Thermoelectric conversion module and production method for same

Abstract

Provided are a thinner thermoelectric conversion module in which a thermistor for temperature detection is embedded inside a substrate included in the thermoelectric conversion module, and a method for manufacturing the thermoelectric conversion module. The thermoelectric conversion module includes a first substrate having a first principal surface and a second principal surface opposite to the first principal surface, a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface, a first electrode provided on the second principal surface, a second electrode provided on the third principal surface, a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface, and a thermistor for temperature detection embedded inside the first substrate and/or the second substrate, and current-carrying electrodes that energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface.

1 . A thermoelectric conversion module comprising:
 a first substrate having a first principal surface and a second principal surface opposite to the first principal surface;   a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface;   a first electrode provided on the second principal surface;   a second electrode provided on the third principal surface;   a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface; and   a thermistor for temperature detection, the thermistor being embedded inside the first substrate and/or the second substrate, wherein   current-carrying electrodes configured to energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface.   
     
     
         2 . The thermoelectric conversion module according to  claim 1 , further comprising:
 a first heat dissipation layer on the first principal surface of the first substrate; and   a second heat dissipation layer on the fourth principal surface of the second substrate.   
     
     
         3 . The thermoelectric conversion module according to  claim 1 , wherein
 the current-carrying electrodes are located on the first principal surface of the first substrate or the fourth principal surface of the second substrate, and are provided as a pair of electrodes spaced apart from each other.   
     
     
         4 . The thermoelectric conversion module according to  claim 1 , wherein
 the thermistor and the current-carrying electrodes are connected along a thickness direction of the first substrate or the second substrate.   
     
     
         5 . The thermoelectric conversion module according to  claim 1 , wherein
 the first substrate and the second substrate are made of insulating materials.   
     
     
         6 . A method for manufacturing a thermoelectric conversion module,
 the thermoelectric conversion module including a first substrate having a first principal surface and a second principal surface opposite to the first principal surface,   a second substrate having a third principal surface facing the second principal surface and a fourth principal surface opposite to the third principal surface,   a first electrode provided on the second principal surface,   a second electrode provided on the third principal surface,   a P-type thermoelectric element layer and an N-type thermoelectric element layer sandwiched between the first electrode and the second electrode and arrayed along the second principal surface and the third principal surface, and   a thermistor for temperature detection, the thermistor being embedded inside the first substrate and/or the second substrate, wherein   current-carrying electrodes configured to energize the thermistor are located on at least one of the first principal surface, the second principal surface, the third principal surface, or the fourth principal surface, the method comprising:   (M) electrically connecting the second electrode to the P-type thermoelectric element layer and the N-type thermoelectric element layer on the first electrode provided on the second principal surface of the first substrate using the second substrate including the second electrode provided on the third principal surface; or   (N) electrically connecting the first electrode to the P-type thermoelectric element layer and the N-type thermoelectric element layer on the second electrode provided on the third principal surface of the second substrate using the first substrate including the first electrode provided on the second principal surface.   
     
     
         7 . The method for manufacturing a thermoelectric conversion module according to  claim 6 , wherein
 (M) or (N) includes the following (S-1) to (S-3):   (S-1): providing a through-hole in the first substrate and/or the second substrate   (S-2): embedding the thermistor in the through-hole   (S-3): providing the current-carrying electrodes to which the thermistor is to be connected on the first substrate and/or the second substrate.