Substrate polishing module, substrate polishing device, and substrate polishing method using the same

Abstract

A substrate polishing module according to at least one embodiment includes a pair of ring-shaped platens disposed along the circumference of the substrate, respectively on the upper and lower portions of the substrate, a polishing pad disposed on each platen of the pair of platens and in contact with the upper and lower surfaces of the substrate to polish a bevel of the substrate, and a driver that rotates each of the platens.

What is claimed is: 
     
         1 . A substrate polishing module, comprising:
 a pair of ring-shaped platens configured to be, respectively, disposed along a circumference of an upper portion and a lower portion of a substrate;   a polishing pad on each platen of the pair of platens such that the polishing pad is configured to be in contact with a corresponding one of an upper and lower surface of the substrate and to polish a bevel of the substrate; and   at least one driver configured to rotate the pair of platens.   
     
     
         2 . The substrate polishing module of  claim 1 , wherein the polishing pad comprises
 a plurality of roll pad supports in each of the pair platens, the plurality of roll pad supports configured to rotate on an axis parallel to the upper or lower surfaces of the substrate; and   a plurality of roll pads surrounding each of the roll pad supports and partially protruding from at least one of an upper surface or a lower surface of each of the pair of platens.   
     
     
         3 . The substrate polishing module of  claim 2 , wherein the roll pad comprises
 a polishing portion configured to contact the substrate and to polish the substrate; and   an adhesive portion between the roll pad support and the polishing portion adhering the roll pad support and the polishing portion.   
     
     
         4 . The substrate polishing module of  claim 1 , further comprising
 a conditioning portion configured to condition the polishing pad.   
     
     
         5 . The substrate polishing module of  claim 4 , wherein the conditioning portion comprises
 a conditioning body configured to be disposed on at least one of an outer upper portion or an outer lower portion of each of the pair of platens disposed on the upper and lower portions of the substrate;   a conditioning pad fixed to the conditioning body and configured to contact the polishing pad while the conditioning body is disposed on the at least one of the outer upper portion or the outer lower portion of each of the pair of platens; and   a body support supporting the conditioning body.   
     
     
         6 . The substrate polishing module of  claim 5 , wherein the conditioning body has a ring shape. 
     
     
         7 . The substrate polishing module of  claim 6 , wherein a plurality of conditioning pads are fixed along the conditioning body. 
     
     
         8 . The substrate polishing module of  claim 1 , wherein the polishing pad is attached to a surface such that each of the pair of platens faces the substrate along the ring shape of each of the pair of platens. 
     
     
         9 . The substrate polishing module of  claim 8 , wherein the polishing pad comprises
 a polishing portion configured to contact the substrate and to polish the substrate; and   an adhesive portion adhering the polishing portion to each of the pair of platens.   
     
     
         10 . The substrate polishing module of  claim 9 , wherein the polishing portion comprises an abrasive. 
     
     
         11 . The substrate polishing module of  claim 9 , wherein the polishing portion is formed of polyurethane without an abrasive. 
     
     
         12 . The substrate polishing module of  claim 11 , further comprising
 a slurry portion configured to supply a slurry toward the substrate.   
     
     
         13 . The substrate polishing module of  claim 1 , wherein the polishing pad comprises
 a plurality of tape supports built into each of the pair of platens, the plurality of tape supports configured to rotate on an axis parallel to the upper or lower surfaces of the substrate; and   a plurality of tape portions surrounding each of the tape supports and partially protruding from at least one of an upper surface or a lower surface of each of the pair of platens.   
     
     
         14 . The substrate polishing module of  claim 13 , wherein the polishing pad further comprises
 a plurality of recovery platens each in parallel with a corresponding tape support of the plurality of tape supports and configure such that each of the pair of recovery platens comprises a recovery portion configured to recover a tape portion released from the corresponding tape support by rotation of the corresponding tape support.   
     
     
         15 . A substrate polishing device, comprising:
 a chuck plate configured to seat a substrate;   a chuck shaft configured to support and rotate the chuck plate; and   a substrate polishing module configured to be disposed on upper and lower portions of the substrate and to polish a bevel of the substrate,   wherein the substrate polishing module comprises
 a pair of ring-shaped platens configured to be disposed along a circumference the upper and lower portions of the substrate, 
 a polishing pad on each of the pair of platens such that the polishing pad is configured to be in contact with a corresponding one of an upper or lower surface of the substrate and to polish the bevel of the substrate, and 
 at least one driver configured to rotate each of the pair of platens. 
   
     
     
         16 . The substrate polishing device of  claim 15 , wherein the substrate polishing module further comprises
 a conditioning portion configured to condition the polishing pad.   
     
     
         17 . The substrate polishing device of  claim 15 , further comprising
 a slurry portion configured to supply a slurry toward the substrate.   
     
     
         18 . A substrate polishing method, comprising:
 seating a substrate on a chuck plate;   disposing a pair of ring-shaped platens along a circumference of the substrate such that the pair of platens are respectively on an upper or lower portion of the substrate, and such that polishing pads disposed on each of the pair of platens contacts the substrate; and   rotating each of the pair of platens and the chuck plate such that a bevel of the substrate is polished.   
     
     
         19 . The substrate polishing method of  claim 18 , further comprising:
 conditioning each of the pair of platens using conditioning pads disposed on outer upper and lower portions of each of the pair.   
     
     
         20 . The substrate polishing method of  claim 18 , further comprising
 supplying a slurry from a slurry portion to the substrate.