Member for semiconductor manufacturing apparatus

Abstract

A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface and a built-in electrode; a base plate provided on a lower surface of the ceramic plate; a base plate through-hole that penetrates the base plate in an up-down direction; an insulating tube inserted into the base plate through-hole; an adhesive agent pool provided in at least one of an inner circumferential surface of the base plate through-hole or an outer circumferential surface of the insulating tube, and disposed at a position down away from an upper surface of the insulating tube; and an adhesive layer including an insulating tube outer circumferential surface adhesion part formed from the lower surface of the ceramic plate to an intermediate point of the adhesive agent pool.

What is claimed is: 
     
         1 . A member for semiconductor manufacturing apparatus, comprising:
 a ceramic plate having a wafer placement surface on its upper surface and a built-in electrode;   a base plate provided on a lower surface of the ceramic plate;   a base plate through-hole that penetrates the base plate in an up-down direction;   an insulating tube inserted into the base plate through-hole;   an adhesive agent pool provided in at least one of an inner circumferential surface of the base plate through-hole or an outer circumferential surface of the insulating tube, and disposed at a position down away from an upper surface of the insulating tube; and   an adhesive layer including an insulating tube outer circumferential surface adhesion part formed from the lower surface of the ceramic plate to an intermediate point of the adhesive agent pool, and configured to bond the inner circumferential surface of the base plate through-hole and the outer circumferential surface of the insulating tube together.   
     
     
         2 . The member for semiconductor manufacturing apparatus according to  claim 1 ,
 wherein the adhesive layer includes an insulating tube upper surface adhesion part continuous to the insulating tube outer circumferential surface adhesion part, and configured to bond the lower surface of the ceramic plate and the upper surface of the insulating tube together.   
     
     
         3 . The member for semiconductor manufacturing apparatus according to  claim 1 ,
 wherein when a position in an up-down direction of an upper end of the adhesive agent pool is viewed along an outer circumference of the insulating tube, the position in the up-down direction of the upper end of the adhesive agent pool varies stepwise or continuously.   
     
     
         4 . The member for semiconductor manufacturing apparatus according to  claim 3 ,
 wherein the base plate includes built-in refrigerant flow paths, and   the base plate through-hole is provided between adjacent ones of the refrigerant flow paths, and one of the adjacent refrigerant flow paths has a higher ceiling surface than the other.   
     
     
         5 . The member for semiconductor manufacturing apparatus according to  claim 1 ,
 wherein the base plate through-hole is part of a power supply member insertion hole into which a power supply member to provide electric power to the electrode is inserted, the power supply member being provided downward from the electrode in the member for semiconductor manufacturing apparatus, or part of a lift pin hole that penetrates the member for semiconductor manufacturing apparatus in an up-down direction, and into which a lift pin is inserted, or part of a gas hole that penetrates the member for semiconductor manufacturing apparatus in an up-down direction to supply gas to the wafer placement surface.