Eco-friendly adhesive formulation containing 2-methyl tetrahydrofuran

Abstract

The present invention relates to an adhesive formulation preferably based on polychloroprene, comprising a preferably bio-based solvent or solvent mixture with a long open time together with a high solution viscosity.

1 . A composition comprising
 polychloroprene; and   a first organic solvent, which is 2-methyl tetrahydrofuran.   
     
     
         2 . The composition according to  claim 1 , which additionally comprises a second organic solvent, which is ethyl acetate. 
     
     
         3 . The composition according to  claim 1 , wherein the first organic solvent, which is 2-methyl tetrahydrofuran, is produced or obtained from waste of corn production. 
     
     
         4 . The composition according to  claim 1 , which exhibits
 a viscosity of >7000 mPas at a temperature of 23° C., and/or   an open time of >3.5 h.   
     
     
         5 . The composition according to  claim 1 , which is or comprises a solvent borne contact adhesive composition comprising polychloroprene and a solvent component comprising a first organic solvent, which is 2-methyl tetrahydrofuran, in an amount of 5 to 100 wt.-%, based on the total weight of the solvent component. 
     
     
         6 . A process for producing a composition according to  claim 1 , which comprises the following steps:
 (a) providing polychloroprene;   (b) providing at least a portion of 2-methyl tetrahydrofuran
 in bio-based form, and/or 
 from non-fossil sources, and/or 
 from waste of corn production; 
   (d) mixing the components according to steps (a) and (b).   
     
     
         7 . The process according to  claim 6 , comprising the following steps:
 (c) providing at least a portion of ethyl acetate
 in bio-based form, and/or 
 from non-fossil sources; and 
   (d′) mixing the components according to steps (a), (b) and (c).   
     
     
         8 . An adhesive and/or sealant comprising the composition according to  claim 1 . 
     
     
         9 . The adhesive and/or sealant according to  claim 8 , wherein the composition is configured for bonding substrates of identical or different types and which contain wood, paper, plastics, textiles, leather, rubber, and/or inorganic materials. 
     
     
         10 . A process for producing bonded substrates, which comprises the following steps:
 providing a first substrate;   applying a composition according to  claim 1  to a surface of the first substrate to obtain a coated first substrate;   providing a second substrate;   bonding the coated first substrate to the second substrate.   
     
     
         11 . A substrate bonded with the composition according to  claim 1 .