductive housing to define a sealed chamber in the thermally conductive housing, so that the capillary structure and the working fluid are contained in the sealed chamber.

What is claimed is: 
     
         1 . A heat transfer device, comprising:
 a thermal conductive shell, comprising a closed chamber;   a capillary structure, arranged in the closed chamber, the capillary structure comprising a plurality of sintered balls, the thermal conductive shell comprising an interna surface comprising at least one portion covered with the sintered balls, each of the sintered balls being made of a metal powder by sintering, each of the sintered balls comprising a plurality of first pores therein, a plurality of second pores defined between the sintered balls, wherein each of the first pores is smaller than each of the second pores; and   a working fluid, accommodated in the closed chamber.   
     
     
         2 . The heat transfer device according to  claim 1 , wherein each of the sintered balls is made of a copper powder or an aluminum powder by sintering. 
     
     
         3 . The heat transfer device according to  claim 1 , wherein the thermal conductive shell is made of copper or aluminum. 
     
     
         4 . The heat transfer device according to  claim 1 , wherein the thermal conductive shell is tubular. 
     
     
         5 . The heat transfer device according to  claim 4 , wherein the capillary structure is extended along a longitudinal direction of the thermal conductive shell. 
     
     
         6 . The heat transfer device according to  claim 1 , wherein the thermal conductive sell is of a hollow plate shape. 
     
     
         7 . The heat transfer device according to  claim 6 , wherein the capillary structure is disposed in the closed chamber corresponding to one side of the thermal conductive shell. 
     
     
         8 . A manufacturing method of a heat transfer device, comprising:
 a) providing a metal powder and firstly sintering the metal powder into a plurality of sintered balls, wherein each of the sintered balls comprises a plurality of first pores;   b) providing a thermal conductive shell and secondary sintering the sintered balls into a capillary structure, wherein the capillary structure is combined with the thermal conductive shell, the thermal conductive shell comprises an internal surface comprising at least one portion covered with the sintered balls, and each of the first pores is smaller than each of the second pores;   c) filling a working fluid into the thermal conductive shell; and   d) sealing the thermal conductive shell to define a closed chamber in the thermal conductive shell, so that the capillary structure and the working fluid are disposed in the closed chamber.   
     
     
         9 . The manufacturing method according to  claim 8 , wherein the metal powder is a copper powder or an aluminum powder. 
     
     
         10 . The manufacturing method according to  claim 8 , wherein the thermal conductive shell is made of copper or aluminum. 
     
     
         11 . The manufacturing method according to  claim 8 , wherein the thermal conductive shell is tubular, and the capillary structure is extended along a longitudinal direction of the thermal conductive shell in the step b). 
     
     
         12 . The manufacturing method according to  claim 8 , wherein the thermal conductive shell is of a hollow plate shape, the capillary structure is disposed in the closed chamber corresponding to one side of the thermal conductive shell in the step b).