US2025196287A1PendingUtilityA1
Polishing systems and methods
Est. expiryDec 14, 2043(~17.4 yrs left)· nominal 20-yr term from priority
B24B 7/228B24B 53/017B24B 41/061B24B 37/30
70
PatentIndex Score
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Claims
Abstract
A frictional displacement resistant conformal dop assembly is provided. A dop head of the dop can include a ball joint including a hemispherical portion received within a housing, the hemispherical portion having a center of rotation proximal to the surface, such that frictional forces applied perpendicular to a movement of the dop head are not associated with reduced conformity of the dop head to a surface interfacing therewith.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A system including:
a rotatable member comprising a first surface configured to couple with a workpiece, the rotatable member:
configured for receipt within a housing;
configured to rotate about an axis parallel to a lateral plane of the first surface; and
having a center of rotation for the axis parallel to the lateral plane which is less than one half of a radius of a substantially hemispherical portion of the rotatable member from the first surface.
2 . The system of claim 1 , wherein the system further comprises:
a linear actuator configured to apply a clamping force between the workpiece and a polishing wheel during the rotation of the rotatable member about an axis perpendicular to the lateral plane; and a connection rod coupled with the linear actuator at a first end and the workpiece at a second end.
3 . The system of claim 2 , wherein the coupling between the second end of the connection rod and the workpiece comprises:
a non-rotatable coupling between the second end of the connection rod and a housing for the rotatable member; and a gimbaled coupling between the rotatable member and the housing.
4 . The system of claim 3 , wherein the housing comprises a single integral portion radially surrounding a portion of the rotatable member.
5 . The system of claim 3 , wherein:
the rotatable member comprises:
the substantially hemispherical portion having a first radial dimension; and
a coupler portion having a second dimension less than the first radial dimension; and
the housing comprises:
a first portion comprising a sidewall defining a central cavity, the first portion configured to receive the substantially hemispherical portion into a corresponding hemispherical sidewall portion; and
a second portion configured to couple the second end of the connection rod with the first portion of the housing, and having a lower surface that, when assembled with the first portion of the housing, defines a headspace above the coupler portion of the rotatable member.
6 . The system of claim 1 , wherein the substantially hemispherical portion is sub-hemispherical by an amount equal to a thickness of the workpiece and is configured to couple with a plurality of additional workpieces.
7 . The system of claim 1 , further comprising:
a redresser comprising a second surface comprising a plurality of protrusions configured to resurface a polishing wheel, the second surface laterally extending a greater dimension than the first surface and configured for receipt with the housing.
8 . The system of claim 1 , further comprising:
an environmental enclosure enclosing the rotatable member and the housing, the environmental enclosure configured to maintain positive pressure relative to an external environment.
9 . A polishing apparatus comprising:
a rotatable member comprising a first surface configured to couple with a workpiece, the rotatable member:
configured for receipt within a housing;
configured to rotate about an axis parallel to a lateral plane of the first surface; and
having a center of rotation for the axis parallel to the lateral plane which is less than one half of a radius of a substantially hemispherical portion of the rotatable member from the first surface;
the housing; a polishing arm configured to translate the rotatable member along the lateral plane; and a motor configured to rotate the rotatable member about an axis perpendicular to the lateral plane.
10 . The polishing apparatus of claim 9 , further comprising:
a pneumatic cylinder configured to apply a clamping force between the polishing arm and a connection rod coupled with: the pneumatic cylinder at a first end via a thrust bearing; and the housing at a second end.
11 . The polishing apparatus of claim 10 , wherein the connection rod is coupled with the motor via a chain drive.
12 . The polishing apparatus of claim 9 , wherein the rotatable member comprises:
a retaining plate couplable with a second surface of the rotatable member, opposite from the first surface, the retaining plate configured to retain the rotatable member within a central cavity of the housing.
13 . The polishing apparatus of claim 9 , wherein the housing comprises a single integral portion radially surrounding a portion of the rotatable member.
14 . A method of polishing diamond workpieces, the method comprising:
coupling a workpiece with a first surface of a rotatable member; receiving the rotatable member within a housing non-rotatably coupled with a connection rod, the rotatable member configured to rotate about an axis parallel to a lateral plane of the first surface and having a center of rotation for the axis parallel to the lateral plane which is less than one half of a radius of a substantially hemispherical portion of the rotatable member from the first surface; and applying a clamping force between the connection rod and a polishing wheel simultaneously to rotating the connection rod about the axis of the application of the clamping force.
15 . The method of claim 14 , wherein the clamping force is transmitted via a thrust bearing along the axis.
16 . The method of claim 14 , wherein multiple workpieces are coupled with the first surface.
17 . The method of claim 14 , further comprising:
removing the rotatable member from the housing; installing a redresser in the housing; and applying the clamping force to redress the polishing wheel.
18 . The method of claim 14 , wherein coupling the workpiece with the first surface comprises:
forming an adhesive coating over a substrate; pressing the workpiece into the adhesive coating; forming a further adhesive over the workpiece; coupling the workpiece to the first surface using the further adhesive; and removing the substrate from the workpiece.
19 . The method of claim 14 , wherein coupling the workpiece with the first surface comprises:
forming an adhesive coating over a substrate; laterally surrounding the substrate with a mold ring; pressing the workpiece into the adhesive coating; forming an epoxy layer over the workpiece; coupling the workpiece to the first surface using the epoxy layer; and removing the substrate from the workpiece.
20 . The method of claim 14 , wherein coupling the workpiece with the first surface comprises:
affixing the workpiece to a vacuum chuck using a vacuum pump; coupling the workpiece to the first surface; and disengaging the vacuum pump to removing the workpiece from the vacuum chuck.Join the waitlist — get patent alerts
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