Resin composition and curable resin composition using the same

Abstract

A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.

1 . A resin composition comprising:
 (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:   
       
         
           
           
               
               
           
         
       
       and a molecular weight of 230˜1000; and
 (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m 2 /g˜250 m 2 /g. 
 
     
     
         2 . The resin composition according to  claim 1 , wherein the content of (B) fumed silica is 0.01˜0.3 part by mass per 1 part by mass of the resin composition. 
     
     
         3 . The resin composition according to  claim 1 , wherein a gelation time of the resin composition (GT), which is a time from mixing of 0.01˜0.1 part by mass of N,N-dimethylbenzylamine with 1 part by mass of the resin composition at 25° C. until the resin composition loses fluidity, is 1 minute˜60 minutes. 
     
     
         4 . The resin composition according to  claim 3 , wherein a ratio of the gelation time of the resin composition (GT) relative to a gelation time of the (A) 2-methylene-1,3-dicarbonyl compound (GT A ), which is a time from mixing of 0.01˜0.1 part by mass of N,N-dimethylbenzylamine with 1 part by mass of the (A) 2-methylene-1,3-dicarbonyl compound contained in the resin composition at 25° C. until the (A) 2-methylene-1,3-dicarbonyl compound loses fluidity, wherein a ratio of a mass of N,N-dimethylbenzylamine relative to a mass of the resin composition in the measurement of the GT is equal to a ratio of a mass of N,N-dimethylbenzylamine relative to a mass of the (A) 2-methylene-1,3-dicarbonyl compound in the measurement of the GT A , is 1.1˜3. 
     
     
         5 . The resin composition according to  claim 1 , wherein the viscosity of the resin composition measured using an E-type viscometer at 1 rpm is 100˜100,000 mPa·s. 
     
     
         6 . The resin composition according to  claim 1 , wherein the resin composition is curable by an action of a basic compound as a curing agent or curing catalyst. 
     
     
         7 . The resin composition according to  claim 1 , further comprising a polymer compound. 
     
     
         8 . The resin composition according to  claim 1 , wherein the resin composition contains substantially no Lewis acidic compound capable of coordinating to the carbonyl oxygen of the (A) 2-methylene-1,3-dicarbonyl compound. 
     
     
         9 . The resin composition according to  claim 1 , wherein the resin composition is substantially inert to water in the atmosphere. 
     
     
         10 . A one-part curable resin composition comprising the resin composition of  claim 1  and a latentized basic compound or photobase generator. 
     
     
         11 . A kit of a two-part mixing curable resin composition, which comprises:
 (A) the resin composition of  claim 1 ; and   (B) a curing agent or a curing catalyst containing a basic compound.   
     
     
         12 . The resin composition according to  claim 1 , wherein the resin composition is usable for manufacture of electronic components. 
     
     
         13 . A cured product formed by curing the resin composition of  claim 1 . 
     
     
         14 . An electronic component comprising the cured product of  claim 13 . 
     
     
         15 . The one-part curable resin composition according to  claim 10 , wherein the one-part curable resin composition is usable for manufacture of electronic components. 
     
     
         16 . The kit according to  claim 11 , wherein the kit is usable for manufacture of electronic components. 
     
     
         17 . A cured product formed by curing the one-part curable resin composition of  claim 10 . 
     
     
         18 . A cured product formed by curing the kit of  claim 11 . 
     
     
         19 . An electronic component comprising the cured product of  claim 16 . 
     
     
         20 . An electronic component comprising the cured product of  claim 17 .